Light emitting diode epitaxial structure with N-type current expansion layer
A technology of light-emitting diodes and epitaxial structures, applied in circuits, electrical components, semiconductor devices, etc., to achieve the effects of promoting current expansion, reducing contact resistance, and reducing voltage
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[0033] The thickness of a single layer Alxinyga (1-X-Y) N sub-layer 731 is 20nm ~ 50nm, and 35nm is selected in this example. -3 ~ 4E04CM -3 , Select 1E04cm in this example -3 Among them, 0.05 -3 ~ 4E02CM -3 , Select 2E02 CM in this example -3 Among them, 0.02 <0.2, 0.06 in the embodiment of this embodiment; the thickness of the single layer GAN sub -layer 732 is 10nm ~ 40nm, and the selection of 25nm in this embodiment;
[0034] The extension of the extension of the light -emitting diode with the N -type current expansion layer is prepared through the following steps:
[0035] Step 2: Continue to grow U -shaped semiconductor layer 30 on the buffer layer 20. This layer is 3D longitudinal growth in the formation of nuclear island, and finally merged with nuclear island; the temperature is 1050 ° ~ 1150 °, and the pressure is 100TORR ~ 300TORR.
[0036] Step 3: Continue to grow N -type semiconductor layer 1 41 on the U -semiconductor layer 30, the temperature is 1000 ° ~ 1100 °, and...
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