Siliconless fire-retardant type quick solidifying covering film for flexible circuit and its preparation method
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- SHENZHEN DANBOND TECH
- Publication Date
- 2004-10-20
- Estimated Expiration
- Not applicable · inactive patent
Abstract
Description
Technical field:
[0001] The invention relates to a silicon-free flame-retardant fast-curing flexible circuit covering film and a preparation method thereof, belonging to polymer adhesives and preparation thereof. Background technique:
[0002] In recent years, the development of the information and communication industry has led to the rapid development of the microelectronics industry, and the requirements for flexible circuits are getting higher and higher. The covering film for protecting flexible circuits must have high bonding strength and heat resistance, acid resistance, alkali resistance and various A chemical medium, as a cover film for flexible circuits, generally a curable adhesive is applied to a polyimide film. Among them, the selection of adhesive material is very important. Generally, a thermoplastic resin is mixed with a thermosetting resin. The thermoplastic resin plays a role of fast bonding, and the thermosetting resin plays a role of permanent bonding and...