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Manufacturing method of glass-based MINI LED backlight substrate

A manufacturing method and glass-based technology, applied in semiconductor devices, electrical components, circuits, etc., can solve the problems of many process flows, low yield, and high equipment cost, and achieve the effects of simple process, reduced labor cost, and reduced cost waste.

Active Publication Date: 2022-04-15
东莞市友辉光电科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The object of the present invention is to provide a method for manufacturing a glass-based MINI LED backlight substrate, which is used to solve the problems of high equipment cost, many process flows and low yield in the existing process

Method used

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  • Manufacturing method of glass-based MINI LED backlight substrate
  • Manufacturing method of glass-based MINI LED backlight substrate

Examples

Experimental program
Comparison scheme
Effect test

no. 1 example

[0034] see figure 2 , a method for manufacturing a glass-based MINI LED backlight substrate, comprising the following steps:

[0035] In step S1, the white glass base material is used, and the outer contour size is cut to the required size, and the thickness size is equal to or greater than 0.7mm.

[0036] Step S2, drilling a through hole at a predetermined position on the surface of the glass substrate, and the diameter of the through hole ranges from 50 μm to 150 μm;

[0037] Step S3, immersing the glass substrate into the HF solution to eliminate glass microcracks generated around the through hole, the soaking time is determined according to the drilling process adopted, the soaking process is automatically completed by machinery, and the soaking process is followed by cleaning and drying. In this embodiment, the mechanical drilling process is adopted, and based on the crack depth characteristics of the mechanical drilling, the time for the white glass to be immersed in t...

no. 2 example

[0066] The second embodiment: the difference between it and Embodiment 1 lies in the drilling process in step S3 and the process of covering the solder resist ink layer in step S14.

[0067] In this embodiment, step S3 is based on production and design requirements, and a picosecond green laser cutting machine is selected to complete the drilling process. Based on the shallow crack characteristics of laser drilling, the time for the white glass to be immersed in the HF solution is equal to or less than 3 minutes. The soaking process is also automatically completed by machinery to avoid the impact of the HF solution on human health. After soaking, it is cleaned and dried.

[0068] further,

[0069] Step S14 of this embodiment is used to cover the through holes, the front side and the back side of the glass substrate with the solder resist ink layer. Compared with the first embodiment, the difference is that the white solder resist ink layer is covered on the front surface, and...

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Abstract

The invention discloses a manufacturing method of a glass-based MINI LED backlight substrate, and compared with the problems of more technological processes and low yield in the traditional technology, the manufacturing method of the glass-based MINI LED backlight substrate has the advantages that: 1, a vacuum sputtering process is omitted, and the expensive equipment purchase cost is saved; 2, a copper etching process is omitted; 3, the adhesive force of chemical copper in the hole wall is increased by utilizing the flowability of the low-viscosity negative adhesive; 4, compared with etching adopted in a traditional process, the method can be used for manufacturing fine lines, the etching process is not needed, patterns can be made to be very thin, and then the wiring density is remarkably increased; and 5, the yield is obviously improved, and the cost waste is reduced. And as the process links are optimized, the quality control is facilitated, and the corresponding investment cost waste links can also be controlled. The method disclosed by the invention is beneficial to quality consistency, simple and convenient in process and excellent in flexibility. And the labor cost can be reduced synchronously. And the method is favorable for quickly introducing industrialization.

Description

technical field [0001] The invention relates to the technical field of backlight display, in particular to a method for manufacturing a glass-based MINI LED backlight substrate. Background technique [0002] As Mini LED enters the stage of commercialization, at present, global mainstream manufacturers have basically completed the research and development process of Mini-LED backlights and entered the stage of small-batch samples or large-batch supply. Major domestic enterprises are also intensively conducting technological research to speed up the process of putting it on the market. Mini LED packaging mainly includes two solutions: COB (Chip on Board) technology and IMD (Integrated Mounted Devices) technology, while Mini COG is a technical solution with glass as the substrate. At present, in the processing of Mini LED substrates, the quality damage frequently occurs in the traditional process, and the cost waste is also high. Therefore, low-cost and high-efficiency manufa...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/62
Inventor 余燕青周朝平
Owner 东莞市友辉光电科技有限公司