Ceramic joint body
A joint body and ceramic body technology, which is applied in the direction of ceramic layered products, semiconductor/solid-state device manufacturing, lamination, etc., can solve the problems of heavy weight, difficult temperature control, and large volume of the heater, and achieve reliable protection from The effect of corrosive gases
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example 1
[0176] (Example 1) manufacture of electrostatic chuck (see Figure 4~6 )
[0177] (1) A green sheet having a thickness of 0.47 mm is obtained by forming a composition obtained by mixing aluminum nitride powder (manufactured by Tokuyama Co., Ltd., The average particle size is 1.1 μm), 100 parts by weight; Y 2 o 3 (average particle size of 0.4 μm), 4 parts by weight; acrylic resin-based binder, 12 parts by weight; dispersant, 0.5 parts by weight; and 1-butanol and ethanol Alcohol is 53 parts by weight.
[0178] (2) Next, after drying the green sheet at 80° C. for 5 hours, the following green sheet was formed: an untreated green sheet; provided with a via hole for connecting the resistance heating element to the conductor circuit through perforation; A green sheet with through holes; a green sheet with through holes for via holes for connecting conductive circuits to external terminals; and a green sheet with through holes for via holes for connecting electrostatic electrodes...
example 2
[0193] (Example 2) manufacture of ceramic heater (see Figure 1~3 and Figure 9 )
[0194] (1) A green sheet having a thickness of 0.47 mm is obtained by forming a composition obtained by mixing aluminum nitride powder (manufactured by Tokuyama Co., Ltd., The average particle size is 1.1 μm), which is 100 parts by weight; diyttrium trioxide (Y 2 o 3 : Diyttrium trioxide, the average particle size is 0.4 μm), 4 parts by weight; adhesive based on acrylic resin, 11.5 parts by weight; dispersant, 0.5 parts by weight; and 1- Alcohol composed of butanol and ethanol is 53 parts by weight.
[0195] (2) Next, after drying the green sheet at 80°C for 5 hours, if figure 1 As shown, the following parts are formed by perforating, namely: the part 15 which is a through hole for passing the lift pin to transport the silicon wafer; the part which is a via hole 630; and the part which is a through hole 63, 63' which is filled with a conductor part.
[0196] (3) Conductive paste A was pr...
example 3
[0211] In this example, if Figure 10 As shown, the manufacturing method of the ceramic bonded body 42 is the same as in Example 1, except that the pattern is formed so that the resistance heating element 42 exists in most of the upper region (region A) of the bonding interface between the cylindrical body 17 and the ceramic substrate 41 ( In plan view, 80% of the area of the joint interface is, therefore, 20% of the area where the resistive heating element is not present). In addition, the resistance heating element 42 is joined to the external terminal 23 through the through-hole 43 using an Ag / Ni brazing material (not shown).
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