The invention discloses a preparation method of an epoxy resin-based heat-conducting, heat-resisting and electric-conducting adhesive film, and relates to the field of epoxy resin-based heat-conducting, heat-resisting and electric-conducting adhesive films. Epoxy resin and an electric-conducting accelerant are uniformly mixed and fully ground, silver powder is added, then a diluent, a coupling agent and an anti-aging agent are added and uniformly mixed, a curing agent is added and uniformly mixed, and the epoxy resin-based heat-conducting, heat-resisting and electric-conducting adhesive film is obtained. The epoxy resin-based heat-conducting, heat-resisting and electric-conducting adhesive film solves the problems that the design requirement cannot be met when an electric-conducting silver adhesive material is used for packaging, and cracking deformation is caused by thermo-oxidative aging of an epoxy resin-based material; through the synergistic effect of the epoxy resin, the electric conduction accelerant, the silver powder and the anti-aging agent, the epoxy resin-based heat-conducting, heat-resisting and electric-conducting adhesive film has good manufacturability during application, packaging of thinner and smaller chips is achieved, meanwhile, piperazine and piperidine are integrated in the same molecule through a chemical synthesis method, and therefore the heat-conducting, heat-resisting and electric-conducting adhesive film is obtained. And the anti-aging agent has a more efficient anti-aging effect.