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Flexible circuit base board and its manufacturing method

A circuit substrate and manufacturing method technology, applied in the direction of circuit substrate materials, printed circuit components, chemical instruments and methods, etc., can solve problems such as cumbersome processes, and achieve the effect of simple processes

Inactive Publication Date: 2003-03-26
黄堂杰
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the PI film must be pre-treated with plasma (Plasma) before sputtering to ionize the oxygen on the PI surface, and the process is relatively cumbersome.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0013] Embodiment 1: The structure of the flexible circuit substrate in this embodiment is a polymer film layer, a chromium adhesion layer, a nickel-chromium alloy adhesion layer, a copper adhesion layer and a copper foil layer in sequence, and its manufacturing process steps are as follows:

[0014] Step 1: Use the film made of PI as the substrate, with an area of ​​10cm×10cm, use 20cm×20cm of chromium material as the sputtering target, the distance between the target and the PI film is 20cm, the sputtering current is 1.0A, and Ar gas is used as the sputtering target. Sputtering gas, sputtering gas pressure 5×10 -3 atm, sputtering gas flow rate 2×10 -3 torr, sputtering time 1min, sputtering a chromium adhesion layer on the surface of the PI side, the thickness of the chromium adhesion layer is less than 1μm;

[0015] Step 2: The sputtering process conditions are the same as step 1, the sputtering target material is a nickel-chromium alloy material, and a nickel-chromium allo...

Embodiment 2

[0019] Example 2: PET is used as the polymer film layer, and the rest are the same as in Example 1. The peel strength of the manufactured flexible circuit substrate reaches 1.0 kgf / cm.

Embodiment 3

[0020] Embodiment 3: the composition of flexible circuit substrate is PI macromolecule thin film layer, chromium adhesion layer, nickel-chromium alloy adhesion layer, nickel adhesion layer, copper adhesion layer and copper foil layer in sequence, sputtering and electroplating in its manufacturing process Condition is the same as embodiment 1, compared with embodiment 1, present embodiment sputters a nickel adhesion layer more between the nickel-chromium alloy adhesion layer and the copper adhesion layer, utilizes the expansion coefficient of nickel material to be between nickel-chromium alloy and copper Between the expansion coefficients, the bonding force between the material layers is strengthened, and the peel strength is greater than 1.0kgf / cm.

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PUM

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Abstract

The invention relates to the method for manufacturing the soft circuit based plate. The base plate comprises the macromolecular thin film layer and the metal, the nickel alloy and the copper bond coat is sequence. The manufacturing method is as following steps. (1) The macromolecule thin film is as the basis material and the metal is as the sputter target material. The metal bond cost is sputtered on the surface of one side of the macromolecule thin film. (2) The nickel alloy is as the sputter target material. The nickel alloy bond cost is sputtered on the surface of the metal bond cost. (3) The copper bond coat is sputtered on the surface of the nickel alloy bond coat by using copper as the sputter target material. Chromium-nickel alloy layer with coefficient of expansion between the coefficients of chrome sputter layer.

Description

(1) Technical field [0001] The invention relates to a printed circuit board, in particular to a flexible circuit board and a manufacturing method thereof. (2) Background technology [0002] In order to meet the miniaturization, light weight, high performance and strict requirements of reliability of electronic products, the development and design of flexible circuit boards have gradually attracted attention. Existing flexible circuit substrates can be roughly divided into three-layer and two-layer types. 1) The manufacturing process of the so-called three-layer flexible circuit board is a film made of a polymer plastic material such as Polyimide (abbreviated as PI) or polyester (Polyester, abbreviated as PET). One side surface of the type polymer film layer is coated with an adhesive, and then laminated with a layer of calendered copper foil layer to form a three-layer structure. The thickness of the adhesive in the interlayer is about 12.5-25 μm, using acrylic (Acrylate) ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B15/08C23C14/20C23C14/34H05K1/05
Inventor 黄堂杰
Owner 黄堂杰
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