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Design method and packaging structure of system-on-chip with copper foil coil

A system-level chip and design method technology, applied in the direction of transformer/inductor coil/winding/connection, semiconductor/solid-state device components, semiconductor devices, etc., can solve the difficulties of integrated circuits, high temperature resistance of optical coupling devices, and difficult magnetic detection and sending circuit etc.

Pending Publication Date: 2022-05-13
鑫金微半导体(深圳)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The current semiconductor integrated circuits are based on the silicon wafer process, it is difficult to directly manufacture magnetic detection and transmission circuits, and it is very difficult to make integrated circuits with electromagnetic signal transmission or reception detection; at the same time, in some chips that require signal coupling and transmission, the principle of optical coupling can be used. Do, but the optical coupling device is difficult to withstand high temperature, and the probability of parameter drift failure is very high in a high temperature environment

Method used

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  • Design method and packaging structure of system-on-chip with copper foil coil
  • Design method and packaging structure of system-on-chip with copper foil coil
  • Design method and packaging structure of system-on-chip with copper foil coil

Examples

Experimental program
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Effect test

Embodiment 1

[0017] The first step: designing and manufacturing a copper foil coil circuit at the bottom of the packaging substrate;

[0018] The second step: other signal detection and processing circuits are placed on the packaging substrate, and connected with the copper foil coil circuit;

[0019] Step 3: Package all circuits together by using integrated circuit semiconductor technology to form a system-in-package chip with electromagnetic detection or transmission function or magnetic coupling function.

[0020] Through the above steps, the production of figure 1 A system-on-a-chip with a copper foil coil with electromagnetic detection or transmission function or magnetic coupling of the structure shown.

Embodiment 2

[0022] The first step: designing and manufacturing a copper foil coil circuit on the top layer of the packaging substrate;

[0023] The second step: other signal detection and processing circuits are placed on the packaging substrate, and connected with the copper foil coil circuit;

[0024] Step 3: Package all circuits together by using integrated circuit semiconductor technology to form a system-in-package chip with electromagnetic detection or transmission function or magnetic coupling function.

[0025] Through the above steps, the production of figure 2 A system-on-a-chip with a copper foil coil with electromagnetic detection or transmission function or magnetic coupling of the structure shown.

Embodiment 3

[0027] The first step: design and manufacture an embedded copper foil coil circuit inside the packaging substrate with a multi-layer packaging substrate manufacturing process;

[0028] The second step: other signal detection and processing circuits are placed on the packaging substrate, and connected with the copper foil coil circuit;

[0029] Step 3: Package all circuits together by using integrated circuit semiconductor technology to form a system-in-package chip with electromagnetic detection or transmission function or magnetic coupling function.

[0030] Through the above steps, the production of image 3 A system-on-a-chip with a copper foil coil with electromagnetic detection or transmission function or magnetic coupling of the structure shown.

[0031] The methods provided in the embodiments of the present invention are for brief description, and for those not mentioned in the embodiments, reference may be made to the corresponding content in the foregoing product emb...

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Abstract

The invention provides a design method and a packaging structure of a system-on-chip with a copper foil coil. A copper foil coil circuit is directly designed and manufactured in the packaging substrate or on the surface of the packaging substrate to serve as an electromagnetic detecting or sending element in the system chip, the coupling transmission function between induction receiving of external electromagnetic signals or sending of electromagnetic signals or internal signals is achieved through the element, and then other signal detecting and processing circuits on the packaging substrate are combined. And the chips work together and are packaged together by using an integrated circuit semiconductor process to form the system-in-package chip with an electromagnetic detection or transmission function or a magnetic coupling function. At the moment, the packaging substrate not only plays a role of a frame for fixing the chip, but also becomes a part of a working circuit.

Description

technical field [0001] The invention belongs to the field of integrated circuit design and packaging, in particular to a design method and packaging structure of a system-level chip with a copper foil coil. Background technique [0002] The current semiconductor integrated circuits are based on the silicon wafer process, it is difficult to directly manufacture magnetic detection and transmission circuits, and it is very difficult to make integrated circuits with electromagnetic signal transmission or reception detection; at the same time, in some chips that require signal coupling and transmission, the principle of optical coupling can be used. Do, but the optical coupling device is difficult to withstand high temperature, and the probability of parameter drift failure is very high in a high temperature environment. Contents of the invention [0003] Aiming at the defects in the prior art, the invention provides a design method and packaging structure of a system-on-chip w...

Claims

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Application Information

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IPC IPC(8): H01L23/66H01L23/12H01F27/28H05K1/09
CPCH01L23/66H01L23/12H01F27/28H05K1/09H01L2223/64
Inventor 夏乾华其他发明人请求不公开姓名
Owner 鑫金微半导体(深圳)有限公司