Aqueous adhesive composition
An adhesive and composition technology, applied in the direction of adhesives, etc., can solve the problems of insufficient adhesive force, difficult degreasing treatment, etc., and achieve excellent water-resistant adhesive force and prevent environmental problems.
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Examples
Embodiment 1
[0047] In this example, first mix 100 parts by weight of a 15% polyvinyl alcohol aqueous solution (manufactured by Kuraray, trade name: PVA217), 60 parts by weight of calcium carbonate (manufactured by Toyo Fine Chemiacl co., Ltd, trade name name: Whiton P-30), 0.5 parts by weight of sodium hexametaphosphate, and 100 parts by weight of styrene-butadiene copolymer latex (manufactured by Asahi Kasei Industries, Ltd., trade name: DL-612) to prepare the main ingredient.
[0048] Then, 5 parts by weight of triethylene glycol dimethyl ether (compound A, boiling point 216° C.) was mixed as the compound having the structure represented by the general formula (1) with respect to 100 parts by weight of the main ingredient.
[0049] Then, as a curing agent isocyanate compound, a mixture of 15 parts by weight of polymethylene polyphenyl polyisocyanate and 4,4'-diphenylmethane diisocyanate (manufactured by Sumika Bayer Urethane, trade name: Sumijule 44V) was added in advance. Warm to 20°C,...
Embodiment 2
[0055] In this example, dipropylene glycol dimethyl ether (compound B, boiling point 171° C.) was used as the compound having the structure represented by the general formula (1) instead of triethylene glycol dimethyl ether used in Example 1 , except that the water-based adhesive composition was prepared in exactly the same manner as in Example 1, and it was made into a paste.
[0056] Then, in exactly the same manner as in Example 1, the adhesive performance of the water-based adhesive composition obtained in this example was tested. The test results are shown in Table 1.
Embodiment 3
[0058] In this example, as the compound having the structure represented by the general formula (1), diethylene glycol dimethyl ether (compound C, boiling point 162° C.) was used instead of triethylene glycol dimethyl ether used in Example 1. Except for methyl ether, a water-based adhesive composition was prepared in the same manner as in Example 1, and a paste was prepared.
[0059] Then, in exactly the same manner as in Example 1, the adhesive performance of the water-based adhesive composition obtained in this example was tested. The test results are shown in Table 1.
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