Building strengthening epoxy type edhesive and its preparation method
An adhesive and epoxy-based technology, applied in the direction of adhesives, epoxy resin glue, adhesive types, etc., can solve problems such as incomplete curing of adhesives, reduced activity of epoxy resins, and strong pungent odors, etc., to achieve T-type High peeling and impact strength, excellent bonding effect
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Embodiment 1
[0025] The raw material composition of the present invention comprises epoxy resin (A component) and the curing agent (B component) that contains amine group, cyano group, phenyl, hydroxyl, urea, thiourea, mercaptan group, and its weight ratio is 2 : 1.
[0026] The epoxy resin (A component) described in the present invention refers to the epoxy resin produced by Dow Chemical Company, and its trade mark is DER331 (DOW CO.).
[0027] The formula of curing agent (B component) of the present invention is: polyamine 29.36% (weight), endene nitrile 16.17% (weight), epoxy compound 38.49% (weight), urea 4.27% (weight), sulfur 5.70% (weight) of urea, 1.44% (weight) of thiol compound, and 4.57% (weight) of silane coupling agent.
[0028] The polyamine mentioned in the present invention refers to diethylenetriamine.
[0029] The epoxy compound described in the present invention refers to benzyl glycidyl ether.
[0030] The thiol compound described in the present invention refers to p...
Embodiment 2
[0039] The raw material composition of the present invention comprises epoxy resin (A component) and the curing agent (B component) that contains amine group, cyano group, phenyl group, hydroxyl group, urea, thiourea, mercaptan group, and its weight ratio is 1 : 1.5.
[0040] Epoxy resin (A component) of the present invention refers to the epoxy resin produced by Di Aisheng Company of Japan, and its trade mark is DIC850S.
[0041] The formula of curing agent (B component) of the present invention is: polyamine 29.12% (weight), acrylonitrile 13.31% (weight), epoxy compound 49.21% (weight), urea 2.51% (weight), thiourea 3.34% (weight), thiol compound 1.00% (weight), silane coupling agent 1.51% (weight).
[0042] The polyamine mentioned in the present invention refers to hexamethylene diamine.
[0043] The epoxy compound described in the present invention refers to DIC850S epoxy resin.
[0044] The thiol compound described in the present invention refers to pentaerythritol tet...
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Abstract
Description
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