Laminate for printed circuit board and method of manufacturing the same
A technology of printed circuit boards and laminates, which is applied in the fields of printed circuit manufacturing, printed circuits, printed circuits, etc., and can solve problems such as difficult application of semiconductor packaging substrates and insufficient rigidity
Inactive Publication Date: 2006-11-15
SAMSUNG ELECTRO MECHANICS CO LTD
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- Abstract
- Description
- Claims
- Application Information
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Problems solved by technology
[0013] However, when the liquid crystal polymers with the above excellent properties are used alone, the stiffness appears to be insufficient
Therefore, this polymer can only be used limitedly in flexible and rigid & flexible PCBs, and is difficult to apply to semiconductor packaging substrates
Method used
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Embodiment 1
[0085] 10 parts by weight of a liquid crystal polyester resin having a liquid crystal melting point of about 300° C. was dissolved in 100 parts by weight of N-methylpyrrolidone as a solvent to prepare a liquid crystal polyester solution. A nonwoven fabric (VECRUS from Kuraray) formed of liquid crystal polyester fibers having an average thickness of about 10 μm, a dielectric constant of 2.8 was introduced into the prepared solution at room temperature for about 8 minutes. and a liquid crystal melting point of about 330°C. The integrated non-woven fabric was predried at about 100°C for about 1 hour under a nitrogen atmosphere, heated and pressed with copper foil at about 250°C for about 2 hours, heat-treated and thoroughly dried to produce the CCL of the present invention. The dielectric constant, dissipation factor, thermal expansion coefficient, and water absorption of the fabricated CCL were measured. The results are shown in Table 2 below.
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Abstract
The present invention relates to a laminate for a printed circuit board, which is manufactured by incorporating woven fabric or nonwoven fabric formed of liquid crystal polyester fibers into a liquid crystal polyester resin, thus having a low dielectric constant and a low dissipation factor, suitable for use in the high frequency range (GHz or more), and exhibiting excellent thermal properties and high reliability, resulting in high processability.
Description
technical field [0001] In general, the present invention relates to a laminate for printed circuit board (PCB) and a manufacturing method thereof, and more particularly, to a laminate for PCB by introducing a woven or non-woven fabric formed of liquid crystal polyester fibers into It is manufactured in liquid crystal polyester resin, so that the laminate has low dielectric constant and low dielectric dissipation factor, even in the high frequency range, and exhibits excellent thermal performance, and the present invention also relates to the laminate for PCB manufacturing method. Background technique [0002] Generally, prepregs and copper clad laminates (CCLs) for packaging substrates are mainly manufactured using BT (bismaleimide triazine) resins and epoxy resins (eg high Tg FR-4). [0003] In addition, B-staged prepregs were prepared by mixing BT or epoxy resin (eg, varnish) with glass cloth. The prepared prepreg was laminated with copper foil in multiple layers, heated...
Claims
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IPC IPC(8): H05K1/03B32B5/00H05K1/00H05K3/00
CPCB32B5/022B32B5/024B32B5/26B32B15/08B32B15/14B32B15/20B32B27/02B32B27/20B32B27/36B32B37/0038B32B38/0004B32B2250/20B32B2262/0276B32B2264/104B32B2264/105B32B2264/108B32B2305/20B32B2305/55B32B2307/204B32B2307/306B32B2307/546B32B2307/734B32B2309/02B32B2309/04B32B2311/12B32B2457/08H05K1/0366H05K1/0373H05K2201/0141H05K2201/0209H05K2201/0278Y10T428/24322H05K1/03
Inventor 申畯植崔哲豪孙暻镇尹今姬李尚烨
Owner SAMSUNG ELECTRO MECHANICS CO LTD