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Structure of improving gallium nitride base high electronic mobility transistor property and producing method

A high electron mobility, gallium nitride-based technology, applied in the structure and manufacturing field of improving the performance of gallium nitride-based high electron mobility transistors, can solve the problem of channel current reduction, current collapse, and channel electron concentration reduction. minor issues

Inactive Publication Date: 2006-06-07
INST OF SEMICONDUCTORS - CHINESE ACAD OF SCI
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Problems solved by technology

At present, the most convincing reason for the formation of the current collapse effect of AlGaN / GaN HEMT devices is the virtual gate model, that is, under the radio frequency signal, the channel electrons are captured by the trap center on the surface of the AlGaN barrier layer, resulting in a decrease in the channel electron concentration. decrease, and the surface state captures electrons to form a virtual gate, modulating the channel current, further causing the channel current to decrease, forming a current collapse

Method used

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  • Structure of improving gallium nitride base high electronic mobility transistor property and producing method
  • Structure of improving gallium nitride base high electronic mobility transistor property and producing method
  • Structure of improving gallium nitride base high electronic mobility transistor property and producing method

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specific Embodiment

[0039] Specific examples (see Figure 3-Figure 6 ):

[0040] The structure of the invention for improving the performance of gallium nitride-based high electron mobility transistors includes:

[0041] A sapphire substrate or silicon carbide substrate or silicon substrate 10;

[0042] A high-resistance semi-insulating gallium nitride buffer layer 20, the high-resistance semi-insulation gallium nitride buffer layer 20 is fabricated on the substrate 10, and the growth temperature of the fabrication is about 1000°C, the high-resistance semi-insulation gallium nitride buffer layer 20, Its growth thickness is about 2-3.5μm (see image 3 );

[0043] A high-mobility gallium nitride channel layer 30, the high-mobility gallium nitride channel layer 30 is fabricated on the high-resistance semi-insulating gallium nitride buffer layer 20, the high-mobility gallium nitride channel layer 30, its The growth thickness is about 50-100nm (see Figure 4 );

[0044] A thin layer of aluminum ...

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Abstract

A structure is for increasing performance of transistors of GaN base high electronic movability includes: a sapphire substrate, a SiC2 substrate or a silicon substrate, a high resistance semi-insulation GaN buffer layer processed on the substrate, a high movability GaN channel layer processed on the buffer layer, a thin ALN plug-in layer processed on the channel layer to increase the integrated performance of the transistor materials of GaN base high electronic movability, a n-type doped or un-purpose doped ALGaN barrier layer processed on the thin ALN plug-in layer.

Description

technical field [0001] The invention belongs to the technical field of semiconductors, in particular to a structure and a manufacturing method for improving the performance of gallium nitride-based high electron mobility transistors (AlGaN / GaN HEMTs). Background technique [0002] The aluminum gallium nitride / gallium nitride (AlGaN / GaN) high electron mobility transistor structure formed by III-V gallium nitride (GaN) and its compound semiconductor materials is used in high-temperature, high-frequency, high-power, radiation-resistant microwave devices and circuits The field has a very important application prospect, mainly because the semiconductor materials that make up the AlGaN / GaN heterostructure have a large band gap, a high breakdown electric field, good chemical stability and strong radiation resistance, and also because GaN materials have high electron saturation drift velocity and peak drift velocity, more importantly because a two-dimensional electron gas with high ...

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Application Information

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IPC IPC(8): H01L29/778H01L21/335
Inventor 王翠梅王晓亮胡国新王军喜李建平曾一平李晋闽
Owner INST OF SEMICONDUCTORS - CHINESE ACAD OF SCI
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