Cubic MgZnO crystal thin film optical waveguide device and preparation process thereof
A preparation process and a technology for optical waveguides, which are applied in optical waveguide light guides, photolithographic process exposure devices, light guides, etc., can solve the problems of large stress and birefringence effect, increase the refractive index of the core layer, increase device loss, etc. Small birefringence effect, reduced loss, low loss effect
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Embodiment 1
[0046] Embodiment 1: see attached figure 1
[0047] (1) Clean the Si(100) substrate with a standard cleaning method, and use a high-temperature oxidation process to thermally grow a uniform layer of SiO on the surface of the Si sheet 2 Thin film --- substrate 1, with a thickness of 2 μm;
[0048] (2) SiO 2 / Si(100) substrate 1 is placed in a growth chamber for low-temperature deposition of cubic MgZnO crystal thin films, and SiO is heated 2 / Si(100) substrate 1 to 100°C, bombarded with high energy electron beam (MgO) 0.10 (ZnO) 0.90 Target material, electron gun high voltage is 5000V, beam current is 30mA, filled with O 2 As a reactive gas, filled with O 2 The air pressure in the post-growth chamber was maintained at 3 × 10 -2 Pa, when the air pressure reaches 5×10 -2 Pa, start to grow, adjust the beam flow and beam spot size and position to maintain a stable pressure condition, and prepare cubic Mg with uniform grains and high surface smoothness. 0.83 Zn 0.17 O crys...
Embodiment 2
[0052] Embodiment 2: see attached figure 1 and with reference to Example 1
[0053] (1) Clean the glass substrate---substrate 1: put the glass substrate 1 in deionized water and ultrasonically clean it three times, each time for 3 minutes, then place the glass substrate in a sodium carbonate solution for 15 minutes in a water bath to remove the surface Organic matter, after taking it out, rinse it repeatedly with deionized water, and finally dry the silicon wafer with nitrogen in a laminar flow clean bench;
[0054] (2) Place the glass substrate 1 in a growth chamber for low-temperature deposition of cubic MgZnO crystal thin films, heat the glass substrate 1 to 100°C, and bombard (MgO) with a high-energy electron beam 0.10 (ZnO) 0.90 Target material, electron gun high voltage is 5000V, beam current is 30mA, filled with O 2 As a reactive gas, filled with O 2 The air pressure in the post-growth chamber was maintained at 3 × 10 -2 Pa, when the air pressure reaches 5×10 -2 P...
Embodiment 3
[0058] Embodiment 3: see attached figure 2 and with reference to Example 2
[0059] (1) Clean the glass substrate---substrate 1: put the glass substrate 1 in deionized water and ultrasonically clean it three times, each time for 3 minutes, then place the glass substrate in a sodium carbonate solution for 15 minutes in a water bath to remove the surface Organic matter, after taking it out, rinse it repeatedly with deionized water, and finally dry the silicon wafer with nitrogen in a laminar flow clean bench;
[0060] (2) Place the glass substrate 1 in a growth chamber for low-temperature deposition of cubic MgZnO crystal thin films, heat the glass substrate 1 to 100°C, and bombard (MgO) with a high-energy electron beam 0.15 (ZnO) 0.85 Target material, electron gun high voltage is 5000V, beam current is 30mA, filled with O 2 As a reactive gas, filled with O 2 The air pressure in the post-growth chamber was maintained at 3 × 10 -2 Pa, when the air pressure reaches 5×10 -2 ...
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Abstract
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