Electromagnetic shield textiles and its preparing method
An electromagnetic shielding and textile technology, applied in the field of electromagnetic shielding textiles and its preparation, can solve the problems of high cost, softness, insufficient air permeability, strong elongation, etc.
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Embodiment 1
[0038] In this example, nylon 66 textile "RIPSTOP" is used as the base material, and the preparation steps are as follows:
[0039] The first step, pretreatment, desizing and refining with sodium hydroxide solution to clean the surface of the substrate fiber and remove the dirt on the fiber surface;
[0040] The second step, sensitization and activation, is treated with palladium chloride activation solution to form an extremely thin metal catalytic layer on the surface of the fiber, and then dried by a heat setting machine MONFORTS 328;
[0041] The third step is strengthening, soaking with 40% formaldehyde solution to strengthen the surface structure of the fiber;
[0042] The fourth step, electroless copper plating process
[0043] Plating solution formula
[0044] Copper Sulfate CuSO 4 ·5H 2 O 15g / L
[0045] Sodium Potassium Tartrate NaKC 4 h 4 o 6 4H 2 O 14g / L
[0046] EDTA tetrasodium salt 25g / L
[0047] Alkaline agent such as NaOH 25g / L
[0048] Formaldehyde...
Embodiment 2
[0073] In this embodiment, polyester taffeta is used as the base material, and the preparation steps are as follows:
[0074] Other preparation steps remain unchanged, and the plating solution formula of the fourth step electroless copper plating process is changed as follows accordingly:
[0075] Copper Sulfate CuSO 4 ·5H 2 O 16g / L
[0076] Sodium Potassium Tartrate NaKC 4 h 4 o 6 4H 2 O 15g / L
[0077] EDTA tetrasodium salt 25g / L
[0078] Alkaline agent such as NaOH 20g / L
[0079] Formaldehyde HCHO (concentration 37-40%) 20g / L
[0080] Nickel chloride NiCl 2 ·6H 2 O 1g / L
[0081] α,α'-bipyridine 20mg / L
[0082] Potassium cyanide 8mg / L
[0083] Penetrant JFC 2g / L
[0084] pH value 12~13
[0085] Temperature 47°C
[0086] The plating solution of the above formula is prepared separately by two groups of A and B, mixed before use, and finally added with a stabilizer to adjust the pH value.
[0087] Group A includes copper sulfate and formaldehyde, dissolves a gi...
Embodiment 3
[0105] In this embodiment, polyester taffeta is used as the base material, and the preparation steps are as follows:
[0106] Other preparation steps remain unchanged, and the plating solution formula of the fourth step electroless copper plating process is changed as follows accordingly:
[0107] Copper Sulfate CuSO 4 ·5H 2 O 16g / L
[0108] Sodium Potassium Tartrate NaKC 4 h 4 o 6 4H 2 O 15g / L
[0109] EDTA tetrasodium salt 25g / L
[0110] Alkaline agent such as NaOH 20g / L
[0111] Formaldehyde HCHO (concentration 37-40%) 20g / L
[0112] Nickel chloride NiCl 2 ·6H 2 O 1g / L
[0113] α,α'-bipyridine 20mg / L
[0114] Potassium cyanide KCN 8mg / L
[0115] Potassium thiocyanate (KSCN) 12mg / L
[0116]Penetrant JFC 2g / L
[0117] pH value 12~13
[0118] Temperature 47°C
[0119] The plating solution of the above formula is prepared separately by two groups of A and B, mixed before use, and finally added with a stabilizer to adjust the pH value.
[0120] Group A include...
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