Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Rapid preparation method of flexible conductive circuit board

A conductive circuit and flexible conductive technology, which is applied in the field of rapid preparation of flexible conductive circuit boards, can solve problems such as difficult rapid preparation of thicker circuits, restrictions on the development and application of flexible conductive circuit boards, and poor bonding between coatings and substrates. The effect of fast forming speed, good bonding strength and high utilization rate

Pending Publication Date: 2022-05-10
JIANGSU UNIV
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, conventional methods for preparing flexible conductive circuit boards generally have certain disadvantages, such as the need for chemical treatment, serious environmental pollution, relatively poor bonding between the obtained coating and the substrate, and difficulty in quickly preparing thicker circuits.
The above problems seriously limit the development and application of flexible conductive circuit boards

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Rapid preparation method of flexible conductive circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] A picosecond laser was used to cut a conductive line with a width of 1mm on a copper sheet with a thickness of 0.03mm; a polyethylene terephthalate substrate was placed on a glass sheet. Place the conductive circuit on the surface of the polyethylene terephthalate material and press it tightly with a glass sheet; connect the positive and negative poles of the power supply at both ends of the conductive circuit. The input current is 3-5A, and it is kept for a short time of 1-3s. The surface of the substrate in contact with the conductive lines undergoes momentary melting, and the conductive lines combine with the flexible substrate to form the final conductive circuit board.

[0025] The forming speed of the conductive circuit is fast, the operation process is simple, no complicated chemical treatment is required, the invention is environmentally friendly, the material utilization rate is high, and the bonding strength of the circuit and the substrate is good.

Embodiment 2

[0027] Conductive lines were prepared by mechanical bending using a copper wire with a diameter of 0.1 mm; a polyethylene terephthalate substrate was placed on a glass slide. Place the conductive circuit on the surface of the polyethylene terephthalate material, and press it tightly with a glass sheet; connect the positive and negative electrodes of the power supply at both ends of the conductive circuit; pass in a current of 5-7A, and keep it for 1-3s A short time; the surface of the substrate in contact with the copper wire melts momentarily, and the copper wire combines with the flexible substrate to form the final conductive circuit board.

[0028] The conductive circuit prepared by the above method has fast forming speed, simple operation process, no complicated chemical treatment, environmental protection, high copper utilization rate, and good bonding strength between the circuit and the substrate.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Widthaaaaaaaaaa
Thicknessaaaaaaaaaa
Diameteraaaaaaaaaa
Login to View More

Abstract

The invention discloses a rapid preparation method of a flexible conductive circuit board, which comprises the following steps of: firstly, cutting a required conductive circuit from a metal sheet by utilizing mechanical cutting, laser cutting and laser ablation, or mechanically winding a metal wire with a certain diameter to obtain the conductive circuit; a conductive circuit is placed on the surface of a flexible substrate, the conductive circuit is pressed and fixed through hard insulating high-temperature-resistant materials such as glass, then the two ends of the conductive circuit are connected to a power source, current is instantly supplied to the conductive circuit, the conductive circuit is rapidly heated through electric heating, and the surface, making contact with the conductive circuit, of the flexible substrate is instantly and temporarily molten; the combination of the conductive circuit and the flexible substrate is realized, and the flexible conductive circuit board is formed. The conductive circuit prepared through the method is high in forming speed, simple in operation process, free of complex chemical treatment, environmentally friendly, high in metal material utilization rate and good in bonding strength of the circuit and a substrate, and the circuit with the large thickness can be rapidly prepared.

Description

technical field [0001] The invention relates to the field of flexible electronic device manufacturing, in particular to a rapid preparation method of a flexible conductive circuit board. . Background technique [0002] The flexible conductive circuit board is a flexible circuit formed after flexible materials such as ethylene glycol phthalate (PET) are used as the base material, and the surface is coated or embedded with a metal circuit. Flexible conductive circuit boards have advantages that traditional rigid circuit boards do not have, and can be twisted and stretched within a certain range. At present, flexible conductive circuit board is a major research direction of the electronics industry, and has broad development space and application prospects in the fields of information and medical science and technology. Common manufacturing methods for flexible conductive circuit boards include etching, inkjet printing, screen printing, electroless copper plating, and laser-a...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H05K3/38H05K3/00
CPCH05K3/38H05K3/00
Inventor 李永健任旭东周王凡童照鹏陈兰
Owner JIANGSU UNIV
Features
  • Generate Ideas
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com