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Chemical copper plating process for non-aqueous system magnesium base hydrogen storage alloy powder

A technology of hydrogen storage alloy powder and chemical copper plating, applied in the direction of coating, can solve the problems of affecting the copper plating effect alloy performance and other problems, and achieve the effects of reducing the formation of Cu2O, improving corrosion resistance, and inhibiting disproportionation reaction

Inactive Publication Date: 2005-10-19
NANKAI UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

There is no report on electroless plating of hydrogen storage alloy powder in non-aqueous system in the current literature. Generally, it starts from the stabilizer to study the effect of adding a small amount of organic reagent on the stability of the plating solution and the deposition rate.
In the traditional electroless copper plating process using water as solvent, when formaldehyde is used as reducing agent, Cu 2+ Easy to be reduced to form Cu 2 O, produced Cu + It is prone to disproportionation reaction and generates tiny copper particles, causing the rapid decomposition of the plating solution, which seriously affects the effect of copper plating and the performance of the alloy after plating.

Method used

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  • Chemical copper plating process for non-aqueous system magnesium base hydrogen storage alloy powder
  • Chemical copper plating process for non-aqueous system magnesium base hydrogen storage alloy powder
  • Chemical copper plating process for non-aqueous system magnesium base hydrogen storage alloy powder

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] With 100ml (wherein methanol accounts for 20%) plating solution, 2g CuSO 4 ·5H 2 O and 5.95g EDTA were dissolved in a 250ml beaker, and 200-400 mesh Mg 1.85 Mmm 0.15 Ni alloy powder 1g, K 4 [Fe(CN) 6 ]·3H 2 O is 2.5mg, using 2ml HCHO as the reducing agent, the stirring speed is 350 rpm, the pH value is 13, and the reaction temperature is 40°C. After the reaction for 15 minutes, the reacted alloy powder is suction-filtered, dried naturally, and sealed. spare.

[0018] The copper-plated alloy powder obtained above was pressed into pieces with a mold, and the non-test surface was coated with epoxy resin, and the electrochemical test was carried out in 5MKOH. The obtained constant potential polarization curve and AC impedance fitting data are shown in Table 1.

[0019] Methanol content

i corr / mA·cm 2

b c / mV

R 1 / Ω·cm 2

R 2 / Ω·cm 2

0

9.6

107

2.87

18.84

20％

6.7

...

Embodiment 2

[0023] With 100ml (wherein methanol accounts for 40%) plating solution, 1.5g CuSO 4 ·5H 2 O and 5.0g EDTA were dissolved in a 250ml beaker, and 200-300 mesh Mg 1.85 Mmm 0.15 Ni alloy powder 1g, K 4 [Fe(CN) 6 ]·3H 2 O is 2.0mg, use 2.5ml HCHO as the reducing agent, adjust the stirring speed to 380 rpm, the pH value to 12.5, and the reaction temperature to 35°C. After reacting for 25 minutes, filter the reacted alloy powder with suction, dry naturally, and seal Packaging, spare.

[0024] Press the copper-plated alloy powder obtained above into a sheet with a mold, coat the non-test surface with epoxy resin, and perform an electrochemical test in 5MKOH, and the constant potential polarization curve figure 1 The fitting results with the AC impedance spectrum are shown in Table 2. The copper-plated alloy powder obtained above is carried out SEM test, and the obtained results are shown in figure 2 .

[0025] Methanol content

[0026] Compared with the alloy plate...

Embodiment 3

[0028] With 100ml (wherein methanol accounts for 60%) plating solution, 2.2g CuSO 4 ·5H 2 O and 6.5g EDTA were dissolved in a 250ml beaker, and 200-400 mesh Mg 1.85 Mmm 0.15 Ni alloy powder 2.0g, K 4 [Fe(CN) 6 ]·3H 2 O is 3.1mg, using 2.8ml HCHO as the reducing agent, the stirring speed is 400 rpm, the pH value is 12.8, and the reaction temperature is 45°C. After 19 minutes of reaction, the reacted alloy powder is suction filtered, dried naturally, and sealed. ,spare.

[0029] The copper-plated alloy powder obtained above was pressed into a sheet with a mold, and the non-test surface was coated with epoxy resin, and the electrochemical test was carried out in 5MKOH. The above-mentioned copper-plated alloy powder obtained is carried out XPS test, and the obtained results are shown in image 3 .

[0030] From the test results of the constant potential polarization curve, the alloy powder coated with copper in 60% methanol reduces the corrosion potential and improves the ...

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Abstract

A chemical copper plating process for hydrogen bearing alloy powder by non-water system features that in the plating procedure, part of water is replaced by organic polar substance (5-80 vol%), which is the mass with hydrophilic polar radicals such as hydroxy, carboxy, or amino radical. Its advantages are high effect on preventing the corrosion and dismutation reaction of copper and plating copper, and high uniformity.

Description

technical field [0001] The invention relates to a non-aqueous system hydrogen storage alloy powder chemical copper plating process, which belongs to the hydrogen storage alloy powder chemical plating process technology. Background technique [0002] With the continuous expansion of population and the rapid development of human society, resulting in a sharp increase in energy consumption, many of the energy we rely on will face depletion in the 21st century. Hydrogen, due to its rich resources, high energy density, and no pollution, has shown good application prospects. As a carrier of hydrogen, hydrogen storage materials are the key to the application of hydrogen energy in practice. Therefore, It is imperative to develop a hydrogen storage material with excellent performance. [0003] Among the currently developed hydrogen storage media, magnesium and its alloys are increasingly attracting people's attention due to their high hydrogen storage capacity, low specific gravity,...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B22F1/02C23C18/38
Inventor 张海昌孙华王晓丹周作祥
Owner NANKAI UNIV
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