Preparation method of epoxy resin-based heat-conducting, heat-resisting and electric-conducting adhesive film

A technology of epoxy resin and conductive adhesive film, applied in epoxy resin adhesive, conductive adhesive, film/sheet adhesive and other directions, can solve the problems of cracking and deformation, chip side climbing glue, chip tilting and other problems , to achieve high-efficiency anti-aging effect and good manufacturability

Pending Publication Date: 2022-05-13
常州宏巨电子科技有限公司
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] (1) Mix the epoxy resin and the conductive accelerator evenly, grind them fully, add silver powder, mix evenly, vacuumize, then add diluent, coupling agent and anti-aging agent, mix evenly, add curing agent, mix evenly, vacuumize , to obtain the epoxy resin-based heat-conducting and heat-resistant

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Preparation method of epoxy resin-based heat-conducting, heat-resisting and electric-conducting adhesive film
  • Preparation method of epoxy resin-based heat-conducting, heat-resisting and electric-conducting adhesive film
  • Preparation method of epoxy resin-based heat-conducting, heat-resisting and electric-conducting adhesive film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] This embodiment is an epoxy resin-based heat-conducting heat-resistant conductive adhesive film, including the following components by weight:

[0039] 12 parts of epoxy resin, 2 parts of diluent, 5 parts of curing agent, 5 parts of coupling agent, 3 parts of conductive accelerator, 5 parts of anti-aging agent, 120 parts of silver powder;

[0040] The epoxy resin-based heat-conducting heat-resistant conductive adhesive film is prepared by the following steps:

[0041] S1: Mix the epoxy resin and the conductive accelerator evenly, and grind them thoroughly;

[0042] S2: Add silver powder, mix evenly, vacuumize, then add diluent, coupling agent and anti-aging agent and mix evenly;

[0043] S3: adding a curing agent and mixing evenly, and vacuumizing to obtain the epoxy resin-based heat-conducting heat-resistant conductive adhesive film;

[0044] Anti-aging agent is prepared by the following steps:

[0045] S11: Under the condition of ice bath, add 46mL of concentrated ...

Embodiment 2

[0052] This embodiment is an epoxy resin-based heat-conducting heat-resistant conductive adhesive film, including the following components by weight:

[0053] 10 parts of epoxy resin, 1 part of diluent, 1 part of curing agent, 5 parts of coupling agent, 3 parts of conductive accelerator, 5 parts of anti-aging agent, 100 parts of silver powder;

[0054] The epoxy resin-based heat-conducting heat-resistant conductive adhesive film is prepared by the following steps:

[0055] S1: Mix the epoxy resin and the conductive accelerator evenly, and grind them thoroughly;

[0056] S2: Add silver powder, mix evenly, vacuumize, then add diluent, coupling agent and anti-aging agent and mix evenly;

[0057] S3: adding a curing agent and mixing evenly, and vacuumizing to obtain the epoxy resin-based heat-conducting heat-resistant conductive adhesive film;

[0058] Anti-aging agent is prepared by the following steps:

[0059] S11: Under the condition of ice bath, add 46mL of concentrated H ...

Embodiment 3

[0066] This embodiment is an epoxy resin-based heat-conducting heat-resistant conductive adhesive film, including the following components by weight:

[0067] 10 parts of epoxy resin, 2 parts of diluent, 5 parts of curing agent, 5 parts of coupling agent, 3 parts of conductive accelerator, 5 parts of anti-aging agent, 120 parts of silver powder;

[0068] The epoxy resin-based heat-conducting heat-resistant conductive adhesive film is prepared by the following steps:

[0069] S1: Mix the epoxy resin and the conductive accelerator evenly, and grind them thoroughly;

[0070] S2: Add silver powder, mix evenly, vacuumize, then add diluent, coupling agent and anti-aging agent and mix evenly;

[0071] S3: adding a curing agent and mixing evenly, and vacuumizing to obtain the epoxy resin-based heat-conducting heat-resistant conductive adhesive film;

[0072] Anti-aging agent is prepared by the following steps:

[0073] S11: Under the condition of ice bath, add 46mL of concentrated ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a preparation method of an epoxy resin-based heat-conducting, heat-resisting and electric-conducting adhesive film, and relates to the field of epoxy resin-based heat-conducting, heat-resisting and electric-conducting adhesive films. Epoxy resin and an electric-conducting accelerant are uniformly mixed and fully ground, silver powder is added, then a diluent, a coupling agent and an anti-aging agent are added and uniformly mixed, a curing agent is added and uniformly mixed, and the epoxy resin-based heat-conducting, heat-resisting and electric-conducting adhesive film is obtained. The epoxy resin-based heat-conducting, heat-resisting and electric-conducting adhesive film solves the problems that the design requirement cannot be met when an electric-conducting silver adhesive material is used for packaging, and cracking deformation is caused by thermo-oxidative aging of an epoxy resin-based material; through the synergistic effect of the epoxy resin, the electric conduction accelerant, the silver powder and the anti-aging agent, the epoxy resin-based heat-conducting, heat-resisting and electric-conducting adhesive film has good manufacturability during application, packaging of thinner and smaller chips is achieved, meanwhile, piperazine and piperidine are integrated in the same molecule through a chemical synthesis method, and therefore the heat-conducting, heat-resisting and electric-conducting adhesive film is obtained. And the anti-aging agent has a more efficient anti-aging effect.

Description

technical field [0001] The invention relates to the field of epoxy resin-based heat-conducting heat-resistant conductive adhesive film, in particular to a preparation method of epoxy resin-based heat-conducting heat-resistant conductive adhesive film. Background technique [0002] With the development of social science and technology, human beings are pursuing more and more high-tech products, and constantly require products to achieve more functions in smaller and smaller dimensions, prompting semiconductor packaging to find thinner, smaller and more Reliability solutions for high packing densities, addressed in part by providing the materials used in the manufacture of ultra-small semiconductor devices; [0003] In the traditional chip packaging connection, materials such as lead-tin solder or conductive silver glue are usually used. Since the minimum pitch of lead-tin soldering is only 0.65mm when using lead-tin solder for packaging, it is easy to The phenomenon of glue ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): C09J7/30C09J9/02C09J11/04C09J11/06C09J163/00C08G59/62
CPCC09J7/30C09J9/02C09J163/00C09J11/06C09J11/04C08G59/623C08K2003/0806C08K2201/001C08K3/08C08K3/042C08K5/3435
Inventor 王浩宋涛曹俊山钱力
Owner 常州宏巨电子科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap