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Epoxy resin foamed material

A technology of epoxy resin and foam material, applied in the field of epoxy resin, to achieve the effect of improving stability, simple and easy to control reaction, and good thermal oxidation resistance

Inactive Publication Date: 2018-04-06
HENAN ACADEMY OF SCI CHEM RES INST CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Method used

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  • Epoxy resin foamed material
  • Epoxy resin foamed material
  • Epoxy resin foamed material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] (1) Weigh 5.0g E44 type bisphenol A epoxy resin and 2.5g methyl isobutyl ketone in a round bottom flask at room temperature, heat and stir until completely dissolved. Then weigh 4.0g oligomer polyamide 650 and 2.5g methyl isobutyl ketone in a beaker, heat and stir until they are completely dissolved, pour them into a round bottom flask, mix the two and stir evenly, then add 0.5g butyl acrylate Esters, 0.1g vinyltrimethoxysilane, 1.0g Span 80 and 1.0g cetyl alcohol were stirred until homogeneous, placed in a water bath at 55°C for 30 minutes for pre-curing and then used.

[0024] (2) Add 0.17g of calcium chloride and 0.005g of potassium persulfate to 25ml of deionized water, mix well and set aside.

[0025] (3) Under mechanical stirring, add step (2) to step (1) drop by drop, and control the dropping time for about 8-10 minutes to obtain a milky white jelly-like HIPE. Move it to a beaker and place it at 50 Continue to react in a water bath at ~60°C for 8~10 hours until ...

Embodiment 2

[0027] (1) Weigh 5.0g E51 type bisphenol A epoxy resin and 2.8g methyl isobutyl ketone in a round bottom flask at room temperature, heat and stir until completely dissolved. Then weigh 4.5g oligomer polyamide 650 and 3.0g methyl isobutyl ketone in a beaker, heat and stir until they are completely dissolved, pour them into a round bottom flask, mix the two and stir evenly, then add 0.25g ethyl acrylate Esters, 0.25g butyl acrylate, 0.12g acryltrimethoxysilane, 1.5g Span 80 and 2.0g cetyl alcohol were stirred until homogeneous, and placed in a 55°C water bath for 30 minutes for pre-curing before use.

[0028] (2) Add 0.2g of calcium chloride and 0.007g of potassium persulfate to 30ml of deionized water, mix well and set aside.

[0029] (3) Under mechanical stirring, use a dropper to add step (2) to step (1), and control the dropping time for about 8-10 minutes to obtain a milky white jelly-like HIPE, which is moved to a beaker and placed in Continue to react in a water bath at ...

Embodiment 3

[0030] Embodiment 3: comparative experiment

[0031] (1) Weigh 6.0g E44 type bisphenol A epoxy resin and 3.0g methyl isobutyl ketone in a round bottom flask at room temperature, heat and stir until completely dissolved. Then weigh 4.7g oligomer polyamide 650 and 3.0g methyl isobutyl ketone in a beaker, heat and stir until they are completely dissolved, pour them into a round bottom flask, mix the two and stir evenly, then add 1.5g Span 80 and 2.0 g of cetyl alcohol were stirred to a homogeneous state, and placed in a water bath at 55°C for 30 minutes for pre-curing before use.

[0032] (2) Add 0.2g of calcium chloride to 30ml of deionized water, mix well and set aside.

[0033] (3) Under mechanical stirring, use a dropper to add step (2) to step (1), and control the dropping time for about 8 to 10 minutes to obtain a milky white jelly-like HIPE, which is transferred to a beaker. Put it in a water bath at 50-60°C and continue to react for 8-10 hours until the curing reaction ...

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Abstract

The invention discloses an epoxy resin foamed material and belongs to the technical field of epoxy resin. An integral block epoxy resin foamed material is prepared by means of a one-step method by taking a copolymer of organosiloxane and acrylate as a toughening phase by means of a high internal phase ratio emulsion template method. The flexibility and the high and low-temperature resistance of the system are improved greatly, and the application prospect is wide.

Description

technical field [0001] The invention relates to the technical field of epoxy resin, and more specifically relates to an epoxy resin foam material. Background technique [0002] Polymer foam materials have the characteristics of low relative density, large specific surface area, low thermal conductivity, and high specific strength. At the same time, they also have the designability and ease of processing of polymers. They are widely used in many fields such as filtration, separation, and sound reduction. Epoxy resin is an important class of thermosetting resin with high mechanical, electrical and heat resistance properties. Epoxy resin foam material is an important branch of foam polymer material, which has become a research hotspot in recent years. [0003] At present, there are many methods for preparing epoxy resin foam materials reported in the literature, mainly the phase separation method, that is, before the curing reaction starts, a removable solvent is added to the s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L33/04C08F220/18C08F230/08C08J9/00
CPCC08F220/18C08F220/1804C08J9/0023C08L63/00C08L2203/14C08L43/04C08F230/08
Inventor 王建莉吴立辉郝旭东刘海涛袁梦旗王晋王金良周晓楠李玉宁秦瑜
Owner HENAN ACADEMY OF SCI CHEM RES INST CO LTD
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