Abrasive tool and method of making the same

Abstract

An abrasive tool includes a substrate, a plurality of abrasive particle groups, and a bonding layer. The abrasive particle group consists of a plurality of abrasive particles grouped together. The abrasive particle groups are disposed in a regular pattern on the surface of the substrate and fixed on the surface by the bonding layer. To control the disposition of the abrasive particle groups, an abrasive particle template is used to form the required pattern. The size of the abrasive particle positioning holes on the template is used to adjust the number of particles in an abrasive particle group.

Description

BACKGROUND OF THE INVENTION

[0001] 1. Field of Invention

[0002] The invention relates to an abrasive tool and the method of making the same. In particular, the invention relates to a diamond abrasive tool and the method of making the same.

[0003] 2. Related Art

[0004] In the manufacturing process of deep sub-micro semiconductor devices, the planarization technique for the oxide layer and the metal layer on the surface of wafer becomes important along with the development in the wire miniaturization and the multiple metal connection technique. In order to have a dense circuit in a small area, the thickness and flatness in each layer of the wafer are strictly demanded.

[0005] The chemical mechanical polishing (CMP) technique employs slurry and polish pad, along with mechanical polishing, to planarize the oxide layer and the metal layer of a wafer. This method can remove limitations in the layout design, increase the pattern density, reduce the defect density, and promote the yield. In...

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