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Multi-cavity PVD-RTA mixed film deposition system

A PVD-RTA, thin film deposition technology, applied in the field of ion sputtering deposition system, can solve the problem of not being able to give full play to the role of RTA, reduce equipment use and maintenance costs, reduce temperature requirements, and improve the effect of thin film crystal structure

Pending Publication Date: 2022-05-31
浙江艾微普科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] However, the existing RTA is an independent annealing equipment for process operation under atmospheric pressure or protective gas; and it is not connected with other wafer processing vacuum process chambers such as film deposition and etching, and cannot fully utilize RTA The role in vacuum thin film preparation

Method used

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  • Multi-cavity PVD-RTA mixed film deposition system
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  • Multi-cavity PVD-RTA mixed film deposition system

Examples

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Embodiment Construction

[0044] refer to Figure 1 to Figure 6 The embodiment of the multi-cavity PVD-RTA hybrid thin film deposition system of the present invention will be further described.

[0045] In the description of the present invention, it should be noted that for orientation words, such as the term "center", "horizontal (X)", "longitudinal (Y)", "vertical (Z)", "length", " Width", "Thickness", "Top", "Bottom", "Front", "Back", "Left", "Right", "Vertical", "Horizontal", "Top", "Bottom", "Inner ", "outside", "clockwise", "counterclockwise" and other indication orientations and positional relationships are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying the Means that a device or element must have a specific orientation, be constructed and operated in a specific orientation should not be construed as limiting the specific protectio...

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PUM

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Abstract

The invention discloses a multi-cavity PVD-RTA (Physical Vapor Deposition-Resin Transfer Analysis) mixed thin film deposition system, which comprises a transport cavity, an RTA (Resin Transfer Angle) and a control system, the uploading cavity is arranged beside the transportation cavity, a first vacuum valve is arranged between the uploading cavity and the transportation cavity, and a third vacuum valve is directly arranged between the uploading cavity and the outside; the process cavity comprises a thin film deposition cavity, an etching cavity and a vacuum rapid annealing cavity which are distributed beside the transport cavity, and a second vacuum valve is arranged between the process cavity and the transport cavity. PVD and RTA are combined, so that the thin film deposition, etching and heat treatment processes of the wafer are all in vacuum, and the wafer does not need to be in contact with the atmosphere, and therefore, the production efficiency is greatly improved, and the production cost is reduced. Not only is the process efficiency improved, but also the performance and quality of the film are improved.

Description

technical field [0001] The invention belongs to the technical field of ion sputtering deposition systems, and more specifically relates to a multi-cavity PVD-RTA hybrid thin film deposition system. Background technique [0002] Lead zirconate titanate Pb(Zr 0.53 Ti 0.47 )O 3 (PZT) piezoelectric thin films have a wide range of applications, 5G communications, personal voice assistants, consumer wearable devices, fingerprint recognition, and medical equipment are all applications of piezoelectric devices. [0003] PZT piezoelectric film is the key technology for MEMS sensors and actuators. At present, the use of semiconductor technology (including MEMS technology) to prepare PZT piezoelectric thin films can make devices miniaturized, highly integrated, low cost, lower power consumption and higher performance to meet the massive demand for consumer products such as smartphones. [0004] Magnetron sputtering technology and equipment are the basic technology and equipment of ...

Claims

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Application Information

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IPC IPC(8): C23C14/08C23C14/58C23C14/56C23C14/35C23C14/18C30B29/32C30B25/02C30B33/02C30B33/08
CPCC23C14/088C23C14/5806C23C14/566C23C14/568C23C14/35C23C14/5873C23C14/185C30B29/32C30B25/02C30B33/02C30B33/08Y02P70/50
Inventor 唐云俊王昱翔
Owner 浙江艾微普科技有限公司
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