Method for processing micro slot array on borosilicate glass surface

A borosilicate glass and surface processing technology, which is applied in the field of processing microgroove arrays on the surface of borosilicate glass, can solve the problems of practical difficulty, high cost, time-consuming and laborious, etc., achieve low cost, improve the ability of erosion, and reduce undercutting volume effect
CN1699234AInactive Publication Date: 2005-11-23SHANGHAI JIAO TONG UNIV

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
SHANGHAI JIAO TONG UNIV
Publication Date
2005-11-23
Estimated Expiration
Not applicable · inactive patent
Patent Text Reader

Abstract

The invention provides a method for processing micro slot array on borosilicate glass surface which comprises sputtering Chromium copper seed layer onto the surface of cleaned boron-silicon glass sheets, forming mask window of processed glass deep groove array through photo-etching, placing the boron-silicon glass sheets into Chromium copper seed layer in the etching solution removing window, striping the analytical pure acetone through ultrasound, employing a plating method for electroplating copper masks, then plating gold masks onto the copper masks, etching continuously so as to obtain micro-trench array with smooth bottoms on the surface of the boron-silicon glass.
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Description

technical field

[0001] The invention relates to a preparation method in the technical field of micro-electromechanical manufacturing, in particular to a method for processing microgroove arrays on the surface of borosilicate glass. Background technique

[0002] At present, research on microfluidic devices is in the ascendant, and microchannel structures prepared on substrate materials such as silicon wafers and glass are widely used in fields such as biochips and microchemical reaction chambers. Especially in the field of chip cooling, flow heat transfer in microchannels is an important topic in the current heat transfer field. Studies have shown that microchannel heat sinks with micron-sized grooves or pipe structures have extremely strong cooling capabilities, and their thermal resistance is 1 / 50 to 1 / 200 of that of passive heat sinks. It can play a major role in future chip packaging and device cooling. Among them, the manufacturing process of the water guide plate is t...

Claims

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