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Method for forming very tip in reader head of data converter, and reader/writer head

A data converter and extremely cutting-edge technology, applied in data recording, instruments, magnetic recording heads, etc., can solve problems such as difficult composition, damage to the reading sensor, and increased cost, and achieve improved track width control, extended service life, and high The effect of aspect ratio

Inactive Publication Date: 2006-05-10
PANASONIC HEALTHCARE HLDG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, using current lithography techniques and steppers, it is difficult to pattern such a narrow tip width and provide a high aspect ratio and vertical profile, while maintaining High critical dimension control due to the resolution of the etch pattern
While a conventional process can be used with a slider horizontal pole shear as a means of achieving sub-micron write track widths, the cost of this operation is significantly higher and may result in a sensor damage

Method used

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  • Method for forming very tip in reader head of data converter, and reader/writer head
  • Method for forming very tip in reader head of data converter, and reader/writer head
  • Method for forming very tip in reader head of data converter, and reader/writer head

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Embodiment Construction

[0024] refer to Figure 1A , shows a side elevational view of a portion of the MR or GMR write head substrate 10 . Substrate 10 may include, for example, aluminum oxide (Al 2 o 3) or other suitable write head gap layer material (about 4000 Å thick) covering the base plate of the write head (not shown) or the shared Shielding; a seed layer 12, such as nickel-iron (NiFe) or similar pole material, deposited to a thickness between 1000 Å-2000 Å. In another embodiment, the seed layer 12 may comprise, for example, a relatively high magnetic momentum material such as iron nitride (FeN) or cobalt nickel iron (CoNiFe).

[0025] Referring now to Figure 1B, the Figure 1A A cross-sectional view of a sample of the structure shown, showing the application of a first photoresist layer to deposit a relatively thick coating on a seed layer 12 (not shown for clarity), which acts as an underlayer in the present technology role. The first photoresist layer 14 is deposited to a thickness of a...

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Abstract

A top surface imaging technique for top pole tip width control in magnetoresistive or giant magnetoresistive read / write heads employs a multilayer structure to form thick photoresist in a process with improved multidimensional control. To this end, a relatively thick upper photoresist layer is patterned with improved resolution, then an intermediate metal or ceramic layer is formed using the upper photoresist layer as a reactive ion etch mask, and then, in In the second RIE process, the bottom thick photoresist layer is formed using the intermediate layer as an etch mask. As a result, submicron pole tip widths with high aspect ratios and vertical profiles, and improved critical dimension control are available.

Description

[0001] The present invention is related to the technology described in the following U.S. Patents: No. 5,485,334 "Magnetoresistive Device and Method with Improved Barkhausen Noise Cancellation"; No. 5,573,809 "Procedure for forming a magneto-resistive device"; No. 5,608,593 "Forming a spin valve-shaped magneto-resistive converter and a method of manufacturing such a magneto-resistive converter with domain stabilization technology "; No. 5,634,260 "Method of Fabricating Magneto-Resistive Devices with Improved Barkhausen Noise Cancellation"; No. 5,637,235 "Styling Rotating Valve-Type Magneto-Resistive Converters and Methods of Fabricating Such Magneto-Resistive Converters with Domain Stabilization Techniques" ; No. 5,639,509 "Procedure for Forming Flux-Enhanced Magnet Data Converters"; No. 5,654,854 "Longitudinal-Biased Magneto-Resistive Converters with Concave Reaction Regions to Reduce Barkhausen Noise by Obtaining Essential Single Magnetic Domain States"; No. .5,658,469 "Format...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G11B5/39G03F7/09G11B5/31
CPCB82Y10/00B82Y25/00G03F7/092G11B5/3116G11B5/3163G11B5/3967G11B2005/3996G11B5/39
Inventor 迈克尔·J·詹尼森潘威
Owner PANASONIC HEALTHCARE HLDG CO LTD