Film type electrostatic chuck with pressure sensing function
A technology of electrostatic chuck and pressure sensor, which is applied to the plating of circuits, electrical components, superimposed layers, etc., can solve problems such as pressure sensor combination, pressure sensor interference, and inability to adjust equipment and process synchronously, so as to ensure normal operation and prolong The effect of improving the service life and yield rate
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Embodiment 1
[0026] A thin-film electrostatic chuck with pressure sensing function proposed by the present invention includes an electrostatic chuck 1 , an interference shielding film 2 and a pressure sensor 3 ;
[0027] like Figure 1-3 As shown, the electrostatic chuck 1 and the pressure sensor 3 are arranged on the interference shielding film 2, and the electrostatic chuck 1 and the pressure sensor 3 are respectively located on both sides of the interference shielding film 2; the pressure sensor 3, the electrostatic chuck 1 and the interference shielding film 2 pass through special Glue connection, combined with external control circuit board to complete the design;
[0028] The manufacturing process steps of the interference shielding film 2 are as follows:
[0029] S1. Use the calculation software to match the parameters of the material and the algorithm to carry out multiple designs, and finally select the circuit diagram with the pressure sensing function; the calculation software ...
Embodiment 2
[0035] Compared with the first embodiment, this embodiment further includes an electrostatic chuck 1 , an interference shielding film 2 and a pressure sensor 3 ;
[0036] like Figure 1-3 As shown, the electrostatic chuck 1 and the pressure sensor 3 are arranged on the interference shielding film 2, and the electrostatic chuck 1 and the pressure sensor 3 are respectively located on both sides of the interference shielding film 2;
[0037] The manufacturing process steps of the interference shielding film 2 are as follows:
[0038] S1. Use the calculation software to match the parameters of the material and the algorithm to carry out multiple designs, and finally select the circuit diagram with the pressure sensing function;
[0039] S2. According to the designed circuit diagram with pressure sensing function, cooperate with the equipment to perform photolithography and drilling on the film;
[0040] S3. Put the film with the circuit after drilling into the electroplating equ...
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