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Electronic ceramic continuous sputtering coating equipment

A technology for sputtering coating and electronic ceramics, which is applied in the field of electronic ceramics continuous sputtering coating equipment, can solve the problems of poor bonding force, high production cost, low yield, etc., and achieves improved work efficiency, good consistency and tensile strength. The effect of strong strength and high temperature erosion resistance

Inactive Publication Date: 2006-07-19
ZHEJIANG UNIV
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Problems solved by technology

Due to the poor bonding force between the evaporated thin film and the ceramic substrate, and the thin film of the simple film system has poor corrosion resistance when soldered with high-temperature lead-free solder, the yield of the product is low, and the quality of the device is low. Poor reliability and stability; in addition, the production efficiency of single-furnace coating is low, the production cost is high, and it is easy to introduce the influence of human factors of operators, and the uniformity and consistency of the film are not ideal.

Method used

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  • Electronic ceramic continuous sputtering coating equipment
  • Electronic ceramic continuous sputtering coating equipment
  • Electronic ceramic continuous sputtering coating equipment

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Embodiment

[0020]A vertical continuous sputtering coating equipment for ceramic substrates, each workpiece frame 1 can be loaded with a ceramic substrate of one square meter, and the technology of the present invention is used to sputter-plate nickel-copper-silver film on both sides thereof, It takes about 5 minutes to plate one frame, and the annual output can be plated to 120,000 square meters. Sampling inspection of the film layer shows that the error of its uniformity is within 3%, the average tensile strength is greater than 5KPa, and no corrosion is found when soldering in a lead-free tin bath at 260 °C. However, the average tensile strength of the same kind of ceramic coating film evaporated by single-furnace vacuum evaporation is below 2KPa, the uniformity error is greater than 10%, and the proportion of scrapping due to erosion when welding in a tin bath at 260°C is more than 8%.

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Abstract

The electronic ceramic continual sputter plating device comprises: a vacuum extraction device; and a body with five near vacuum chambers mutual connected insulating valves as the pre-pump chamber, front transition chamber, sputtering chamber with metal sputtering targets on mutual disposition, back transition chamber and the decompression chamber. Wherein, arranging a fitting friction piece transfer device and a piece frame can be convened to five chambers and outside by the transfer device; arranging a feeding table, an out-feeding table and a back mechanism all and said transfer device connected to a continual loop transfer line. This invention has large yield with low cost, strong bonding force and resistance to high temperature and corrosion.

Description

technical field [0001] The invention relates to a special equipment for sputtering coating, in particular to a continuous sputtering coating equipment for electronic ceramics. Background technique [0002] In the manufacturing process of electronic ceramic devices such as piezoelectric ceramics, the two surfaces of the ceramic sheet must be plated with metal thin films in order to conduct polarization treatment and lead out electrodes. The prior art is to vapor-deposit copper and silver films on the surface of ceramic sheets by evaporation technology in a single-furnace vacuum coating machine. Due to the poor bonding force between the evaporated thin film and the ceramic substrate, and the thin film of simple film system has poor corrosion resistance when soldered with high-temperature lead-free solder, the yield of the product is low, and the quality of the device is low. Poor reliability and stability; in addition, the production efficiency of single-furnace coating is lo...

Claims

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Application Information

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IPC IPC(8): C23C14/34C23C14/56C23C14/54C23C14/35C23C14/04
Inventor 王德苗任高潮董树荣金浩顾为民
Owner ZHEJIANG UNIV
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