Method of forming inorganic orientation film, inorganic orientation film, substrate for electronic devices, liquid crystal panel, and electronic equipment

Abstract

In a method of forming an inorganic orientation film, a target is irradiated with ion beams supplied from an ion beam source to lead out sputter particles from the target, and then the sputter particles are made incident on a matrix to form the inorganic orientation film, wherein the film formation is carried out without replacing the whole of the target while carrying out a repair processing for supplementing or recovering a defect of the target. The target is formed from a plurality of separable members so that only a part of the separable members can be selected and replaced, and the repair processing is carried out by replacing a member within the plural separable members on which the defect is produced. According to this method, it is possible to manufacture an inorganic orientation film which is excellent in an orientation characteristic and also excellent in light resistance while effectively using the target. This saves resources and gives fewer burdens on an environment.

Description

technical field [0001] The present invention relates to a method for forming an inorganic alignment film, an inorganic alignment film, a substrate for an electronic device, a liquid crystal panel, and an electronic device. Background technique [0002] A known projection type display device projects an image on a screen. In this projection type display device, a liquid crystal panel is mainly used for image formation. [0003] Such a liquid crystal panel generally has an alignment film set so that a predetermined pretilt angle (pretilt) is found in order to align liquid crystal molecules in a certain direction. In order to manufacture these alignment films, a known method is a rubbing treatment method of rubbing a film made of a polymer compound such as polyimide formed on a substrate in one direction with a cloth such as rayon (rayou) ( For example, refer to Patent Document 1) [0004] However, a thin film made of a polymer compound such as polyimide suffers from photode...

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Problems solved by technology

If such impurities are contained in a large amount, it will have a great adverse effect on the characteristics of the alignment film.

Also, for example, in ion beam sputtering in which sputtered particles are extracted by irradiating an ion beam on a target, generally a concentrated ion beam is injected into the target, but even when such a concentrated ion beam is used (Concentrated high-energy particle beams), some of the ions (high-energy particles) will also collide with the target fixing parts, etc., causing the above-mentioned problems

In order to solve such a problem, it is considered to use a target that is sufficiently large (for example, a diameter of 20 cm or more), and in this case, it is difficult to efficiently use the target for film formation

That is, in ion beam sputtering, although a part of ions are diffusely injected into areas other than the target area, since most of the ions are injected into a predetermined area (target area) of the target, the target used for film formation is It is consumed near the central part, and most of it near the peripheral part cannot be used for film formation

Since the targets used in the formation of the alignment film are generally expensive, it is not optimal from the viewpoint of energy saving and production cost that the targets cannot be effectively used as described above.

[0006] In addition, if the life of the target (the amount available for film formation is small) is short, the operator will increase the frequency of replacing the target in the chamber of the device. Causes of Productivity Decrease in Alignment Film

In addition, when such a target is replaced, there is a high possibility of foreign matter entering the chamber, which is also undesirable from the viewpoint of improving the quality of the formed alignment film.

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