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Heat conducting electronic pouring sealant

A technology of potting glue and electronics, which is applied in the direction of circuits, electrical components, electric solid devices, etc., can solve the problems of thermal conductive electronic potting glue relying on imports, poor performance at low temperature, and high price, and achieve excellent physical and mechanical properties, low temperature The effect of good mechanical properties and low price

Inactive Publication Date: 2004-10-06
DONGGUAN UNIV OF TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, the heat-conducting electronic potting adhesive uses bisphenol A epoxy resin as the adhesive. Because the chain link of the bisphenol-A epoxy resin contains a benzene ring structure, the cured product of this type of heat-conducting electronic potting adhesive has poor low-temperature performance and Poor weather resistance and other disadvantages, and most of my country's thermally conductive electronic potting adhesives rely on imports, which are expensive

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0013] ——take 20 grams of benzene, 20 grams of glycidyl maleopimarate, 55 grams of aluminum oxide, 3.8 grams of dioctyl phthalate, 0.4 grams of titanate coupling agent, 0.6 grams of silicone dispersant, dark blue 0.2 g of pigment, stirred evenly to prepare component A.

[0014] - polyamide 650 # 60 grams, 40 grams of dioctyl phthalate, stirred evenly to obtain component B;

[0015] ——100 grams of component A, 25 grams of component B, stir evenly, pour the electronic high-frequency transformer with it, and cure it at 120°C for 5 hours. The test results show that the average temperature rise of the transformer is 55.6°C, and the thermal conductivity is 1.4 W / ( m. Celsius), the compressive strength is 2×10 8 Pa.

Embodiment 2

[0017] ——Take 22 grams of toluene, 22 grams of glycidyl maleopimarate, 46 grams of aluminum oxide, 3.8 grams of dibutyl phthalate, 0.45 grams of titanate coupling agent, 0.55 grams of silicone dispersant, black pigment 0.2 g, stirred evenly at room temperature to obtain component A;

[0018] ——100 grams of component A, 35 grams of component B of Example 1, stir evenly, pour the electronic high-frequency transformer with it, and cure it at 150°C for 2.5 hours. The test results show that the average temperature rise of the transformer is 57.4°C, and the thermal conductivity is 1.2 W / (m. Celsius), compressive strength is 1.6×10 8 Pa.

Embodiment 3

[0020] ——Take 22 grams of toluene, 22 grams of glycidyl maleopimarate, 46 grams of aluminum oxide, 3.8 grams of dioctyl phthalate, 0.45 grams of aluminate coupling agent, 0.55 grams of silicone dispersant, black pigment 0.2 g, stirred evenly at room temperature to obtain component A;

[0021] ——100 grams of component A, 45 grams of component B of Example 1, stir evenly, pour the electronic high-frequency transformer with it, and cure it at 120°C for 5 hours. The test results show that the average temperature rise of the transformer is 58.8°C, and the thermal conductivity is 1.3 W / (m. Celsius), the compressive strength is 1.5×10 8 Pa.

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PUM

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Abstract

The heat-conducting electronic pouring sealant is made up by adopting the following process: the solvent, moleopimaric acid glycidic ester, aoluminium oxide, plasticizer, coupling agent, dispersing agent and pigment are uniformly stirred to obtain component A, and the polyamide 650 and plasticizer are uniformly stirred to obtain component B, then both components A and B are uniformly stirred, and hardened for 5 hr. at 120 deg.c or for 2.5 hr. at 150 deg.c so as to obtain the invented product. Said invention uses the maleopimaric acid glycidic ester as binding agent, so that the mechanical property, electric property and weatherability of said invented pouring sealant can be raised.

Description

technical field [0001] The invention relates to a heat-conducting electronic potting adhesive using glycidyl maleopimarate as an adhesive and a preparation method thereof. Background technique [0002] At present, the heat-conducting electronic potting adhesive uses bisphenol A epoxy resin as the adhesive. Because the chain link of the bisphenol-A epoxy resin contains a benzene ring structure, the cured product of this type of heat-conducting electronic potting adhesive has poor low-temperature performance and Poor weather resistance and other disadvantages, and most of my country's heat-conducting electronic potting adhesives rely on imports, which are expensive. Contents of the invention [0003] The purpose of the present invention is to provide a heat-conducting electronic potting glue, which uses glycidyl maleopimarate with excellent performance and low raw material cost instead of bisphenol A epoxy resin to prepa...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09K3/10H01L23/28
Inventor 刘治猛沈敏敏哈成勇蒋欣
Owner DONGGUAN UNIV OF TECH