Heat sink

a heat sink and heat sink technology, applied in the field of heat sinks, can solve the problems of high cost of extrusion equipment, slow process, and compromise of extrusion toleran

Inactive Publication Date: 2004-10-07
WONG CHEE TIENG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, as the aspect ratio increases, the extrusion tolerance is compromised.
Also, extrusion equipment is expensive, the process slow, Further, in order that it can be made by an extrusion process, a heat sink must be made from aluminium, and other materials cannot be used.
One disadvantage of such an arrangem

Method used

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first embodiment

[0031] FIGS. 1 to 6 show the present invention. The heat sink comprises a base or substrate 1, being a block of metal such as aluminium or copper. Layers of the substrate 1 are peeled or shaved away successively in order to form heat dissipative fins 2. The fins 2 may be formed in a series of columns 3 and rows 5. The fins 2 of each column 3 may be formed simultaneously. The rows 5 of fins 2 are separated by a gap 6. Between the rows 5 of fins 2 a rib 8 is present. Between each rib 8 is a groove 10, which is formed as the fins 2 are cut from the substrate 1.

[0032] The fins 2 are arcuate. The arc of each fin 2 illustrated represents approximately {fraction (1 / 8)} of a circle. The arc profile depends on the design of the tool that forms the fins 2, and the thickness and height of the fins 2.

[0033] FIG. 2 shows how a heat sink is formed from substrate 1. Initially, the substrate 1 is a cuboid.

[0034] A cutting tool C of a stamping die tooling engages the substrate 1 to form the fin 2 fr...

third embodiment

[0042] FIG. 8 shows the invention wherein a single row 5" of fins 2" is formed.

[0043] FIG. 9 shows a fourth embodiment, which is small modification of the third embodiment. In the fourth embodiment the fins 2"' are formed across the full width of the substrate 1 rather than leaving a rib 8 at each side, as in the first, second and third embodiments.

[0044] FIG. 10 is a side elevational view of the heat sink of FIG. 9.

[0045] The pitch 18 of the fins 2 according to the embodiments of the present invention and the thickness and height of the fins 2 can be varied within a larger range than is possible using a conventional processes such as extrusion process.

[0046] Also, the process according to the embodiments produces heat sinks faster than the processes of producing an extrusion heat sink, folder type and bonded type heat sink according to the prior art and at lower cost.

[0047] Further, compared with the prior art extrusion process, the bottom surface 14 of the substrate 1 will be rela...

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Abstract

A heat sink is manufactured by forming a fin 2 for dissipating heat by separating a length of material from a substrate 1 while leaving the proximal end attached to the substrate 1. The fins are cut from the substrate by stamping process using the stamping single or progressive die tooling cutting the substrate 1 along dotted line 16. The heat sink is a unitary construction, with the fins 2 being integrally formed with the substrate 1.

Description

BACKGROUND TO THE INVENTION[0001] The present invention relates to heat sinks and to a method of forming the same. More particularly, but not exclusively, the present invention relates to an improved method of forming heat dissipating fins of a heat sink.[0002] Heat sinks are well known components used, for example, for dissipating heat from electronic circuitry, CPUs (computers) and microprocessors in order to cool the components to enable them to function consistently and properly. Heat sinks are often used in conjunction with printed circuit boards which are found in electronic equipment such as television sets and audio amplifiers. There are many types of conventional heat sinks.[0003] One of the most widely used heat sink is extruded heat sink. It is well know to manufacture the extruded heat sink by extruding aluminium, through a complex shaped die to produce a section. Extrusion limits, such as the fin height-to-gap and fin thickness, usually dictate the flexibility in design...

Claims

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Application Information

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IPC IPC(8): B23P15/26F28F3/02H01L21/48H01L23/367
CPCB23P15/26B23P2700/10F28F3/022H01L21/4878Y10T29/4935H01L2924/0002H01L23/3672Y10T29/4913H01L2924/00B21J5/068
Inventor WONG, CHEE TIENG
Owner WONG CHEE TIENG
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