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Low-temperature curing conductive silver paste and preparation method thereof

A conductive silver paste, low temperature technology, applied in the manufacture of cables/conductors, conductive materials dispersed in non-conductive inorganic materials, circuits, etc. problems, to avoid high temperature damage to the film or other materials, high conductivity, low curing temperature

Pending Publication Date: 2022-05-17
衡阳思迈科科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the sintering temperature range of the conductive silver paste of the current touch screen material is narrow, which cannot meet the characteristics of the touch screen such as low cost, low temperature coefficient, no light decay, no hidden cracks, high stability, and low process temperature.

Method used

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  • Low-temperature curing conductive silver paste and preparation method thereof
  • Low-temperature curing conductive silver paste and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0029] A low-temperature curing conductive silver paste, comprising the following raw materials in parts by weight:

[0030] 13 parts of nano-silver powder; 8 parts of polymer resin; 7 parts of solvent; 4 parts of curing agent; 3 parts of nano additives; 1 part of coupling agent; 3 parts of conductive accelerator.

[0031] In the embodiment of the present application, the polymer resin includes the following raw materials in parts by weight: 3 parts of bisphenol A epoxy resin, 3 parts of polyurethane resin and 4 parts of alkyd resin.

[0032] As a further solution of the present invention, the solvent is a mixture of butanone, ethanol, terpineol, isopropanol and dimethyl adipate in a mass ratio of 1:2:3:1:2.

[0033] As a further solution of the present invention, the nano additives are mixed with nano-aluminum powder, nano-nickel powder and nano-copper powder in a mass ratio of 1:3:2.

[0034] As a further solution of the present invention, the coupling agent is tetraethoxys...

Embodiment 2

[0042] A low-temperature curing conductive silver paste, comprising the following raw materials in parts by weight:

[0043] 21 parts of nano-silver powder; 12 parts of polymer resin; 9 parts of solvent; 5 parts of curing agent; 4 parts of nano additives; 3 parts of coupling agent; 4 parts of conductive accelerator.

[0044] In the embodiment of the present application, the polymer resin includes the following raw materials in parts by weight: 4 parts of bisphenol A epoxy resin, 5 parts of polyurethane resin and 6 parts of alkyd resin.

[0045] As a further solution of the present invention, the solvent is a mixture of ethanol, terpineol and isopropanol in a mass ratio of 5:2:4.

[0046] As a further solution of the present invention, the nano additives are mixed with nano-aluminum powder, nano-nickel powder and nano-copper powder in a mass ratio of 2:5:4.

[0047] As a further solution of the present invention, the coupling agent is a mixture of tetraethoxysilane and silane ...

Embodiment 3

[0056] A low-temperature curing conductive silver paste, comprising the following raw materials in parts by weight:

[0057] 28 parts of nano-silver powder; 15 parts of polymer resin; 12 parts of solvent; 7 parts of curing agent; 5 parts of nano additives; 4 parts of coupling agent; 5 parts of conductive accelerator.

[0058] In the embodiment of the present application, the polymer resin includes the following raw materials in parts by weight: 5 parts of bisphenol A epoxy resin, 6 parts of polyurethane resin and 8 parts of alkyd resin.

[0059] As a further solution of the present invention, the solvent is terpineol.

[0060] As a further solution of the present invention, the nano-aluminum additive is mixed with nano-aluminum powder and nano-nickel powder according to a mass ratio of 1:3.

[0061] As a further solution of the present invention, the coupling agent is silane.

[0062] As a further solution of the present invention, the conduction promoter is conductive graphit...

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Abstract

The invention discloses low-temperature curing conductive silver paste and a preparation method thereof. The low-temperature curing conductive silver paste comprises the following raw materials in parts by weight: 13-28 parts of nano silver powder; 8-15 parts of polymer resin; 7-12 parts of a solvent; 4-7 parts of a curing agent; 3-5 parts of a nano auxiliary agent; 1-4 parts of a coupling agent; and 3-5 parts of a conductive promoter. According to the conductive silver paste provided by the invention, the addition amount of the nano silver powder is reduced, and after the nano silver powder, the nano additive and the conductive accelerant are fully dispersed and dissolved with the polymer resin, the density of the conductive silver paste can be effectively improved, and the low-temperature conductivity of the conductive silver paste is improved, so that the conductive silver paste is high in conductivity and low in curing temperature; the curing temperature of the original nano-silver paste is changed from 130 DEG C to 80 DEG C, so that the nano-silver paste meets the requirement of lower curing temperature of a touch screen, and a film or other materials are prevented from being damaged by high temperature.

Description

technical field [0001] The invention relates to the technical field of conductive silver paste, in particular to a low-temperature curing conductive silver paste and a preparation method thereof. Background technique [0002] Conductive silver paste is widely used in touch screen or solar cell anode materials. Taking the conductive silver paste for touch screen as an example, the surface of the touch screen should be printed with conductive low-temperature silver paste. According to the performance requirements of the touch screen, the sintering or curing temperature of the silver paste should be less than 250°C-300°C, which has high conductivity. [0003] However, the sintering temperature range of the conductive silver paste of the current touch screen material is narrow, which cannot meet the characteristics of the touch screen such as low cost, low temperature coefficient, no light decay, no hidden cracks, high stability, and low process temperature. [0004] Therefore,...

Claims

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Application Information

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IPC IPC(8): H01B1/16H01B1/22H01B13/00
CPCH01B1/16H01B1/22H01B13/00Y02E10/50
Inventor 涂晨辰王广胜蒋留新
Owner 衡阳思迈科科技有限公司