Flexible film, preparation method thereof and sensor based on flexible film

A flexible film and sensor technology, which is applied in the process, instrument, and coupling of optical waveguides for producing decorative surface effects to achieve the effects of improving signal-to-noise ratio, improving sensitivity, and widening measurement range

Pending Publication Date: 2022-04-08
ZHONGBEI UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The invention aims to solve the technical problem of how to effectively improve the electrical performance of a flexible mechanical sensor, and provides a flexible film with a modified micro-cone array structure on the surface and a preparation method thereof, and a sensor prepared based on the flexible film

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  • Flexible film, preparation method thereof and sensor based on flexible film
  • Flexible film, preparation method thereof and sensor based on flexible film
  • Flexible film, preparation method thereof and sensor based on flexible film

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Embodiment Construction

[0019] The technical solutions of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Apparently, the described embodiments are part of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0020] In the description of the present invention, it should be noted that the terms "first" and "second" are used for description purposes only, and should not be understood as indicating or implying relative importance.

[0021] The invention provides a kind of preparation method of flexible film, comprises the following steps:

[0022] Step 1. Preparation of silicon wafer template: After the single-polished silicon wafer with an oxide layer on the surface is etched by photolithography, development, and buf...

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Abstract

The invention belongs to the technical field of flexible mechanical sensors and micro electro mechanical systems, particularly relates to a flexible thin film with a modified micro frustum array structure on the surface, a preparation method of the flexible thin film and a sensor prepared based on the flexible thin film, and solves the technical problems in the background technology. The front surface of the flexible film is provided with a plurality of micron-sized regular rectangular pyramid structures which are uniformly distributed, and the surfaces of the regular rectangular pyramid structures are provided with a plurality of random and closely arranged nano-sized bulge structures. The surface of the flexible film with the modified micro-frustum array structure has a micro-nano level structure, the specific surface area of the surface of the film can be effectively increased, and the three flexible mechanical sensors are high in sensitivity, high in weak pressure sensing capacity and wide in measurement range; the method disclosed by the invention is simple in operation step and low in implementation condition requirement, meets the requirements of production cost and the like, and can be used for preparing the flexible film in batches by utilizing the silicon wafer template.

Description

technical field [0001] The invention belongs to the field of flexible mechanical sensors and micro-electromechanical technology, and specifically relates to a flexible film with a modified micro-cone array structure on the surface, a preparation method thereof, and a sensor prepared based on the flexible film. Background technique [0002] With the development of sensing technology, in order to meet the development needs of the times, flexible mechanical sensors have been widely studied to sense physiological and mechanical parameters. At present, there are mainly four modes of flexible mechanical sensors: resistive, capacitive, piezoelectric and triboelectric. Except for the piezoelectric type, the other three modes can be formed in a multilayer thin film structure. The resistance type is to convert the mechanical change into the change of the resistance value for measurement, and the resistance value changes with the change of the external force. The capacitive type is t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01L1/14G01L1/20B81B7/02B81C1/00
Inventor 余俊斌丑修建何剑侯晓娟穆继亮耿文平崔浩然崔建峰
Owner ZHONGBEI UNIV
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