Polymeric barrier removal polishing slurry

Abstract

The aqueous slurry is useful for chemical mechanical polishing semiconductor substrates having copper interconnects. The aqueous slurry includes by weight percent, 0.01 to 25 oxidizing agent, 0.1 to 50 abrasive particles, 0.001 to 3 polyvinyl pyrrolidone, 0.01 to 10 inhibitor for decreasing static etch of the copper interconnects, 0.001 to 5 phosphorus-containing compound for increasing removal rate of the copper interconnects, 0.001 to 10 complexing agent formed during polishing and balance water; and the aqueous slurry has a pH of at least 8.

Description

CROSS REFERENCE TO RELATED APPLICATION [0001] This application claims the benefit of U.S. Provisional Application Ser. No. 60 / 715,918 filed Sep. 8, 2005.BACKGROUND OF THE INVENTION [0002] As ultra-large-scale-integrated circuit (ULSI) technology migrates to smaller lines widths, there are new challenges for the integration of conventional chemical mechanical polishing (CMP) processes. In addition, the introduction of low-k and ultra-low k dielectric films requires the use of a gentler CMP processes due to the films' low mechanical strength and weak adhesion to adjacent layers. Furthermore, ever-tightening defectivity specifications have placed additional demands on polishing slurries for low k films. [0003] The integration of various low k films into USLIs can also require numerous extra steps and the incorporation of new technologies such as supercritical cleaning, dielectric and metal caps, conformal deposition of barriers and copper, chemical mechanical planarization with low dow...

AI Technical Summary

Benefits of technology

[0007] In another aspect of the invention, the invention includes an aqueous slurry useful for chemical mechanical polishing a semiconductor substrate having copper interconnects comprising by weight percent, 0.05 to 15 oxidizing agent, 0.1 to 40 silica abrasive particles, 0.002 to 2 polyvinyl pyrrolidone, 0.02 to 5 azole inhibitor for decreasing static etch of the copper interconnects, 0.01 to 3 phosphorus-containing compound for increasing removal rate of the copper interconnects, 0.01 to 5 organic acid complexing agent formed during polishing and balance water; and the aqueous slurry having a pH of 8 to 12.

Problems solved by technology

As ultra-large-scale-integrated circuit (ULSI) technology migrates to smaller lines widths, there are new challenges for the integration of conventional chemical mechanical polishing (CMP) processes.

In addition, the introduction of low-k and ultra-low k dielectric films requires the use of a gentler CMP processes due to the films' low mechanical strength and weak adhesion to adjacent layers.

Furthermore, ever-tightening defectivity specifications have placed additional demands on polishing slurries for low k films.

The complexities surrounding implementation of low k materials have introduced larger challenges for the barrier CMP process, which will necessitate the ability to control the complicated input variables and achieve a consistent high yield.

Unfortunately, these slurries have inadequate copper removal rate for some applications.