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Inorganic or organic hybridization nanocomposite for packaging light emitting diode (LED) and preparation method thereof

A nanocomposite material and LED packaging technology, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems that cannot take into account the light transmittance, mechanical properties, inorganic phase and organic phase that are prone to phase separation and agglomeration, etc. question

Active Publication Date: 2014-11-05
GUANGZHOU CHEM CO LTD CHINESE ACADEMY OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] Although the organosilicon material for LED packaging modified by inorganic nano-oxidation has the above-mentioned remarkable advantages, there are also problems that cannot be ignored in this system, such as the aggregation of inorganic phase nanoparticles in the system, and the inorganic phase in the system easily phase-separate from the organic phase
Therefore, when improving the refractive index and weather resistance of materials, it is often impossible to take into account the light transmittance and mechanical properties of the system.

Method used

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  • Inorganic or organic hybridization nanocomposite for packaging light emitting diode (LED) and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0062] (1) Preparation of inorganic nano-hybrid phenyl vinyl silicone resin: phenylsilane (C 6 h 5 ) 2 Si(OCH 2 CH 3 ) 2 70g, Vinylsilane CH 2 =CHCH 2 Si(OCH 3 ) 3 10g and hydrocarbyl silane (CH 3 ) 2 Si(OC 2 h 5 ) 2 Dissolve 20g in a mixture of 100g tetrahydrofuran and 1.0g water, stir evenly with an electromagnetic stirrer at 70°C, add 1.5g of HCl solution catalyst with a mass fraction of 30%, react at 70°C for 4h, and vacuum at 0.09MPa , Remove water, by-products and solvents by rotary evaporation under reduced pressure at a temperature of 50°C, then add 100g of ethanol sol (Nanjing Haitai Nano Materials Co., Ltd.) Then carry out rotary evaporation under reduced pressure to remove the solvent, by-products and water, and obtain the inorganic nano-hybrid phenylvinyl silicone resin.

[0063] (2) Preparation of phenyl hydrogen-containing silicone resin: phenyl silanol (C 6 h 5 ) 2 Si(OH) 2 100g with hydrosilane CH 3 SiH(OC 2 h 5 ) 2 Mix 20g evenly, add 1.0...

Embodiment 2

[0066] (1) Preparation of inorganic nano-hybrid phenyl vinyl silicone resin: Phenylsilane C 6 h 5 Si(OCH 2 CH 3 ) 3 90g, Vinylsilane (CH 2 =CH)(C 6 h 5 )Si(OC 2 h 5 ) 3 5g and hydrocarbyl silane (CH 3 CH 2 ) 2 Si(OCH 3 ) 2 Dissolve 5g in a mixture of 50g ethanol and 10g water, stir evenly with an electromagnetic stirrer at 60°C, and add 0.1g of dibutyltin dilaurate as a catalyst, react at 60°C for 8h, in a vacuum of 0.08MPa and a temperature of Remove water, by-products and solvents by rotary evaporation under reduced pressure at 90°C, then add 200g of isobutyl acetate sol (Nanjing Haitai Nano Materials Co., Ltd.) Then carry out rotary evaporation under reduced pressure to remove the solvent, by-products and water, and obtain the inorganic nano-hybrid phenylvinyl silicone resin.

[0067] (2) Preparation of phenyl hydrogen-containing silicone resin: phenyl silanol (C 6 h 5 )(C 2 h 5 )Si(OH) 2 100g with hydrosilane (C 2 h 5 ) 2 SiHOC 2 h 5 Mix 0.1g evenl...

Embodiment 3

[0070] (1) Preparation of inorganic nano-hybrid phenyl vinyl silicone resin: phenylsilane CH 3 (C 6 h 5 ) 2 SiOCH 3 60g, Vinylsilane CH 2 =CHSi(OCH 3 ) 3 1 g and Hydrocarbylsilane CH 3 CH 2 CH 2 CH 2 Si(OC 2 h 5 ) 3 Dissolve 39g in a mixture of 200g 1,4-dioxane and 0.1g water, stir evenly with an electromagnetic stirrer at 90°C, add 5.0g of stannous octoate as catalyst and react at 90°C for 8h, in a vacuum of 0.09MPa, Water, by-products and solvents were removed by rotary evaporation under reduced pressure at a temperature of 100°C, and then 200g of n-butyl acetate sol (Nanjing Haitai Nano Materials Co., Ltd.) with a nano-sized zirconia content of 1% was added and reacted at 120°C for 2 hours. The reaction solution is subjected to vacuum rotary evaporation to remove solvent, by-products and water etc. to obtain inorganic nano-hybrid phenylvinyl silicone resin.

[0071] (2) Preparation of phenyl hydrogen-containing silicone resin: Phenylsilanol C 6 h 5 Si(OH) 3...

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Abstract

The invention belongs to the optoelectronic device packaging material technical field and discloses an inorganic or organic hybridization nanocomposite for packaging light emitting diode (LED) and a preparation method of the inorganic or organic hybridization nanocomposite for packaging LED. The preparation method of the inorganic or organic hybridization nanocomposite for packaging LED comprises the following steps: on one hand, using organosilane as monomer to prepare oligomerization siloxane, and compounding oligomerization siloxane and nanometer oxide sol to prepare inorganic nanometer hybridization phenyl group vinyl group organic silicone resin; on the other hand, using phenyl group silanol and hydrogen containing silane to prepare phenyl group hydrogen containing organic silicone resin through a nonhydrolytic sol- gel process ; and then solidifying the prepared phenyl group vinyl group organic silicone resin, phenyl group hydrogen containing organic silicone resin, auxiliaries and the like under catalytic agent condition through hydrosilylation, and obtaining the inorganic or organic hybridization nanocomposite. The prepared inorganic or organic hybridization nanocomposite has advantages of both inorganic materials and organic polymer materials, and can be used as materials for sealing LED or other optical protective materials.

Description

technical field [0001] The invention belongs to the technical field of photoelectric device packaging materials, and discloses an inorganic / organic hybrid nanocomposite material for LED packaging and a preparation method thereof. technical background [0002] Light-emitting diode (LED) is a solid-state semiconductor component. It has significant advantages such as high efficiency, energy saving, environmental protection and long service life. It is widely used in signal indication, lighting, backlight and other circuits. As the fourth-generation light source after incandescent lamps, fluorescent lamps, and high-pressure gas lamps, the application prospects of LEDs in the lighting market have attracted the attention of various countries. As early as 2002, the U.S. federal government launched the "National Semiconductor Lighting Research Program"; Japan was also one of the first countries in the world to initiate LED industry policies, and implemented the "21st Century Light P...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L83/07C08L83/05C08G77/20C08G77/12C08K13/02C08K3/36C08K3/22H01L33/56
Inventor 刘伟区高南
Owner GUANGZHOU CHEM CO LTD CHINESE ACADEMY OF SCI