Method for processing micro slot array on borosilicate glass surface

Abstract

The invention provides a method for processing micro slot array on borosilicate glass surface which comprises sputtering Chromium copper seed layer onto the surface of cleaned boron-silicon glass sheets, forming mask window of processed glass deep groove array through photo-etching, placing the boron-silicon glass sheets into Chromium copper seed layer in the etching solution removing window, striping the analytical pure acetone through ultrasound, employing a plating method for electroplating copper masks, then plating gold masks onto the copper masks, etching continuously so as to obtain micro-trench array with smooth bottoms on the surface of the boron-silicon glass.

Description

technical field [0001] The invention relates to a preparation method in the technical field of micro-electromechanical manufacturing, in particular to a method for processing microgroove arrays on the surface of borosilicate glass. Background technique [0002] At present, research on microfluidic devices is in the ascendant, and microchannel structures prepared on substrate materials such as silicon wafers and glass are widely used in fields such as biochips and microchemical reaction chambers. Especially in the field of chip cooling, flow heat transfer in microchannels is an important topic in the current heat transfer field. Studies have shown that microchannel heat sinks with micron-sized grooves or pipe structures have extremely strong cooling capabilities, and their thermal resistance is 1 / 50 to 1 / 200 of that of passive heat sinks. It can play a major role in future chip packaging and device cooling. Among them, the manufacturing process of the water guide plate is t...

AI Technical Summary

Problems solved by technology

Although this method can process deep grooves on the glass and avoid defects such as pinholes on the glass surface, the above method is costly and time-consuming

Because the glass microgroove can only be further processed after opening a window on the silicon mask, and this process takes eight hours. After the processing is completed, it takes another eight hours to remove the silicon mask. The treatment of the membrane takes about sixteen to twenty hours, which takes too much time

Moreover, the single crystal silicon wafer used as a mask also greatly increases the cost of the above method, and there are still great difficulties in practical application.