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Mixed integrated efficient full-colour LED lamp

A technology of hybrid integration and LED chips, applied in the direction of lampshades, lighting and heating equipment, electrical components, etc., to achieve the effects of easy production, uniform color mixing, and high brightness

Inactive Publication Date: 2005-04-20
卢景贵
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The hybrid integrated LED full-color lamp of the present invention can solve the problem of no single-color spots on the surface of the lamp housing and reasonable light intensity distribution without affecting the light effect

Method used

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  • Mixed integrated efficient full-colour LED lamp
  • Mixed integrated efficient full-colour LED lamp
  • Mixed integrated efficient full-colour LED lamp

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Experimental program
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Effect test

Embodiment Construction

[0028] The LED chips in this device are ultra-high brightness and large-size chips, and the LEDs of various colors are selected as follows: Red light: GaTIAs (double heterojunction DH) λp650-680nm

[0029] Green light: InGaN (single quantum well structure SQW) λp520, 540nm

[0030] Blue light: GaN λp470nm, 430nm

[0031] Orange light: InGaAIP λp620, 590nm

[0032] The mixed and integrated three-primary-color (red, blue, green) LED chip is fixed on a two-dimensional lead porcelain base with X-Y cross wiring. The wiring and structure of the porcelain base can be found in image 3 , Figure 4 , Figure 5 , Image 6 : The X-Y cross wiring is divided into upper and lower layers on the porcelain base to form a conductive belt, the upper layer is the electrode plate in the X row direction, and the lower layer is the electrode plate in the Y column direction. The upper and lower porcelain bases are fixed together by low-melting glass sintering (about 400°C). The thickness of th...

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Abstract

The hybrid integrated LED full-color lamp of the present invention comprises a hybrid integrated LED, a porcelain base, a polygonal spheroid packaging cap, a glass shell and a metal base. Wherein the ceramic base includes a conductive strip of an upper and lower double-layer porcelain substrate, and the conductive strip is an X-Y cross two-dimensional wiring layer. The device has uniform luminous color mixing, high brightness and is easy to manufacture.

Description

technical field [0001] The invention relates to a lighting device using LED as a light source. Background technique [0002] In recent years, due to breakthrough large-scale production and development of ultra-brightness blue, green, red and orange light in LED epitaxial material MOCVD (metal organic chemical vapor deposition) technology, a single LED chip package φ3, φ5 under 20mA current, Candlelight-level light intensity has been reached. The white light source lamp is made of red, blue and green primary color LED chips and YAG phosphor powder, which has reached 10 times the luminous efficiency of ordinary incandescent lamps. At present, there are many LED lamp products at home and abroad, but due to the limitations of existing technology and conditions, it is rare to see high-performance, high-quality LED lamp molding products. The traditional method of making decorative lamps, roadside lamps, lawn lamps, etc. with LED lamps is as follows: LED discrete device lamps of ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F21S10/00F21S13/12F21V3/04H01L21/82H01L25/075
Inventor 卢景贵卢健
Owner 卢景贵
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