Preparation process of gold finger gold plating and chemical gold copper-based circuit board

Abstract

The invention discloses a preparation process of a gold finger gold plating and chemical gold copper-based circuit board. Comprising a solution to the problem that a drilling tool is easy to wear / break, a solution to the technical difficulty of electroplating and hole plating of a copper substrate, a solution to the technical difficulty of solder mask printing of a thick copper plate, a solution to the technical difficulty of surface treatment nickel gold electroplating and chemical gold plating, and a solution to the technical difficulty of molding processing of a metal copper substrate. According to the invention, through the overall process design of the preparation of the gold finger gold plating and chemical gold copper-based circuit board, the cutter and parameter selection for processing the small hole of the copper substrate are optimized; a chemical copper deposition autocatalytic reaction is induced through activation of the palladium core, and after treatment in the step, a layer of chemical copper can be deposited on the surface or the hole wall of the metal copper substrate to be precisely combined with the surface and the hole wall of the metal copper substrate; through flow optimization, the solder resist printing quality of the thick copper plate is improved; as the integration level of the IC is higher and higher, the IC pins are more and denser; the laser has high applicability and sensitivity, and the influence range of cutting is reduced.

Description

technical field [0001] The invention belongs to the technical field of gold-finger gold-added gold-copper base circuit board preparation technology, and in particular relates to a preparation process of gold-finger gold-added gold-copper base circuit board. Background technique [0002] Copper substrate is the most expensive kind of metal substrate, and its thermal conductivity is many times better than that of aluminum substrate and iron substrate. It is suitable for high-frequency circuits and areas with large changes in high and low temperature, as well as heat dissipation of precision communication equipment and architectural decoration industries. The circuit board made of copper substrate has the advantages of good thermal conductivity, electrical insulation performance and mechanical processing performance. The substrate material is generally copper plate, which can provide better thermal conductivity, and its heat dissipation effect is also better than that of aluminu...

AI Technical Summary

Problems solved by technology

[0006] 1. Difficulty in pure copper small hole drilling technology: especially when the drilling tool diameter is less than 0.7mm, the lateral cutting force and axial force it can withstand are very limited, and the ability to shed chips is very weak, which is a challenge for drilling Very big;

[0007] 2. Small hole copper plating technology on metal substrate: it is prone to the problems of hole breakage, crack and pull-off;

[0009] 4. Difficulties in the surface treatment technology of electro-nickel gold plus chemical gold: two different surface treatments of gold plating and soft gold are performed on the same board at the same time. The two processes and procedures are different, which increases the difficulty of manufacturing and processing;

[0010] 5. Difficulties in forming and processing metal copper substrates: traditional thick copper plate shape processing generally uses mechanical drilling machines for forming processing, and there are some technical shortcomings;

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