Multi-cavity PVD-RTA mixed film deposition system
A PVD-RTA, thin film deposition technology, applied in the field of ion sputtering deposition system, can solve the problem of not being able to give full play to the role of RTA, reduce equipment use and maintenance costs, reduce temperature requirements, and improve the effect of thin film crystal structure
Pending Publication Date: 2022-05-31
浙江艾微普科技有限公司
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The invention discloses a multi-cavity PVD-RTA (Physical Vapor Deposition-Resin Transfer Analysis) mixed thin film deposition system, which comprises a transport cavity, an RTA (Resin Transfer Angle) and a control system, the uploading cavity is arranged beside the transportation cavity, a first vacuum valve is arranged between the uploading cavity and the transportation cavity, and a third vacuum valve is directly arranged between the uploading cavity and the outside; the process cavity comprises a thin film deposition cavity, an etching cavity and a vacuum rapid annealing cavity which are distributed beside the transport cavity, and a second vacuum valve is arranged between the process cavity and the transport cavity. PVD and RTA are combined, so that the thin film deposition, etching and heat treatment processes of the wafer are all in vacuum, and the wafer does not need to be in contact with the atmosphere, and therefore, the production efficiency is greatly improved, and the production cost is reduced. Not only is the process efficiency improved, but also the performance and quality of the film are improved.
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