Heat sink

a heat sink and heat sink technology, applied in the field of heat sinks, can solve the problems of high cost of extrusion equipment, slow process, and compromise of extrusion toleran
US20040194924A1Inactive Publication Date: 2004-10-07WONG CHEE TIENG
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Patent Information

Authority / Receiving Office
US · United States
Current Assignee / Owner
WONG CHEE TIENG
Publication Date
2004-10-07
Estimated Expiration
Not applicable · inactive patent

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Abstract

A heat sink is manufactured by forming a fin 2 for dissipating heat by separating a length of material from a substrate 1 while leaving the proximal end attached to the substrate 1. The fins are cut from the substrate by stamping process using the stamping single or progressive die tooling cutting the substrate 1 along dotted line 16. The heat sink is a unitary construction, with the fins 2 being integrally formed with the substrate 1.
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Description

BACKGROUND TO THE INVENTION

[0001] The present invention relates to heat sinks and to a method of forming the same. More particularly, but not exclusively, the present invention relates to an improved method of forming heat dissipating fins of a heat sink.

[0002] Heat sinks are well known components used, for example, for dissipating heat from electronic circuitry, CPUs (computers) and microprocessors in order to cool the components to enable them to function consistently and properly. Heat sinks are often used in conjunction with printed circuit boards which are found in electronic equipment such as television sets and audio amplifiers. There are many types of conventional heat sinks.

[0003] One of the most widely used heat sink is extruded heat sink. It is well know to manufacture the extruded heat sink by extruding aluminium, through a complex shaped die to produce a section. Extrusion limits, such as the fin height-to-gap and fin thickness, usually dictate the flexibility in design...

Claims

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