Anisotropic high-performance thermal interface material and preparation method thereof

A thermal interface material, anisotropic technology, applied in the direction of heat exchange materials, chemical instruments and methods, can solve the problems of easy leakage, difficult to improve thermal conductivity, corrosion of devices, etc., to improve thermal conductivity and effective heat. The effect of improved conductivity and convenient preparation

Active Publication Date: 2022-08-05
空间液态金属科技发展江苏有限公司
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  • Description
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Problems solved by technology

[0005] In order to solve the above-mentioned problems in the prior art, the present invention provides an anisotropic high-performance thermal interface material and its preparation method, which uses flexible materials as the matrix, magnetic liquid metal as the filler, and introduces micro-nano magnetic particles as heat-conducting materials. Reinforced particles; to solve the problems of existing liquid metal thermal interface materials that are difficult to improve thermal conductivity, easy to leak, corrode devices, etc., and can achieve anisotropy of thermal conductivity

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  • Anisotropic high-performance thermal interface material and preparation method thereof
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  • Anisotropic high-performance thermal interface material and preparation method thereof

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Embodiment 1

[0033] like figure 1 As shown, the high-performance thermal interface material with anisotropy provided in this embodiment includes a magnetic liquid metal 1 , magnetic particles 2 and a network skeleton 3 . Among them, the mesh skeleton 3 is made of flexible materials to separate the droplets of the magnetic liquid metal 1, and the magnetic liquid metal 1 is made of GaIn 21.4 It is composed of iron tetroxide particles, the flexible material is copolyester (Ecoflex), and the magnetic particles 2 are iron particles with a particle size of 1 micron.

[0034] In this embodiment, GaIn 21.4 That is, the mass of the eutectic gallium indium alloy is 500 grams, about 80 milliliters, the mass of iron tetroxide particles is 100 grams, the particle size is 1 micron, the Ecoflex system is 30 milliliters, and the volume of iron particles is 30 cubic centimeters.

[0035] The specific preparation process is as follows:

[0036] First, mix the liquid metal and the ferric oxide particles t...

Embodiment 2

[0043] Embodiment 2 is basically the same as Embodiment 1. For the sake of brevity, in the description of this embodiment, the same technical features as Embodiment 1 will not be described, and only the differences between this embodiment and Embodiment 1 will be described:

[0044] The thermal interface material with anisotropy provided in this embodiment 2, wherein the magnetic liquid metal passes through the Ga 68 In 21 Sn 11 It is mixed with ferric oxide particles, and the flexible material is polydimethylsiloxane (PDMS); the magnetic particles 2 are iron particles with a particle size of 2 microns.

[0045] In this embodiment, Ga 68 In 21 Sn 11 The mass of FeO is 500 g, about 80 ml, the mass of ferric oxide particles is 100 g, and the particle size is 3 microns; the system of polydimethylsiloxane (PDMS) is 30 ml, and the volume of iron particles is 30 cubic centimeters.

[0046] The specific preparation process is as follows:

[0047] First, mix the liquid metal and...

Embodiment 3

[0051] The high-performance thermal interface material with anisotropy provided in Example 3, the magnetic liquid metal passes through GaIn 10 It is mixed with NdFeB particles, the polymer is a hydrogel, and the magnetic particles 2 are iron particles with a particle size of 0.5 microns.

[0052] In this Example 3, GaIn 10 The mass of NdFeB particles is 500 g, about 80 ml, the mass of NdFeB particles is 100 g, the particle size is 0.5 microns, the system of hydrogel is 30 ml, and the volume of iron particles is 30 cubic centimeters.

[0053] The specific preparation process is as follows:

[0054] First, the liquid metal and NdFeB particles are mixed together, and stirred at a frequency of 290 rpm for 11 minutes by a mechanical stirrer. It can be seen that the surface NdFeB particles completely enter the liquid metal to obtain a magnetic liquid metal;

[0055] Then, put the magnetic liquid metal and iron particles obtained in the previous step into the hydrogel solution, and...

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Abstract

The invention provides anisotropic high-performance thermal interface material and a preparation method thereof, belonging to the field of heat dissipation materials. The high-performance thermal interface material includes a mesh skeleton, magnetic liquid metal and magnetic particles; wherein the mesh skeleton is made of a flexible material as a matrix; the magnetic liquid metal has a low melting point and is uniformly distributed in the mesh skeleton for use in Conduct heat; magnetic particles are micro-nano magnetic particles, evenly distributed in the network skeleton. By controlling the presence or absence of the magnetic field in a specific direction, the invention can make the magnetic particles and the magnetic liquid metal in the network skeleton align in the direction of the magnetic field, thereby realizing anisotropic thermal interface materials, and the design of dual magnetic components also Effectively improve the overall thermal conductivity of the material. The invention solves the problems of insufficient thermal conductivity of thermal interface materials in the prior art, and it is difficult to realize flexible anisotropy, and has considerable application value.

Description

technical field [0001] The invention relates to the field of thermal interface materials, in particular to a high-performance thermal interface material and a preparation method and application thereof. Background technique [0002] The vast universe is governed by several fundamental laws. The second law of thermodynamics is one of them. It tells us the inevitability of entropy increase, that is to say, all kinds of energy in a closed system need to be discharged in the form of heat energy. Returning to life, this law shows that heat generation in machine systems is inevitable, and with the development of electronic devices towards miniaturization and high integration, the heat generation of electronic devices gradually increases. If the heat dissipation is poor, the resulting thermal failure will greatly affect the performance and life of electronic equipment. Therefore, effective and reliable thermal management becomes the key to solving this problem. We know that there...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L67/00C08L83/04C08L53/02C08K3/22C08K3/08C09K5/14
CPCC08K3/22C08K3/08C09K5/14C08K2003/2275C08K2201/01C08K2003/0856C08K2201/005C08L67/00C08L83/04C08L53/025
Inventor 陈森盛磊刘贵林袁晓龙刘静陆逸扬
Owner 空间液态金属科技发展江苏有限公司
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