Rapid preparation method of flexible conductive circuit board

A conductive circuit and flexible conductive technology, which is applied in the field of rapid preparation of flexible conductive circuit boards, can solve problems such as difficult rapid preparation of thicker circuits, restrictions on the development and application of flexible conductive circuit boards, and poor bonding between coatings and substrates. The effect of fast forming speed, good bonding strength and high utilization rate

Pending Publication Date: 2022-05-10
JIANGSU UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, conventional methods for preparing flexible conductive circuit boards generally have certain disadvantages, such as the need for chemical treatment, serious environmental pollution, relatively poor

Method used

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  • Rapid preparation method of flexible conductive circuit board

Examples

Experimental program
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Effect test

Example Embodiment

[0023] Example 1

[0024] Using picosecond laser, a conductive line with a width of 1mm was cut on a copper sheet with a thickness of 0.03mm; Place the polyethylene terephthalate matrix on a glass sheet. Place the conductive line on the surface of polyethylene terephthalate material and press it with a glass sheet; Connect the positive and negative poles of the power supply at both ends of the conductive line. The applied current is 3-5A, and it is kept for 1-3s for a short time. The surface of the substrate in contact with the conductive circuit melts momentarily, and the conductive circuit is combined with the flexible substrate to form the final conductive circuit board.

[0025] The conductive circuit has the advantages of high forming speed, simple operation process, no need of complicated chemical treatment, environmental protection, high material utilization rate and good bonding strength between the circuit and the substrate.

Example Embodiment

[0026] Example 2

[0027] A 0.1mm diameter copper wire was used to prepare the conductive circuit by mechanical bending. Place the polyethylene terephthalate matrix on a glass sheet. Place the conductive line on the surface of polyethylene terephthalate material and press it with a glass sheet; Connect the positive and negative poles of the power supply at both ends of the conductive line; The current is 5-7A, and it is kept for a short time of 1-3s; The surface of the substrate in contact with the copper wire melts momentarily, and the copper wire is combined with the flexible substrate to form the final conductive circuit board.

[0028] The conductive circuit prepared by the method has the advantages of high forming speed, simple operation process, no need of complicated chemical treatment, environmental protection, high utilization rate of copper and good bonding strength between the circuit and the substrate.

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Abstract

The invention discloses a rapid preparation method of a flexible conductive circuit board, which comprises the following steps of: firstly, cutting a required conductive circuit from a metal sheet by utilizing mechanical cutting, laser cutting and laser ablation, or mechanically winding a metal wire with a certain diameter to obtain the conductive circuit; a conductive circuit is placed on the surface of a flexible substrate, the conductive circuit is pressed and fixed through hard insulating high-temperature-resistant materials such as glass, then the two ends of the conductive circuit are connected to a power source, current is instantly supplied to the conductive circuit, the conductive circuit is rapidly heated through electric heating, and the surface, making contact with the conductive circuit, of the flexible substrate is instantly and temporarily molten; the combination of the conductive circuit and the flexible substrate is realized, and the flexible conductive circuit board is formed. The conductive circuit prepared through the method is high in forming speed, simple in operation process, free of complex chemical treatment, environmentally friendly, high in metal material utilization rate and good in bonding strength of the circuit and a substrate, and the circuit with the large thickness can be rapidly prepared.

Description

technical field [0001] The invention relates to the field of flexible electronic device manufacturing, in particular to a rapid preparation method of a flexible conductive circuit board. . Background technique [0002] The flexible conductive circuit board is a flexible circuit formed after flexible materials such as ethylene glycol phthalate (PET) are used as the base material, and the surface is coated or embedded with a metal circuit. Flexible conductive circuit boards have advantages that traditional rigid circuit boards do not have, and can be twisted and stretched within a certain range. At present, flexible conductive circuit board is a major research direction of the electronics industry, and has broad development space and application prospects in the fields of information and medical science and technology. Common manufacturing methods for flexible conductive circuit boards include etching, inkjet printing, screen printing, electroless copper plating, and laser-a...

Claims

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Application Information

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IPC IPC(8): H05K3/38H05K3/00
CPCH05K3/38H05K3/00
Inventor 李永健任旭东周王凡童照鹏陈兰
Owner JIANGSU UNIV
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