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Preparation method and application of flexible electronic material based on metal phase change

A technology of metal phase change and electronic materials, applied to conductive materials dispersed in non-conductive inorganic materials, photovoltaic power generation, etc., can solve the problems of lack of deformation ability, high conductive threshold, and easily damaged resistance of conductive paths, and achieve the goal of manufacturing The method is simple and easy to implement, with good application prospects and simple post-processing effects

Pending Publication Date: 2022-08-05
SOUTHEAST UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although this method is simple, the metal fillers (such as metal powder and metal film) used in flexible electronic materials are generally solid at room temperature and only play a conductive role and lack deformability (to achieve deformable liquid The state generally requires a higher temperature), resulting in the conductive path being easily damaged during the stretching process and causing a sharp increase in resistance, which limits the application in flexible electronics
Although liquid metal is deformable as a filler and can achieve solid-liquid phase transition at room temperature, it has a high conductivity threshold and cannot achieve continuous solid-liquid phase transition (the phase transition temperature of liquid metal is a fixed value), so it cannot Tuning the mechanical and electrical properties of flexible materials

Method used

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  • Preparation method and application of flexible electronic material based on metal phase change
  • Preparation method and application of flexible electronic material based on metal phase change
  • Preparation method and application of flexible electronic material based on metal phase change

Examples

Experimental program
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Effect test

Embodiment 1

[0050] (1) Put metal gallium and indium into a round-bottomed flask in a mass ratio of 3:7, and after heating and melting (the temperature reaches the melting point of the metal and the two metals are melted), mechanically stir to obtain Ga 0.3 In 0.7 binary metal.

[0051] (2) Mix the polydimethylsiloxane (PDMS) and the curing agent (containing platinum catalyst, purchased with PDMS) in a mass ratio of 10:1, and then spin coating (300RPM 18S, 600RPM 30S) to print on the On the polytetrafluoroethylene sheet, after heating and curing at 80°C, a flexible substrate is obtained to be used as a PDMS substrate.

[0052] (3) Put Ga 0.3 In 0.7 The solid-liquid two-phase metal is printed on the PDMS substrate which has been heated and cured in step (2) by a blade coating method.

[0053] (4) Then mix the polydimethylsiloxane (PDMS) and the curing agent (containing platinum catalyst, purchased with PDMS) in a mass ratio of 10:1, and print them on the surface by spin coating (300RPM ...

Embodiment 2

[0059] (1) Put metal gallium and indium into a round-bottomed flask in a mass ratio of 3:7, heat and melt and mechanically stir to obtain Ga 0.3 In 0.7 binary metal.

[0060] (2) 0.35mLGa after melting by heating 0.3 In 0.7 The binary metal was mixed with 0.325 mL of Ecoflex A by trituration, and the mixture was cooled to room temperature.

[0061] (3) 0.325 mL of Ecoflex B was added to the mixture, and the mixture was ground and mixed, and then put into a mold for curing at room temperature to obtain a flexible electronic material based on metal phase change.

[0062] The resistance of the flexible electronic materials based on metal phase change prepared in this example is measured at different temperatures. By changing the temperature (10-160 ° C), the solid-liquid phase of the metal in the Ga-In solid-liquid two-phase region can be precisely controlled. The properties of the material are regulated. Figure 5 It is a graph of the resistance versus temperature of the f...

Embodiment 3

[0064] The preparation method of Example 3 is the same as that of Example 2, except that the Ga-In solid-liquid two-phase metal is replaced with Ga-Sn solid-liquid two-phase metal, and the mass ratio of metal gallium to tin is 3:7.

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Abstract

The invention discloses a preparation method and application of a flexible electronic material based on metal phase change. The method comprises the following steps: heating two or more metal elementary substances until the metal elementary substances are molten and mixed, stirring and then cooling to obtain solid-liquid two-phase metal; solid-liquid two-phase metal and a flexible high polymer material are compounded, and a compound is obtained; and processing and molding the compound to obtain the electronic material based on metal phase change. The preparation method is simple and easy to implement, low in cost and simple in aftertreatment, meanwhile, the prepared flexible electronic material based on metal phase change has very high response to force, and the response coefficient ranges from 0.1 to 10000. Meanwhile, weak deformation can influence a conductive network in the phase-change flexible electronic material, so that an electric signal of the material is changed. The flexible electronic material based on metal phase change prepared by the invention has a good application prospect in the aspects of wearable equipment, electronic skin, stretchable electrodes and the like.

Description

technical field [0001] The invention belongs to the field of flexible conductive materials, and in particular relates to a flexible electronic material based on metal phase transition and a preparation method and application thereof. Background technique [0002] With the development of science and technology, the demand for flexibility of various new electronic devices is more and more urgent, which makes electronic devices develop towards flexibility, including solar cells, smart textiles, displays, electronic skins, and energy storage devices. Electronic materials are indispensable in flexible electronic devices, so the development of high-performance flexible electronic materials is of great significance for various new application scenarios. Flexible electronic materials mainly achieve flexibility in two ways, namely structure-introduced flexibility and material-introduced flexibility. Structures introduce flexibility mainly by designing materials into stretchable stru...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/04C08K3/08C08L101/00H01B1/22
CPCC08L83/04C08K3/08C08L101/00H01B1/22C08K2201/001C08L2203/20Y02E10/549
Inventor 张久洋刘怀志李全
Owner SOUTHEAST UNIV