Polycrystalline SiTFT of multi-grid double-channel structure
A polysilicon thin film, dual-channel technology, applied in transistors and other directions, can solve problems such as increasing the aspect ratio
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preparation Embodiment 1
[0048] 1) First, use PECVD method on a silicon substrate at 300°C to obtain 5000 Ȧ of SiO 2 .
[0049] 2) Use LPCVD method on the substrate (atmospheric pressure 0.3Torr, SiH 4 60sccm, the speed is 25 Ȧ per second) to deposit 2000 Ȧ of a-Si (amorphous silicon, SiH 4 Decomposed as a gas source to obtain a-Si, the substrate temperature during deposition is 200°C, and the background vacuum is 2×10 -4 Pa, reaction chamber pressure 80Pa) and ion implantation doping (energy 45KeV, concentration 5×10 15 cm -2 ), and then use a plasma etching process (dry etching) to photolithographically form the bottom gate 23 as shown in Figure 2;
[0050] 3) Precipitate 2500 Ȧ of SiNx as the insulating layer of the bottom gate, and the growth of this layer of film also uses PECVD on SiH 4 and NH 3 grow under a mixed atmosphere, the substrate temperature is kept at 270°C, and the reaction chamber pressure is 30Pa;
[0051] 4) Precipitating a 500 Ȧ a-Si thin film by LPCVD technology, the cond...
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