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Circuit substrate, circuit-formed suspension substrate, and production methods therefor

A circuit substrate, substrate technology, applied in the direction of circuit substrate materials, chemical instruments and methods, printed circuits, etc., can solve problems such as insulation failure, performance attenuation, distortion, etc.

Inactive Publication Date: 2004-05-12
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the suspension finally obtained by using a conventional circuit substrate with polyimide resin as an insulating layer also suffers from insulation failure and distortion, resulting in performance degradation in some cases, because the polyimide resin Has a higher coefficient of linear thermal expansion than metal foil substrates

Method used

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  • Circuit substrate, circuit-formed suspension substrate, and production methods therefor
  • Circuit substrate, circuit-formed suspension substrate, and production methods therefor
  • Circuit substrate, circuit-formed suspension substrate, and production methods therefor

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0088] Dissolve 0.702kg (6.5 moles) of p-phenylenediamine, 1.624kg (5.5) moles of 3,4,3',4'-diphenyltetracarboxylic dianhydride (hydrogen phthalate) in 19.72kg of dimethylacetamide dianhydride), 0.444 kg (1.0 mol) of 2,2-bis(3,4-dicarboxyphenyl) hexafluoropropane (6FDA) (total anhydride: 6.5 mol), and the resulting solution was stirred at room temperature for 72 hours . The temperature of the solution was raised to 75°C. When the viscosity of the solution reached 5,000 c.p., the heating was stopped and the solution was allowed to cool to room temperature.

[0089] A solution of a photosensitive polyimide resin precursor was prepared by adding 0.9633 kg (2.78 moles) of niphedipin, 0.6422 kg (2.04 moles) of an acetyl compound, and 0.161 kg (2.36 moles) of imidazole to the solution.

[0090] After coating this photosensitive polyimide resin precursor solution on a long stainless steel (SUS 304) foil having a thickness of 25 μm with a continuous coater, the coating was dried by ...

Embodiment 2

[0103] In 19.72kg N-methyl-2-pyrrolidone, dissolve 0.702kg (6.5 moles) of p-phenylenediamine, 1.743kg (5.9 moles) of 3,4,3',4'-diphenyltetracarboxylic dianhydride, 0.289 kg (0.65 mol) of 2,2-bis(3,4-dicarboxyphenyl)hexafluoropropane (total anhydride: 6.5 mol), and the resulting solution was stirred at room temperature for 72 hours. The temperature of the solution was raised to 75°C. When the viscosity of the solution reached 5,000 c.p., the heating was stopped and the solution was allowed to cool to room temperature.

[0104] A solution of a photosensitive polyimide resin precursor was prepared by adding 0.9633 kg (2.78 moles) of niphedipin, 0.6422 kg (2.04 moles) of an acetyl compound, and 0.161 kg (2.36 moles) of imidazole to the solution.

[0105] After coating this photosensitive polyimide resin precursor solution on a long stainless steel (SUS 304) foil having a thickness of 25 μm with a continuous coater, the coating was dried by heating at 120° C. for 2 minutes to form...

Embodiment 3

[0109] Dissolve 0.702kg (6.5 moles) p-phenylenediamine, 1.535kg (5.2 moles) 3,4,3',4'-diphenyltetracarboxylic dianhydride, 0.577kg (1.3 moles) in 19.72kg dimethylacetamide mol) 2,2-bis(3,4-dicarboxyphenyl)hexafluoropropane (total anhydride: 6.5 mol), and the resulting solution was stirred at room temperature for 72 hours. The temperature of the solution was raised to 75°C. When the viscosity of the solution reached 5,000 c.p., the heating was stopped and the solution was allowed to cool to room temperature.

[0110] A solution of a photosensitive polyimide resin precursor was prepared by adding 0.9633 kg (2.78 moles) of niphedipin, 0.6422 kg (2.04 moles) of an acetyl compound, and 0.161 kg (2.36 moles) of imidazole to the solution.

[0111] After coating this photosensitive polyimide resin precursor solution on a long stainless steel (SUS 304) foil having a thickness of 25 μm with a continuous coater, it was heated at 120° C. for 2 minutes to dry the coating to form Photosen...

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Abstract

The present invention provides a circuit substrate and a circuit-formed suspension substrate comprising the circuit substrate, the circuit substrate comprising a metal foil substrate and an insulating layer composed of a polyimide resin formed on the metal foil substrate, wherein the polyimide resin is one obtained by the reaction of (A) p-phenylene diamine and (B) acid anhydrides of (a) 3,4,3',4'-biphenyltetracarboxylic acid dianhydride and (b) 2,2-bis(3,4-dicarboxyphenyl)hexafluoropropane. Since a coefficient of linear thermal expansion of the polyimide resin is close to that of various metal foils, the circuit substrate causes no cracking on the resin layer and scarcely causes warpage, and the resin layer does not separate.

Description

technical field [0001] The invention relates to a circuit substrate, a suspended substrate formed with a circuit and a production method thereof. More specifically, the present invention relates to a circuit substrate having an insulating layer composed of polyimide resin on a metal foil substrate, a suspension substrate having a pattern circuit composed of a conductive layer formed on the circuit substrate. Chips and circuit substrates and suspension substrates formed with circuits. Background technique [0002] In a magnetic disk device such as a hard disk device used as an external storage device for a computer or the like, for magnetic recording or reproduction, it is necessary to relatively operate the above-mentioned magnetic disk and the magnetic head, elastically press the magnetic head so that the magnetic disk overcomes the resulting air flow , and maintain a fixed and precise distance between the head and the disk. The head support method for elastically pushing...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G11B5/60B32B27/34C08G73/10G03F7/004G03F7/038G11B5/48H05K1/05H05K3/44
CPCC08G73/1025G03F7/0387B32B27/34H05K1/056Y10S428/901G11B5/4846Y10T428/24917Y10T428/31721Y10T428/31681B32B15/043B32B15/08B32B27/281B32B2379/08B32B7/12B32B2311/12B32B2311/30
Inventor 船田靖人表利彦
Owner NITTO DENKO CORP
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