Plating method
A technology of plating and electrolysis of gold, applied in the field of electroless metal plating and electroless gold plating, can solve the problems of inability to plate other metals and the like
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Embodiment 1
[0047] A gold plating bath was prepared by combining the components in the amounts shown in Table 1.
[0048] Table 1
[0049] Ingredients Dosage (g / L)
[0050] Such as AuNa 3 o 6 S 4 or HAuCl 4 Form of gold 1
[0051] Sodium thiosulfate 50
[0053]Potassium dihydrogen phosphate 15
[0054] Oxalic acid 5
[0055] Water up to 1L
[0056] The pH of the bath is about 5.5. The temperature of the bath was maintained at 120°F (about 49°C).
Embodiment 2
[0058] With commercially available electroless nickel products (EVERON TM SMT electroless nickel, available from Shipley Corporation, Marlborough, Massachusetts) was nickel plated with acid copper plated FR4 coupons (1 inch x 0.5 inch). Nickel was deposited at a rate of 12 μin / min using standard plating conditions (190°F). Following electroless nickel plating, the nickel coating is rinsed.
[0059] After rinsing, the nickel-coated FR4 coupons were then contacted with a palladium catalytic bath (Ronamerse SMT catalyst, available from Shipley Corporation) for 1 minute. The palladium catalytic bath contained 100 ppm palladium in the form of tetraammonium palladium chloride, 170 mL / L hydrochloric acid and 730 mL / L deionized water. After contact with the palladium bath, the sample contained only barely visible palladium deposits and the palladium layer did not completely cover the entire surface. The sample was then contacted with the gold plating bath of Example 1. Gold was d...
Embodiment 3
[0060] Embodiment 3 (comparative example)
[0061] The procedure of Example 2 was repeated except that the sample was not catalytically contacted with palladium plating prior to gold plating.
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