Method for magnetron sputtering preparation of (HAú½Zro#-[2]ú½Y#-[2]O#-[3])/Ti#-[6]Al#-[4]V bio-based composites endosteal implant
A technology of magnetron sputtering and composite materials, applied in sputtering plating, metal material coating process, ion implantation plating, etc., can solve problems such as lesions, restriction of bone tissue repair and reconstruction, and low purity of coating HA , to achieve the effect of low cost
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Embodiment 1
[0022] (1) Magnetron sputtering HA target preparation
[0023] Submicron HA+ZrO with a purity of 99.5% was prepared by sol-gel method 2 +Y 2 o 3 Composite powder, adding polyvinyl alcohol solution accounting for 5% by weight and 8% concentration to HA composite powder for granulation, and dry pressing under 110MPa pressure to form a green sheet, and then heat preservation at a temperature of 900°C 3 hours for debinding and firing. Thus, a magnetron sputtering HA composite target with a size of Φ10mm*2mm is obtained.
[0024] (2) Ti6Al4V substrate surface activation treatment
[0025] Use 360 for Ti6Al4V substrate # SiO 2 Grinding with sandpaper, sandblasting with 40-mesh corundum sand, ultrasonic cleaning in acetone and absolute ethanol solution for 10 minutes, rinsing with deionized water, drying the Ti6Al4V substrate and placing it in a desiccator for later use.
[0026] (3) Magnetron sputtering process
[0027] Put the HA composite target and the Ti6Al4V substrate...
Embodiment 2
[0029] (1) Magnetron sputtering HA target preparation
[0030] Submicron HA+ZrO with a purity of 99.5% was prepared by sol-gel method 2 +Y 2 o 3 Composite powder, adding 7% by weight polyvinyl alcohol solution with a concentration of 9% to the HA composite powder for granulation, and dry pressing under a pressure of 130MPa to form a green sheet, and then heat preservation at a temperature of 1000°C 2 hours for debinding and firing. Thus, a magnetron sputtering HA composite target with a size of Φ40mm*2mm is obtained.
[0031] (2) Ti6Al4V substrate surface activation treatment
[0032] Use 360 for Ti6Al4V substrate # SiO 2 Grinding with sandpaper, sandblasting with 40-mesh corundum sand, ultrasonic cleaning in acetone and absolute ethanol solution for 10 minutes, rinsing with deionized water, drying the Ti6Al4V substrate and placing it in a desiccator for later use.
[0033] (3) Magnetron sputtering process
[0034] Put the HA composite target and the Ti6Al4V substrat...
Embodiment 3
[0036] (1) Magnetron sputtering HA target preparation
[0037] Submicron HA+ZrO with a purity of 99.5% was prepared by sol-gel method 2 +Y 2 o 3 Composite powder, adding 9% by weight polyvinyl alcohol solution with a concentration of 11% to the HA composite powder for granulation, and dry-pressing it into a green sheet under a pressure of 140MPa, and then keeping it warm at a temperature of 1150°C 1 hour for debinding and firing. Thus, a magnetron sputtering HA composite target with a size of Φ60mm*3mm is obtained.
[0038] (2) Ti6Al4V substrate surface activation treatment
[0039] Use 360 for Ti6Al4V substrate# SiO 2 Grinding with sandpaper, sandblasting with 40-mesh corundum sand, ultrasonic cleaning in acetone and absolute ethanol solution for 10 minutes, rinsing with deionized water, drying the Ti6Al4V substrate and placing it in a desiccator for later use.
[0040] (3) Magnetron sputtering process
[0041] Put the HA composite target and the Ti6Al4V substrate in...
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