Abrasive tool and method of making the same

Abstract

An abrasive tool includes a substrate, a plurality of abrasive particle groups, and a bonding layer. The abrasive particle group consists of a plurality of abrasive particles grouped together. The abrasive particle groups are disposed in a regular pattern on the surface of the substrate and fixed on the surface by the bonding layer. To control the disposition of the abrasive particle groups, an abrasive particle template is used to form the required pattern. The size of the abrasive particle positioning holes on the template is used to adjust the number of particles in an abrasive particle group.

Description

BACKGROUND OF THE INVENTION [0001] 1. Field of Invention [0002] The invention relates to an abrasive tool and the method of making the same. In particular, the invention relates to a diamond abrasive tool and the method of making the same. [0003] 2. Related Art [0004] In the manufacturing process of deep sub-micro semiconductor devices, the planarization technique for the oxide layer and the metal layer on the surface of wafer becomes important along with the development in the wire miniaturization and the multiple metal connection technique. In order to have a dense circuit in a small area, the thickness and flatness in each layer of the wafer are strictly demanded. [0005] The chemical mechanical polishing (CMP) technique employs slurry and polish pad, along with mechanical polishing, to planarize the oxide layer and the metal layer of a wafer. This method can remove limitations in the layout design, increase the pattern density, reduce the defect density, and promote the yield. In...

AI Technical Summary

Benefits of technology

[0014] In particular, the abrasive positioning holes are designed to have an appropriate size so that a single hole can accommodate a plurality of abrasive particles to form an abrasive particle group. The abrasive positioning holes may have different patterns according to the abrasive tool that one wants to form. The abrasive po

Problems solved by technology

Moreover, the debris getting off from the wafer and the slurry will deposit on the surface of the polish pad.

The abrasive particles used in this type of abrasive tool are highly rigid and abrasive.

In a CMP process, however, the abrasive particles fixed on the surface of the abrasive tool often cannot be held tightly on the surface of the metal substrate.

Therefore, abrasive particles often get off from the abrasive tool.

These lost particles are likely to damage precision and expensive wafers.

In particular, since the abrasive particles are random disposed on the abrasive tool, their distribution may be non-uniform such that the abrasive particles are under different pressures.

This is why the abrasive particles may fall

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