The invention discloses a preparation method of an
epoxy resin-based heat-conducting, heat-resisting and electric-conducting
adhesive film, and relates to the field of
epoxy resin-based heat-conducting, heat-resisting and electric-conducting
adhesive films.
Epoxy resin and an electric-conducting
accelerant are uniformly mixed and fully ground, silver
powder is added, then a
diluent, a
coupling agent and an anti-aging agent are added and uniformly mixed, a curing agent is added and uniformly mixed, and the
epoxy resin-based heat-conducting, heat-resisting and electric-conducting
adhesive film is obtained. The epoxy resin-based heat-conducting, heat-resisting and electric-conducting adhesive film solves the problems that the design requirement cannot be met when an electric-conducting silver adhesive material is used for packaging, and
cracking deformation is caused by thermo-oxidative aging of an epoxy resin-based material; through the synergistic effect of the epoxy resin, the electric conduction
accelerant, the silver
powder and the anti-aging agent, the epoxy resin-based heat-conducting, heat-resisting and electric-conducting adhesive film has good manufacturability during application, packaging of thinner and smaller chips is achieved, meanwhile,
piperazine and
piperidine are integrated in the same molecule through a
chemical synthesis method, and therefore the heat-conducting, heat-resisting and electric-conducting adhesive film is obtained. And the anti-aging agent has a more efficient anti-
aging effect.