Cleaning method for removing plasma on surface of array type laminated semiconductor packaging lead frame
A technology for plasma cleaning machines and packaging leads, applied in cleaning methods and utensils, semiconductor/solid-state device manufacturing, chemical instruments and methods, etc., can solve problems such as prolonged processing time, discoloration, and board burning, and improve reliability and efficiency. Effect
Pending Publication Date: 2022-03-18
KUNSHAN PLAUX ELECTRONICS TECH CO LTD
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Problems solved by technology
[0006] There is another problem with the continuous wave plasma cleaning process commonly used in the industry. To remove the organic matter inside the lead frame, the processing time needs to be extended, which will cause the periphery of the lead frame to be continuously bombarded by plasma and accumulate a large amount of energy, causing the lead frame to be close to the material. Part of the box (carrier) is discolored, or even burned; at the same time, the uniformity (the average degree of the water drop angle test is less than 30°) and the processing efficiency are not good
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[0024] In order to make the technical means, creative features, goals and effects achieved by the present invention easy to understand, the present invention will be further described below in conjunction with specific embodiments.
[0025] See figure 2 , 3 , 4, discloses a cleaning method for removing plasma from the surface of an arrayed, stacked semiconductor packaging lead frame, said method comprising:
[0026] Step 1. Put the material box (carrier) containing the lead frame of the multi-layer semiconductor package on the specially designed electrode bracket in the reaction chamber of the plasma cleaning machine, and close the reaction chamber of the plasma cleaning machine;
[0027] Step 2. Turn on the vacuum pump to allow the air pressure in the reaction chamber to reach a certain degree of vacuum;
[0028] Step 3. Turn on the flow meter and feed a certain amount of process gas until the vacuum degree maintains a dynamic balance.
[0029] Step 4. Turn on the pulse p...
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The invention discloses a cleaning method for removing plasma on the surface of an array type laminated semiconductor packaging lead frame, which comprises the following steps of: placing a carrier provided with the laminated semiconductor packaging lead frame on an electrode bracket in a reaction chamber of a plasma cleaning machine, and closing the reaction chamber of the plasma cleaning machine; starting a vacuum pump to enable the air pressure in the reaction cavity to reach a preset vacuum degree; starting a flow meter, and introducing process gas until the vacuum degree keeps dynamic balance; the pulse plasma generator is started, relevant parameters of the pulse plasma generator are adjusted, the electrodes in the reaction cavity are triggered to discharge, the formed pulse plasma and the organic matter on the surface of each layer of semiconductor packaging lead frame are subjected to chemical reaction, volatile matter is formed, and therefore the purpose of removing the organic matter is achieved.
Description
technical field [0001] The invention relates to a cleaning method for removing plasma from the surface of an arrayed, laminated semiconductor packaging lead frame, and belongs to the technical field of semiconductor packaging lead frames. Background technique [0002] Lead frames in the semiconductor packaging industry are divided into Flip chip series, SOP series, TO series, SOT series, etc. according to the packaging form; according to the substrate, they are divided into PCB, FPC, ceramic base, metal, polymer, etc., especially the metal represented by copper The lead frame is developing in the direction of thinner substrate thickness, finer lead pitch and multi-pin. As the chip carrier of integrated circuits, the lead frame is a key structural part that realizes the electrical connection between the lead-out end of the chip's internal circuit and the outer lead by means of bonding materials (gold wire, aluminum wire, copper wire) to form an electrical circuit. It serves ...
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Login to View More IPC IPC(8): H01L21/02B08B7/00
CPCH01L21/02041B08B7/00
Inventor 郭峰王宇
Owner KUNSHAN PLAUX ELECTRONICS TECH CO LTD