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Resin composition for encapsulating semiconductor chip and semiconductor device therewith

A resin composition and semiconductor technology, applied in the direction of semiconductor devices, semiconductor/solid device parts, electric solid devices, etc., can solve the problems that cannot meet the crack resistance, high fluidity and fire resistance at the same time, and achieve curing Sex, the effect of good fluidity

Active Publication Date: 2006-04-19
SUMITOMO BAKELITE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, none of these methods can simultaneously satisfy all the requirements of crack resistance, high flow and fire resistance

Method used

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  • Resin composition for encapsulating semiconductor chip and semiconductor device therewith
  • Resin composition for encapsulating semiconductor chip and semiconductor device therewith
  • Resin composition for encapsulating semiconductor chip and semiconductor device therewith

Examples

Experimental program
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Effect test

preparation example Construction

[0084] figure 1 The semiconductor device can be manufactured by casting and curing the above-mentioned epoxy resin composition as the encapsulation resin 5 by suitable methods such as transfer molding, compression molding, and injection molding, and then encapsulating the semiconductor chip 1 .

[0085] because figure 1 The illustrated semiconductor device is encapsulated by an encapsulating resin composition comprising a compound (F) comprising two or more hydroxyl groups bonded to each adjacent carbon atom on an aromatic ring, thereby Appropriate viscosity and flow characteristics of the encapsulating resin composition can be obtained. Therefore, a semiconductor device having good moldability can be stably provided.

[0086] Use the epoxy resin composition that comprises the epoxy resin of general formula (1) and the phenolic resin of general formula (2) to package semiconductor chip, then can provide the semiconductor with better flame retardancy and soldering resistance ...

Embodiment 1

[0089] Phenol biphenyl aralkyl type epoxy resin (Nippon Kayaku Co., Ltd., NC3000-P, epoxy equivalent: 274, "n" in general formula (1) is 2.8 on average, softening point: 58°C) : 7.35 parts by weight;

[0090] Phenol biphenyl aralkyl resin (Meiwa Kasei Co., Ltd., MEH-7851SS, hydroxyl equivalent: 203, "n" in general formula (2) is 2.5 on average, softening point: 65°C): 5.5 parts by weight ;

[0091] Spherical fused silica (average particle size: 30 μm): 86.0 parts by weight;

[0092] γ-glycidyl propyl-trimethoxysilane: 0.4 parts by weight;

[0093] Triphenylphosphine: 0.2 parts by weight;

[0094] 2,3-dihydroxynaphthalene (reagent grade): 0.05 parts by weight;

[0095] Carnauba wax: 0.2 parts by weight; and

[0096] Carbon black: 0.3 parts by weight

[0097] Mix in a mixer at room temperature, then melt and knead at 80° C. to 100° C. with a hot roller, cool, and then grind to obtain an epoxy resin composition. The obtained epoxy resin composition was measured as follows. ...

Embodiment 2-13 and comparative example 1-15

[0103] According to the mixing ratios shown in Tables 1 and 2, the epoxy resin composition was prepared and determined according to the method described in Example 1. The measurement results are shown in Tables 1 and 2.

[0104] Except the component among the embodiment 1, other components used are as follows:

[0105] Biphenyl type epoxy resin (Japan Epoxy Resin Inc., YX4000H, epoxy equivalent: 195, melting temperature: 105°C);

[0106] Phenol aralkyl resin (Mitsui Chemical Inc., XLC-LL, hydroxyl equivalent: 174, "n" in general formula (2) is 3.6 on average, softening point: 79° C.);

[0107] Cresol novolac epoxy resin (Nippon Kayaku Co., Ltd., EOCN 1020-55, epoxy equivalent: 198, softening point: 55°C);

[0108] Phenol phenolic resin (hydroxyl equivalent: 104, softening point: 80°C);

[0109] γ-Mercaptopropyltrimethoxysilane;

[0110] 1,8-diazabicyclo(5,4,0)undecene-7 (hereinafter referred to as "DBU");

[0111] A curing accelerator represented by general formula (7); ...

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Abstract

An epoxy resin composition for encapsulating a semiconductor chip, which has good flowability without deterioration in curability. Specifically, a resin composition is disclosed for encapsulating a semiconductor chip containing a phenol aralkyl type epoxy resin containing biphenylene structure(A), a phenol aralkyl type resin containing phenylene or biphenylene structure (B), an inorganic filler (C) and a curing accelerator (D) as main components, further containing a silane coupling agent (E) in 0.01 wt % to 1 wt % both inclusive of the total amount of the epoxy resin composition and a Compound (F) containing two hydroxyl groups combined with each of adjacent carbon atoms on a naphthalene ring in more than or equal to 0.01 wt % of the total amount of the epoxy resin composition.

Description

technical field [0001] The present invention relates to a resin composition for encapsulating semiconductor chips and a semiconductor device using the resin composition. Background technique [0002] Due to the well-balanced properties of epoxy resins in terms of productivity, cost, and reliability, epoxy resin compositions have been mainly used in packaging of semiconductor chips in recent years. As the size and thickness of semiconductor devices decrease, epoxy resin compositions for encapsulation with lower viscosity and higher strength are required. In addition, there is an increasing need to prepare a fire-resistant device that does not contain flame retardants such as Br compounds and antimony oxides in consideration of environmental factors. In view of this situation, the current research clearly tends to use less viscous resins and add more inorganic fillers to the epoxy resin composition. [0003] As a new trend, lead-free solders having a higher melting point tha...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/24H01L23/29
CPCH01L24/45H01L2924/00014H01L2924/10253H01L2224/45144H01L2224/73265H01L2224/32245H01L2224/48247H01L2224/45H01L2924/181
Inventor 梅野邦治上田茂久
Owner SUMITOMO BAKELITE CO LTD
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