Micro-needle array chip, percutaneous administration device, percutaneous administration patch and preparation method thereof

A microneedle array and chip technology, applied in the directions of microneedles, needles, and drug devices, can solve the problems of blockage of needle orifices, and the aspect ratio and firmness of solid microneedle structures need to be improved. Conducive to diffusion and absorption, safe and reliable use

Inactive Publication Date: 2009-08-19
TSINGHUA UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0015] In the above-mentioned documents, solid or hollow microneedle arrays of various shapes and substrates perpendicular to it are all formed on a piece of metal. The preparation methods include the following: 1) cutting the metal plate by chemical etching or laser cutting and Form various planar microneedle patterns on it, and then use methods such as stamping to lift these planar microneedles and finally be perpendicular to the metal plate. This method is only applicable to the manufacture of solid microneedle array chips; 2) for metal plates The surface is subjected to selective electrolysis or electrochemical corrosion to form raised microneedles. The solid microneedle structure prepared by this method needs to be improved in terms of aspect ratio and firmness; 3) methods such as electroplating and plastic casting Combined to make hollow metal microneedles, the needles of these microneedles are similar to the mouth of ordinary daily-use bottles, and if they can penetrate the skin, it is easy to cause blockage of the needle mouth channel

Method used

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  • Micro-needle array chip, percutaneous administration device, percutaneous administration patch and preparation method thereof
  • Micro-needle array chip, percutaneous administration device, percutaneous administration patch and preparation method thereof
  • Micro-needle array chip, percutaneous administration device, percutaneous administration patch and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0091] Microneedle array chip and its preparation method

[0092] The microneedle array chip includes a microneedle and a substrate 4. The microneedle is composed of a needle head 1, a needle bar 2 and a needle seat 3. The top of the needle head is a needle point 5. The microneedle is fixed on the substrate 4 through the needle seat 3. The needle bar 2 and the needle seat 3 is a cylinder or a cone, and the microneedles are vertically fixed on the substrate 4, such as figure 1 and figure 2 As shown, the needle head 1 is conical; or the microneedle is fixed on the substrate 4 at an inclined setting angle, and the setting angle is preferably 15 to 90 degrees, such as Figure 4 ~ Figure 7 As shown, the upper surface of the needle point 5 is an elliptical plane parallel to or inclined to set an acute angle with the substrate 4, so the needle point 5 is an elliptical needle point 5 or the elliptical needle point is further processed to make it have a sharper angle 5a , that is, t...

Embodiment 2

[0115] Fabrication of Solid or Hollow Stainless Steel Microneedle Array Chips

[0116] Insert a stainless steel wire rod or capillary tube with an outer diameter of 350 microns into each hole of the through-hole array mold, and then insert these wire rods or capillary tubes at a certain angle at the same time or penetrate the heat-softened polyacrylic resin with a thickness of 2mm. methacrylate substrate. After cooling in water, the wire rods or capillary tubes are cut off at a distance of 1-8 mm from the plate by a cutting machine, thereby forming a wire rod or capillary tube array chip. Use a grinding machine to grind one side of the substrate of the chip. If electrochemical polishing is required in the subsequent process, it must be ensured that all wire rods or capillaries are exposed on the surface of the substrate on this side; grind and polish the fracture of the stainless steel wire rod or capillary on the other side to the desired microneedle height. Finally, immers...

Embodiment 3

[0118] Fabrication of Solid or Hollow Stainless Steel Microneedle Array Chips

[0119] Insert a stainless steel wire rod or capillary tube with an outer diameter of 350 microns into each hole of the through-hole array mold, and then insert these stainless steel wire rods or capillary tubes at a certain angle at the same time or penetrate through the heat-softened polyester with a thickness of 2mm. Methyl methacrylate substrate. After cooling in water, the wire rods or capillary tubes are cut off at a distance of 1-8 mm from the substrate by a cutting machine, thereby forming a wire rod or capillary tube array chip. Use a grinding machine to grind the substrate side of the chip. If electrochemical corrosion or polishing is required in the subsequent process, it must be ensured that all wire rods or capillaries are exposed on the surface of the substrate on this side; the stainless steel wire rods or capillary fractures on the other side are ground. Polished to the required mic...

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Abstract

The invention relates to a micro-needle array chip, a transdermal delivery device, a transdermal delivery patch and a preparation method thereof, wherein a micro-needle is obliquely fixed on a substrate at a set angle, the upper surface of the needle is an elliptic plane parallel to the substrate or obliquely provided with an acute angle, the needle is further treated to have more edge angles, a metal wire bar or tube penetrates a non-metallic material substrate such as polymer and the like along a certain angle, and then a nick of the metal wire bar or tube on the substrate is grinded and polished; and photosensitive resist patterns are formed nearby the nick at one end by adopting photoetching and etching technology, then the metal wire bar or tube is subjected to chemical or electrochemical corrosion to form a needle point and the photosensitive resist is removed, the surface of the manufactured solid micro-needle array chip can be covered with drugs, and the manufactured solid micro-needle array chip can deliver liquid medicine or extract body fluid. The method avoids the skin plugging a transfusion hole, is easy to adjust and control the maximum penetrating depth of the micro-needle, and is suitable for percutaneous transportation of biological macromolecular drugs and cosmetics and skincare and new percutaneous preparation of the prior drugs.

Description

technical field [0001] The invention relates to the technical fields of medical and beauty equipment, biomedicine and microfabrication, in particular to a microneedle array chip, a transdermal drug delivery device, a transdermal drug delivery patch and a preparation method. Background technique [0002] The therapeutic effect of a drug not only depends on the drug itself, but the drug delivery system also has a very important impact on the efficacy of the drug. For biomacromolecular drugs such as peptides, proteins, DNA, and vaccines represented by insulin, due to the degradation of enzymes in the gastrointestinal tract and the first-pass effect of the liver, the bioavailability of oral administration is very low and the curative effect cannot be achieved. . Subcutaneous injection can easily and quickly inject large doses of drugs into the human body and can make up for the shortcomings of oral administration, but its limitations are pain, injury at the injection point, inj...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): A61M37/00A61M35/00A61F13/02
CPCA61M2037/0053A61M2037/0023
Inventor 岳瑞峰王燕
Owner TSINGHUA UNIV
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