Quartz pot plasma meltallizing method suitable for physical vapor deposition process

A technology of physical vapor deposition and quartz pot, which is applied in ion implantation plating, metal material coating process, sputtering plating, etc., can solve the problems of general operation and reduced use effect, so as to increase maintenance times, improve service life, Effect of reducing loss of maintenance

Pending Publication Date: 2022-07-15
合肥升滕半导体技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] With the improvement of deposition methods and technologies, physical vapor deposition technology can not only deposit metal films, alloy films, but also deposit compounds, ceramics, semiconductors and polymer films. Quartz is a mineral with very stable physical and chemical properties. Resources, the crystal belongs to the oxide mineral of trigonal crystal system. In order to improve the service life of the quartz pot, it is necessary to use physical vapor deposition technology and plasma spraying method on the surface of the quartz pot for coating treatment. The existing preparation method is generally operated, thereby reducing Therefore, we propose a quartz pot plasma spraying method suitable for physical vapor deposition process to solve the above problems

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  • Quartz pot plasma meltallizing method suitable for physical vapor deposition process

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Embodiment 1

[0030] Example 1: Please refer to figure 1 As shown, the present invention discloses a quartz pot plasma spraying method suitable for physical vapor deposition process, comprising the following steps:

[0031] S1. Masking operation: Carry out self-inspection operation on the product to confirm whether the state of the product after removing the film reaches the sandblasting standard, mask the non-spraying area, and use 5cm wide hot melt tape to mask the edge of the quartz pot. The standard of sandblasting is to remove the film layer on the surface of the quartz pot cleanly, without bumps, pits and scratches;

[0032] S2. Sandblasting treatment: carry out self-inspection operation on the masked products in step S1 to confirm whether the masking is qualified, use 60# white corundum to sandblast the sprayed area, and use CDA to purge after sandblasting, not applicable The sandblasted area is completely masked with hot melt tape, and the interface of the tape is gentle. Sandblast...

Embodiment 2

[0041] Example 2: Please refer to figure 1 As shown, the present invention discloses a quartz pot plasma spraying method suitable for physical vapor deposition process, comprising the following steps:

[0042] S1. Masking operation: Carry out self-inspection operation on the product to confirm whether the state of the product after removing the film reaches the sandblasting standard, mask the non-spraying area, and use 5cm wide hot melt tape to mask the edge of the quartz pot. The standard of sandblasting is to remove the film layer on the surface of the quartz pot cleanly, without bumps, pits and scratches;

[0043] S2. Sandblasting treatment: carry out self-inspection operation on the masked products in step S1 to confirm whether the masking is qualified, use 60# white corundum to sandblast the sprayed area, and use CDA to purge after sandblasting, not applicable The sandblasted area is completely masked with hot melt tape, and the interface of the tape is gentle. Sandblast...

Embodiment 3

[0052] Example 3: Please refer to figure 1 As shown, the present invention discloses a quartz pot plasma spraying method suitable for physical vapor deposition process, comprising the following steps:

[0053] S1. Masking operation: Carry out self-inspection operation on the product to confirm whether the state of the product after removing the film reaches the sandblasting standard, mask the non-spraying area, and use 5cm wide hot melt tape to mask the edge of the quartz pot. The standard of sandblasting is to remove the film layer on the surface of the quartz pot cleanly, without bumps, pits and scratches;

[0054] S2. Sandblasting treatment: carry out self-inspection operation on the masked products in step S1 to confirm whether the masking is qualified, use 60# white corundum to sandblast the sprayed area, and use CDA to purge after sandblasting, not applicable The sandblasted area is completely masked with hot melt tape, and the interface of the tape is gentle. Sandblast...

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Abstract

The invention discloses a quartz pot plasma meltallizing method suitable for a physical vapor deposition process, and relates to the technical field of quartz pot plasma meltallizing, and the quartz pot plasma meltallizing method comprises the following steps: S1, shielding operation; s2, carrying out sand blasting treatment; s3, carrying out first detection operation; s4, carrying out cleaning operation for the first time; s5, performing baking operation for the first time; s6, performing meltallizing operation; s7, carrying out second detection operation; s8, performing cleaning operation for the second time; s9, ultrasonic operation; and S10, performing baking operation for the second time. The quartz pot is used in a pre-c l ean XT process cavity in physical vapor deposition for manufacturing an integrated circuit, the principle of the physical vapor deposition technology is that under the vacuum condition, a low-voltage and large-current arc discharge technology is adopted, gas discharge is utilized to evaporate a target material and ionize an evaporated substance, and under the action of an electric field, the target material and the evaporated substance are separated. The prepared thin film has the advantages of being high in hardness, low in friction coefficient, good in abrasion resistance and chemical stability and the like.

Description

technical field [0001] The invention relates to the technical field of quartz pot plasma spraying, in particular to a quartz pot plasma spraying method suitable for a physical vapor deposition process. Background technique [0002] Physical vapor deposition technology refers to the use of physical methods under vacuum conditions to vaporize the surface of a material source (solid or liquid) into gaseous atoms or molecules, or partially ionize into ions, and deposit on the surface of the substrate through a low-pressure gas (or plasma) process The technology of thin films with certain special functions, physical vapor deposition is one of the main surface treatment technologies, physical vapor deposition coating technology is mainly divided into three categories: vacuum evaporation coating, vacuum sputtering coating and vacuum ion coating, physical vapor deposition coating. The main methods are: vacuum evaporation, sputtering coating, arc plasma coating, ion coating and molec...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/02C23C14/04C23C14/32C23C14/58C23G1/24
CPCC23C14/325C23C14/042C23G1/24C23C14/024C23C14/028C23C14/5806
Inventor 许杰
Owner 合肥升滕半导体技术有限公司
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