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Aqueous adhesive composition

An adhesive and composition technology, applied in the direction of adhesives, etc., can solve the problems of insufficient adhesive force, difficult degreasing treatment, etc., and achieve excellent water-resistant adhesive force and prevent environmental problems.

Inactive Publication Date: 2007-03-14
株式会社大鹿
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, according to the above-mentioned water-based polymer-isocyanate adhesive composition, when adhering plywood made of wood such as birch wood with more resin content than lauan wood, there is a problem that sufficient adhesive force cannot be obtained.
In addition, when using pine systems such as larch, Larix dahurica, and red pine with a high resin content for structural plywood, degreasing treatment is required, but it is difficult to perform sufficient degreasing treatment, which may cause Unfavorable situation where sufficient adhesive force cannot be obtained

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0047] In this example, first mix 100 parts by weight of a 15% polyvinyl alcohol aqueous solution (manufactured by Kuraray, trade name: PVA217), 60 parts by weight of calcium carbonate (manufactured by Toyo Fine Chemiacl co., Ltd, trade name name: Whiton P-30), 0.5 parts by weight of sodium hexametaphosphate, and 100 parts by weight of styrene-butadiene copolymer latex (manufactured by Asahi Kasei Industries, Ltd., trade name: DL-612) to prepare the main ingredient.

[0048] Then, 5 parts by weight of triethylene glycol dimethyl ether (compound A, boiling point 216° C.) was mixed as the compound having the structure represented by the general formula (1) with respect to 100 parts by weight of the main ingredient.

[0049] Then, as a curing agent isocyanate compound, a mixture of 15 parts by weight of polymethylene polyphenyl polyisocyanate and 4,4'-diphenylmethane diisocyanate (manufactured by Sumika Bayer Urethane, trade name: Sumijule 44V) was added in advance. Warm to 20°C,...

Embodiment 2

[0055] In this example, dipropylene glycol dimethyl ether (compound B, boiling point 171° C.) was used as the compound having the structure represented by the general formula (1) instead of triethylene glycol dimethyl ether used in Example 1 , except that the water-based adhesive composition was prepared in exactly the same manner as in Example 1, and it was made into a paste.

[0056] Then, in exactly the same manner as in Example 1, the adhesive performance of the water-based adhesive composition obtained in this example was tested. The test results are shown in Table 1.

Embodiment 3

[0058] In this example, as the compound having the structure represented by the general formula (1), diethylene glycol dimethyl ether (compound C, boiling point 162° C.) was used instead of triethylene glycol dimethyl ether used in Example 1. Except for methyl ether, a water-based adhesive composition was prepared in the same manner as in Example 1, and a paste was prepared.

[0059] Then, in exactly the same manner as in Example 1, the adhesive performance of the water-based adhesive composition obtained in this example was tested. The test results are shown in Table 1.

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Abstract

The invention provides a water-based adhesive composition affording high adhesive force in bonding resinous wood and also affording high water resistance, heat resistance and durability. The water-based adhesive composition comprises a main ingredient consisting of one or more components among a water-soluble polymer aqueous solution, an aqueous latex and an aqueous emulsion, a curing agent consisting of an isocyanate compound and a compound having a structure of the general formula(1): R<1>-(CH<2>-CH(R<2>)-O)-R<3>, wherein, R<1>is methoxy, ethoxy, butoxy, phenoxy or 2-ethylhexyloxy; R<2>is H or methyl; R<3>is H, acetyl or a 1-4C alkyl; and n is an integer of 1-4. In this adhesive composition, the compound represented by the general formula(1) is contained at 0.5 to 15 pt(s).wt. based on 100 pts.wt. of the main ingredient. This compound of the general formula(1) has a boiling point of preferably 160 to 310 DEG C, more preferably 240 to 310 DEG C.

Description

technical field [0001] The present invention relates to an aqueous adhesive composition used for gluing wood, and more specifically, to an aqueous adhesive composition used for gluing plywood with many resin components. In addition, in this specification, a "resin" means natural resins, such as rosin contained in wood. Background technique [0002] At present, as a water-based adhesive composition for wood, it is known to use water-soluble polymer aqueous solution, water-based latex, water-based emulsion, etc. as the main agent, and mix the main agent with an isocyanate compound as a curing agent. Isocyanate adhesive composition. The above-mentioned water-based polymer-isocyanate adhesive composition is, for example, a composition obtained by mixing 4,4'-diphenylmethane diisocyanate and polymethylene polyphenyl polyisocyanate in the above-mentioned main ingredient in a specific ratio (for example, Refer to Japanese Patent Laid-Open Publication Heisei 10 No. 121021). In ad...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J9/00
Inventor 藤井一郎森永博泰尾崎章一原岛进
Owner 株式会社大鹿