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Microchannel-group integrated heat-pipe radiator

A heat pipe radiator and micro-groove technology, applied in indirect heat exchangers, instruments, heat exchange equipment, etc., can solve the problems of narrow irregular space, heat pipe radiator structure and complex processing procedures, etc., to increase the contact area of ​​phase change , simple manufacturing process, high overall strength and rigidity

Inactive Publication Date: 2006-10-25
杨洪武
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] The first purpose of the present invention is to solve the problem of complex structure and processing procedure of the existing heat pipe radiator, and propose a heat pipe radiator with micro-groove clusters, which has good performance of absorbing liquid working medium, and has good transmission efficiency. Thermal conductivity
[0009] The second purpose of the present invention is to solve the problem of complex structure and processing procedure of the existing heat pipe radiator, and propose a heat pipe radiator integrated with microgrooves, which can simplify the processing procedure and the structure of the heat pipe radiator, thereby improving production efficiency. reduce manufacturing cost
[0010] The third object of the present invention is to solve the problem that the structure and processing procedure of the existing heat pipe radiator are complex, and propose a heat pipe radiator with micro-groove clusters, which can be made into various shapes to meet the requirements of the narrow and irregular space of the notebook. Require

Method used

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  • Microchannel-group integrated heat-pipe radiator
  • Microchannel-group integrated heat-pipe radiator
  • Microchannel-group integrated heat-pipe radiator

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0047] Such as image 3 As shown, it is a schematic structural diagram of Embodiment 1 of the micro-slot group integrated heat pipe radiator of the present invention. The heat pipe radiator of this embodiment includes a closed shell 1, a core 3, and a liquid working fluid (not shown). The body of the closed shell 1 is completely sealed, and its internal cavity is evacuated and filled A certain amount of liquid working fluid; the core 3 is a whole formed by tightly stacking metal sheets 2, and during installation, the outer surface of the core 3 and the internal cavity of the closed casing 1 are connected by brazing. The metal sheet 2 is provided with through holes 4 for the vaporized liquid working fluid to circulate between adjacent gaps of the metal sheet, and the core 3 forms a through hole at the position of the through hole 4. The outer surface of the closed casing 1 is welded with radiating fins 5 perpendicular to the metal sheet 2, and a passage for cold air circulation is ...

Embodiment 2

[0055] Such as Picture 12 As shown, it is a schematic structural diagram of Embodiment 2 of the micro-slot group integrated heat pipe radiator of the present invention. The previous embodiment is a flat fin type flat radiator, this embodiment is a radiator with cold fluid channels. in Picture 12 In the middle part of the closed shell is a cylindrical cold fluid channel 9 with a rectangular cross section. A plurality of radiating fins 5 are provided in the cold fluid channel 9 and on the outer surface of the closed shell. These fins 5 are perpendicular to the metal The sheet 2 is welded in the cold fluid channel 9 and on the outer surface of the closed casing. In the working process, these radiating fins can quickly dissipate the heat from the heat pipe radiator under the action of cold air.

[0056] Such as Figure 13 As shown, it is a schematic cross-sectional view of the metal sheet welded to the inner cavity of the closed casing. The metal sheet 2 is a hollow rectangle. The g...

Embodiment 3

[0059] Such as Figure 15 Shown is a schematic structural diagram of Embodiment 3 of the micro-groove group integrated heat pipe radiator of the present invention. The difference between this embodiment and Embodiment 1 is that the cross section is different. This embodiment uses a flat heat pipe with a trapezoidal section. The length of the heat-absorbing bottom plate 10 is less than the length of the upper edge, and can be placed on a smaller electronic device, so that it can dissipate heat for the smaller electronic device and has good heat dissipation performance. In order to accelerate the heat dissipation, heat dissipation fins perpendicular to the metal sheet 2 can also be provided on the surface of the closed casing 1. In addition, the core 3 of the present embodiment is a disc-shaped flat plate heat pipe of equal height to height formed by winding a strip.

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PUM

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Abstract

This invention relates to a micro-slot group integrated heat-pipe radiator including a closes shell made of metal thin plates, in which, the inside cavity of the shell is vacuum filled with working fluid, a core piled up closely by multiple metal thin plates are set in the closed shell, the outer surface of the core is welded to the internal surface of the shell, gaps generating capillary force to adsorb the working fluid is set between the metal thin plates, the surface of the plate is opened with through holes, multiple piled up through holes form through holes on said core to drive the boiled fluid to flow among the slots adjacent to said metal thin plates.

Description

Technical field [0001] The invention relates to a micro-groove group integrated heat pipe radiator, in particular to a micro-groove group which is provided with closely overlapping metal sheets in the inner cavity of a shell to generate capillary force to adsorb liquid working fluid and at the same time provide internal support for the heat pipe radiator Integrated heat pipe radiator. Background technique [0002] With the rapid development of microelectronics technology, the integration of integrated circuits is greatly improved, and the heat dissipation of electronic components has become a technical bottleneck restricting the miniaturization, operating speed and output power of electronic equipment. [0003] Take the computer CPU chip as an example, its integration has increased by nearly 20,000 times in 30 years, and the heat flow it generates has reached 100W / cm 2 Degree. As we all know, the reliability and life of a computer is closely related to its operating temperature. ...

Claims

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Application Information

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IPC IPC(8): H01L23/427G06F1/20H01L23/34H05K7/20
CPCF28D15/0233F28F3/02H01L23/3672H01L23/427H01L2924/0002
Inventor 杨洪武
Owner 杨洪武