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Siliconless fire-retardant type quick solidifying covering film for flexible circuit and its preparation method

A fast-curing, flexible circuit technology, applied in coatings, devices for coating liquid on the surface, epoxy resin coatings, etc., can solve problems such as the impact of electrical properties, achieve easy coating, ensure stability, and reduce glue overflow Effect

Inactive Publication Date: 2004-10-20
SHENZHEN DANBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, in the field of hard disk heads, silicon has an impact on electrical performance

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] Heat 80 parts of acrylate copolymer, 100 parts of brominated epoxy resin EX-48, and 400 parts of toluene / acetone 1:1 mixed solvent at 80°C in sequence, and dissolve the prepared 50 parts of liquid phenolic F- 44. 90 parts of TDE-85 epoxy resin, 9 parts of AG80 epoxy resin, 10 parts of diaminodiphenyl sulfone, stirred with the solution of the above heating reaction for 1 hour, dissolved and then added 90 parts of aluminum hydroxide, 20 parts of diaminodiphenyl sulfone Diphenyl sulfone, 8 parts of modified dicyandiamide HT-11, 300 parts of toluene / acetone mixed solvent are heated at 80°C, stirred for 1 hour, the glue is prepared to measure the solid content of 30-35%, and the viscosity measuring cup is measured for 20-30 seconds. Cloth polyimide film, bake to a temperature of 80°C-90°C-100°C, and pass through for 10-12 minutes. After drying, the thickness of the film is 25-30μm, isolate it with release paper, roll it into a roll, and then roll it up. The cover film and th...

Embodiment 2

[0039] The only difference between this example and the previous example is that the multifunctional epoxy resin AG-80 is not used in various epoxy resin compounds, and the product test results are as follows:

[0040] The peel strength decreased to 1.1kg / mm;

[0041] The amount of glue overflow has increased to >0.06mm

[0042] Other indicators are the same as in Embodiment 1.

Embodiment 3

[0044] The difference between this example and Examples 1 and 2 is that, in addition to not adopting multifunctional epoxy resin AG-80 in various epoxy resin compounds, 8 parts of modified dicyandiamide in the above two examples HT-11 was replaced by 8 parts of diaminodiphenyl sulfone, and other conditions were the same, and the product test results were as follows:

[0045] The peel strength further decreased to 0.8kg / mm

[0046] The amount of overflowing glue further increased and became >0.08mm

[0047] Other indicators remain unchanged. This result still passes.

[0048] In addition, we have also done two comparative experiments, respectively omitted diaminodiphenyl sulfone and aluminum hydroxide in the experiments, and the products obtained could not pass the test. It can be seen that the formulation and preparation method of the present invention are inventive.

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PUM

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Abstract

A flame-retarded quickly solidified silicon-free covering film for flexible circuit contains brominated epoxy resin, liquid phenolic epoxy resin, high-activity low-viscosity epoxy resin, acrylate copolymer, diaminodiphenyl sulfone (or methane), aluminium hydroxide, Sb2O3, and toluene / acetone. Its advantages are high adhesion and fire resistance.

Description

Technical field: [0001] The invention relates to a silicon-free flame-retardant fast-curing flexible circuit covering film and a preparation method thereof, belonging to polymer adhesives and preparation thereof. Background technique: [0002] In recent years, the development of the information and communication industry has led to the rapid development of the microelectronics industry, and the requirements for flexible circuits are getting higher and higher. The covering film for protecting flexible circuits must have high bonding strength and heat resistance, acid resistance, alkali resistance and various A chemical medium, as a cover film for flexible circuits, generally a curable adhesive is applied to a polyimide film. Among them, the selection of adhesive material is very important. Generally, a thermoplastic resin is mixed with a thermosetting resin. The thermoplastic resin plays a role of fast bonding, and the thermosetting resin plays a role of permanent bonding and...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B05D7/04C08J5/18C09D163/00
Inventor 刘萍
Owner SHENZHEN DANBOND TECH
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