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Single-step electrolytic method for filling through-holes in printed circuit boards and other substrates

A technology for printed circuit boards and electronic substrates, applied in the directions of printed circuits, printed circuit manufacturing, printed circuit components, etc., and can solve problems such as circuit failures

Pending Publication Date: 2022-06-17
麦克德米德乐思公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the temperature of an electronic part or a circuit board rises excessively due to heat emitted from the electronic part, there is a problem that a circuit formed on the electronic part or the circuit board may malfunction

Method used

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  • Single-step electrolytic method for filling through-holes in printed circuit boards and other substrates
  • Single-step electrolytic method for filling through-holes in printed circuit boards and other substrates
  • Single-step electrolytic method for filling through-holes in printed circuit boards and other substrates

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0139] The acid copper plating bath was prepared according to the following parameters:

[0140] Element constitute Control range copper sulfate 240g / L 230g / L-245g / L sulfuric acid 90g / L 85g / L-90g / L Chloride 75ppm 70ppm-100ppm brightener 7ppm 4ppm-10ppm wetting agent 5g / L 1g / L-10g / L leveling agent 10ppm 0.001ppm-50ppm bath temperature 23℃ 22℃-25℃

[0141] The concentration of copper sulfate is maintained by the addition of copper oxide on a manual or automatic basis based on operational amperometric analysis and / or with chemical titration analysis.

[0142] Supplement the concentration of sulfuric acid and chloride ions based on chemical titration analysis.

[0143] Replenishment of brighteners, wetting agents, and leveling agents is accomplished using an automated drug delivery system based on operational amperometric and / or cyclic voltammetric stripping (CVS) analysis.

Embodiment 1

[0150] The acid copper plating baths described above were used to plate test panels using plating cycles in accordance with the present invention and the plating parameters outlined in Table 4.

[0151] A cycle time of 80 minutes was used to plate a test panel with a thickness of 0.075 mm and a 0.12 mm laser drilled through hole.

[0152] The current density is 2.2A / dm 2 And the plating was performed for 80 minutes.

[0153] image 3 A cross section of a plated circuit board is depicted and shows 23 to 25 micron plated deposits and no pits.

Embodiment 2

[0160] The acid copper plating baths described above were used to plate test panels using plating cycles in accordance with the present invention and the plating parameters outlined in Table 4.

[0161] A 60 minute cycle time was used to plate test panels having a thickness of 0.07 mm and mechanical means to form 0.1 mm through holes therein.

[0162] The current density is 2.2A / dm 2 And the plating was performed for 60 minutes.

[0163] Figure 5 A cross section of a plated circuit board is depicted and shows 18 to 20 micron plated deposits and no pits.

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Abstract

A method of copper electroplating in the manufacture of a printed circuit board is disclosed. The method is used for filling through holes and micro vias with copper. The method includes the steps of: (1) preparing an electronic substrate to receive copper electroplating thereon; (2) forming at least one of one or more through-vias and / or one or more micro-vias in the electronic substrate; and (3) electroplating copper in the one or more through-vias and / or the one or more micro-vias by contacting the electronic substrate with an acidic copper electroplating solution. The acidic copper plating solution comprises a source of copper ions; sulfuric acid; a chloride ion source; a brightener; a wetting agent; and a leveling agent. The acidic copper plating solution coats the one or more through-vias and / or the one or more micro-vias until metallization is completed.

Description

technical field [0001] The present invention generally relates to a single-step electrolytic deposition method for copper, particularly for filling through-holes and micro-vias in printed circuit boards and other substrates. Background technique [0002] Electroplating copper solutions are used in many industrial applications, including anti-corrosion and decorative coatings, and in the electronics industry to manufacture electronic devices. Copper sulfate water baths are used in the manufacture of printed circuit boards (PCBs) and semiconductors. Copper has better electrical conductivity than most other metals and allows application to smaller features. [0003] Interconnect features are features such as blind micro-vias (BMVs), trenches and vias formed in dual electronic substrates. These features are preferably metallized with copper to provide interconnect conduction. During circuit fabrication, copper is plated on select portions of the surface of a printed circuit b...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K1/11H05K3/00
CPCH05K3/424H05K2203/1572H05K2203/1492H05K2203/0789H05K1/0206C25D3/38C25D7/00C25D5/18C25D5/02H05K3/188H05K3/181H05K1/181H05K3/423H05K7/20154
Inventor D·德萨尔沃R·布雷克C·古廖蒂W·J·德西萨雷R·贝勒马尔
Owner 麦克德米德乐思公司
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