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Novel integrated DC-DC module and manufacturing method thereof

A DC-DC, module technology, applied in the direction of transformer/inductor coil/winding/connection, electrical components, transformer/inductor components, etc., can solve the problem of weak battery life, large board area and applicability problems such as poor performance, to achieve the advantages of high integration and small size, and the effect of increased battery life

Pending Publication Date: 2022-03-22
东莞市三体微电子技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

On the PCB, the two devices are mounted separately and independently. The traditional integrated circuit design occupies a large area. In addition, the traditional integrated circuit has relatively weak battery life and poor applicability.

Method used

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  • Novel integrated DC-DC module and manufacturing method thereof
  • Novel integrated DC-DC module and manufacturing method thereof
  • Novel integrated DC-DC module and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] Embodiment 1: NR wire-wound power inductor + DC-DC conversion chip.

[0037] S1, according to Figure 4 The NR power inductor is designed with a 2.5*2.0*1.0mm nickel-zinc ferrite core. There are grooves at the bottom of the magnetic core electrode, and the metallization pattern on the electrode surface is designed according to the requirements of chip pins and winding welding requirements.

[0038] S2. Using the winding method, the wire is wound on the NR252010 magnetic core, and the lead wire is electrically connected to the magnetic core through side thermocompression welding;

[0039] S3, the semi-finished product obtained in S2 is coated with magnetic glue and cured to obtain the finished product of NR winding power inductor;

[0040] S4. Spray solder paste or implant BGA balls at the bottom pit of the NR winding power inductor corresponding to the metallization layer, then implant the DC-DC conversion chip into the bottom pit of the NR winding power inductor, and...

Embodiment 2

[0042] Embodiment 2: Laminated power inductor + DC-DC conversion chip.

[0043] S1, according to Image 6 with Figure 7 Design the internal electrode structure and external electrode structure of the 2.5*2.0*0.8mm laminated power inductor. The soft magnetic material is ferrite soft magnetic material.

[0044] S2. Carry out the production of the laminated power inductor according to the structural design of S1;

[0045] S3. Spray solder paste or implant BGA balls on the top surface of the stacked power inductor corresponding to the solder joint, and then paste the DC-DC conversion chip on the top surface of the stacked power inductor, and perform electrical connection through the reflow soldering process; or DC -The DC conversion chip is pasted on the top surface of the laminated power inductor, and then connected by bonding;

[0046] S4. Dispensing glue on the surface of the semi-finished chip obtained in S3 to protect the chip, and at the same time facilitate the absorpt...

Embodiment 3

[0047] Embodiment 3: Integral molding power inductor + DC-DC conversion chip.

[0048] S1, according to figure 1 Carry out 2.5*2.0*0.8mm for the production of integral molding inductors, and lead wires are drawn on the side of the product at 2.0*0.8mm.

[0049] S2. Carry out full insulation coating on the integrally formed power inductor product obtained in S1;

[0050] S3. Grind the 2.0*0.8mm side of the integrally formed power inductor to expose the leads; etch a pre-designed pattern on the other surface of the integrally formed power inductor by laser etching, such as figure 1 shown;

[0051] S4. Perform electroplating on the semi-finished product obtained in S3 to obtain the required external electrodes and electrical circuits.

[0052] S5. Spray solder paste or implant BGA balls on the top surface of the integrally formed power inductor obtained in S4, then paste the DC-DC conversion chip on the top surface of the laminated power inductor, and perform electrical connec...

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Abstract

The invention relates to the technical field of integrated circuit modules, in particular to a novel integrated DC-DC module and a manufacturing method thereof.The novel integrated DC-DC module comprises a power inductor, a DC-DC conversion chip and a plastic package material, and the DC-DC conversion chip is electrically connected to the top of the power inductor; and a layer of flat plastic package material is arranged on the DC-DC conversion chip and the power inductor assembly so as to protect the DC-DC conversion chip and facilitate material suction and feeding in the SMT process. According to the invention, through sealing integration of discrete devices, two-dimensional unfolding design of a traditional device on a PCB is changed into three-dimensional unfolding design, and the two-dimensional area of the PCB is reduced, so that the overall dimension of a whole machine product is basically unchanged or reduced under the trend that the functions of the whole machine product are gradually increased; meanwhile, more space is supplied to the battery, so that the cruising ability of the product is improved; the integrated module obtained by the invention can be widely applied to various electronic devices such as wearable devices, smart phones, medical devices and the like.

Description

technical field [0001] The invention relates to the technical field of integrated circuit modules, in particular to a novel integrated DC-DC module and a manufacturing method thereof. Background technique [0002] DC / DC converter is a voltage converter that changes the input voltage and effectively outputs a fixed voltage. DC-DC converters are widely used in mobile phones, MP3, digital cameras, portable media players and other products, and belong to chopping in terms of circuit type classification. circuit. [0003] In the design of traditional electronic integrated circuits, chips and inductors are designed separately. On the PCB board, the two devices are mounted separately and independently. The traditional integrated circuit design occupies a large area. In addition, the traditional integrated circuit has relatively weak battery life and poor applicability. [0004] In view of this, a novel integrated DC-DC module and its manufacturing method are proposed. Contents ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/64H01L23/522H01F27/29
CPCH01F27/292H01L23/645H01L23/5227
Inventor 廖财亮
Owner 东莞市三体微电子技术有限公司
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