Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Tri-level dynamic element matcher allowing reduced reference loading and dac element reduction

a dynamic element and matching technology, applied in the field of three-level dacs, can solve the problems of mild roll-off of gain, phase distortion, and inability to achieve perfect reconstruction filter practicably, and achieve the effect of reducing power consumption

Active Publication Date: 2010-09-30
DIALOG SEMICONDUCTOR GMBH
View PDF13 Cites 43 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0038]A principal object of the present invention is to achieve methods and systems to achieve a multi-bit delta-sigma DAC having a reduced power consumption.
[0041]A further object of the present invention is to achieve a multi-bit delta-sigma DAC having a reduced peak reference current and a reduced reference loading.
[0042]A further object of the present invention is to reduce power consumption and voltage droop of a delta-sigma DAC.
[0043]Another object of the present invention is reduce circuit complexity required to implement a N-bit delta-sigma DAC.
[0044]Moreover an important objective of the invention is to achieve low distortion in spite of variations of circuit elements

Problems solved by technology

This would, in principle, reproduce a sampled signal precisely up to the Nyquist frequency, although a perfect reconstruction filter cannot be practically constructed as it has infinite phase delay; and there are errors due to quantization.
However, this filter means that there is an inherent effect of the zero-order hold on the effective frequency response of the DAC resulting in a mild roll-off of gain at the higher frequencies (often a 3.9224 dB loss at the Nyquist frequency) and depending on the filter, phase distortion.
However, mismatches (such as random manufacturing variations) between the unit elements used to build a multi-bit DAC can cause non-linearity in the DAC transfer function, which causes signal distortion when converting a distortion-free digital signal to an analog signal.
A further known issue with most switched capacitor DACs implementations is signal-dependent loading of the DAC reference voltages, which can lead to signal distortion.
One way to remove signal dependency is to always draw the maximum reference current, but this maximizes reference power, which is undesirable in low-power systems.
It is a challenge for the designers of DACs to reduce therefore the peak reference current significantly compared to prior art.
Adding a discharge phase in the clocking arrangement removes all traces of signal from the DAC capacitors before they are switched to the reference, This achieves signal independence but makes the clock generation more complicated and results in maximum reference loading for all digital input codes.
A well known problem with dependency of the reference charge on the DAC input code is that providing this charge requires a current to flow from or to the reference voltage source, and this current flow can modify the reference voltage through interaction with the reference sources output impedances (e.g. ohmic drop).
Any signal-dependent variation of the reference voltages with changing DAC input causes non-linearity of the DAC analog output versus digital input code transfer function, and subsequent distortion of any signals being converted to analog.
A further well-known serious problem with multi-bit S / C (and current steering) DACs is that the individual DAC unit elements, C1-CN, cannot be manufactured to be exactly equal, but will have unavoidable random variations from ideal (“mismatches”) due to manufacturing variations.
These mismatches can cause nonlinearity of the DAC transfer function and hence distortion of any digital signals being converted to analog.
It is a challenge for the designers of DACs to reduce therefore the peak reference current significantly compared to prior art.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Tri-level dynamic element matcher allowing reduced reference loading and dac element reduction
  • Tri-level dynamic element matcher allowing reduced reference loading and dac element reduction
  • Tri-level dynamic element matcher allowing reduced reference loading and dac element reduction

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0066]The preferred embodiments disclose methods and systems to implement rotation-based Dynamic Element Matcher (DEM) techniques suitable for multi-bit DAC implementations. Unlike the well-known data weighted averaging (DWA) rotation method, described by the references above in the prior art section) and the majority of other known noise-shaping DEM algorithms, the method invented is applicable to DACs constructed from 3-level DAC elements.

[0067]Without a suitable DEM algorithm, using 3-level DAC elements would be impractical in most cases.

[0068]A key advantage of using 3-level elements is that in switched capacitor (S / C) DAC implementations, using 3-level DAC elements allows reduction of the maximum charge that the reference voltages must provide on any clock cycle, i.e. reduced reference currents. Reducing the reference currents offers twin benefits of reducing both power dissipation in the reference voltage generation (important for low-power DACs) and also reference voltage dro...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

Systems and methods using the same to achieve a tri-level multi-bit delta-sigma DAC having reduced power consumption and voltage droop have been achieved. A new rotation-based first order noise-shaping Dynamic Element Matcher (DEM) technique for use with 3-level unit elements have been disclosed. Reduced reference loading has been achieved when the tri-level DEM scheme is applied to switched capacitor implementations in particular. Furthermore a differential switched-capacitor DAC implementation, which enables use of the DEM technique is disclosed. The invention allows reduced circuit complexity required to implement a N-bit DAC when constructed using 3-level unit elements.

Description

BACKGROUND OF THE INVENTION[0001](1) Field of the Invention[0002]This invention relates generally to digital-to-analog converters (DAC) and relates more specifically to three-level DACs applying dynamic element matching (DEM) techniques.[0003](2) Description of the Prior Art[0004]A digital-to analog converter (DAC) is a device for converting a digital (usually binary) code to an analog signal (current, voltage or electric charge). The DAC fundamentally converts finite-precision numbers (usually fixed-point binary numbers) into a continuously varying physical quantity, usually an analogue electrical voltage.[0005]In an ideal DAC, the numbers are output as a sequence of impulses, that are then filtered by a reconstruction filter. The DAC fundamentally converts finite-precision numbers (usually fixed-point binary numbers) into a continuously varying physical quantity, usually an analogue electrical voltage.[0006]In an ideal DAC, the numbers are output as a sequence of impulses, that ar...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(United States)
IPC IPC(8): H03M1/00H03M1/66
CPCH03M1/0665H03M3/502H03M1/806H03M1/08
Inventor MYLES, ANDREWTERRY, ANDREW
Owner DIALOG SEMICONDUCTOR GMBH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products