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Plating method

A technology of plating and electrolysis of gold, applied in the field of electroless metal plating and electroless gold plating, can solve the problems of inability to plate other metals and the like

Inactive Publication Date: 2003-07-09
SHIPLEY CO INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this patent, a layer of gold is electrolessly deposited on a continuous layer of palladium, whereas these baths cannot plate other metals such as nickel

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0047] A gold plating bath was prepared by combining the components in the amounts shown in Table 1.

[0048] Table 1

[0049] Ingredients Dosage (g / L)

[0050] Such as AuNa 3 o 6 S 4 or HAuCl 4 Form of gold 1

[0051] Sodium thiosulfate 50

[0052] Benzene sulfite 10

[0053]Potassium dihydrogen phosphate 15

[0054] Oxalic acid 5

[0055] Water up to 1L

[0056] The pH of the bath is about 5.5. The temperature of the bath was maintained at 120°F (about 49°C).

Embodiment 2

[0058] With commercially available electroless nickel products (EVERON TM SMT electroless nickel, available from Shipley Corporation, Marlborough, Massachusetts) was nickel plated with acid copper plated FR4 coupons (1 inch x 0.5 inch). Nickel was deposited at a rate of 12 μin / min using standard plating conditions (190°F). Following electroless nickel plating, the nickel coating is rinsed.

[0059] After rinsing, the nickel-coated FR4 coupons were then contacted with a palladium catalytic bath (Ronamerse SMT catalyst, available from Shipley Corporation) for 1 minute. The palladium catalytic bath contained 100 ppm palladium in the form of tetraammonium palladium chloride, 170 mL / L hydrochloric acid and 730 mL / L deionized water. After contact with the palladium bath, the sample contained only barely visible palladium deposits and the palladium layer did not completely cover the entire surface. The sample was then contacted with the gold plating bath of Example 1. Gold was d...

Embodiment 3

[0060] Embodiment 3 (comparative example)

[0061] The procedure of Example 2 was repeated except that the sample was not catalytically contacted with palladium plating prior to gold plating.

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PUM

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Abstract

Disclosed are methods of depositing electroless gold layers on a metal substrate using a catalytic palladium deposit. Such electroless gold layers have increased adhesion as compared to conventional electroless gold deposits.

Description

technical field [0001] The present invention is generally in the field of electroless metal plating. More specifically, the present invention is in the field of electroless gold plating. Background technique [0002] Immersion or displacement plating is an electroless plating method, but is classified in a different category in the art. In immersion plating, the metal ions of the plating solution are deposited by displacing the elemental metal of the substrate. In electroless plating deposition, deposition occurs primarily by autocatalytic reduction of metal ions in solution. These electroless platings require the presence of a reducing agent. [0003] Immersion plating uses no applied electrical current but uses electrochemical displacement reactions driven by the position of the substrate metal in the electrokinetic series with respect to the metal to be deposited in solution. Plating occurs when dissolved metal ions in the plating bath are displaced by more reactive (...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/54C23C18/28C23C18/42C23C18/44H05K3/24
CPCH05K3/244C23C18/42C23C18/28C23C18/1651C23C18/54
Inventor M·坎茨勒
Owner SHIPLEY CO INC