Silicon carbide cladding slab based laser cooling device
a laser cooling and silicon carbide technology, applied in the field of optical instruments, can solve the problems of increasing the complexity of the experiment system design, affecting the stability of operations, and inconvenient design and experiment, and achieves the effects of reducing the harm of thermal stress on the experiment device, high conductivity, and high efficiency cooling
Inactive Publication Date: 2012-09-20
SHANGHAI JIAO TONG UNIV
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Benefits of technology
[0011]Laser diode pump beams are introduced into the Nd:YVO4 active material from its side faces, and the heat generated during the experiment is rapidly transferred to the heat sinks through the silicon carbide slabs having a high conductivity and is quickly dissipated from the whole system by the fans, thus achieving a highly efficient cooling. As the experiment device is designed to be completely symmetrical, the system only generates a temperature gradient in a vertical direction perpendicular to the surfaces of the active material, and the heat is rapidly dissipated from the system along the vertical direction, thereby minimizing the harm of thermal stress to the experiment device and forming a basis for stably and efficiently producing high-energy laser beams.
Problems solved by technology
Although liquid cooling is effective, it is complex and inconvenient for design and experiment.
In design, paths of cooling liquid, airtightness and other aspects must be taken into account; during the experiment, such problems as requiring a bulky cooling liquid circulating device and appropriately arranging the liquid pipelines bring great inconvenience, and also increase the complexity of experiment system design and affect the stability of operations.
However, this method is relatively complex and inconvenient for design and experiment.
Method used
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[0014]Reference will now be made in detail to exemplary embodiments of the invention, which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers will be used throughout the drawings to refer to the same or like parts.
[0015]As shown in FIG. 1, the laser cooling device according to one embodiment of the present invention includes: a first silicon carbide slab 2, a second silicon carbide slab 3, a first heat sink 4, a second heat sink 5, a first fan 6 and a second fan 7, wherein the first and the second silicon carbide slabs 2 and 3 are diffusion bonded to both surfaces of a Nd:YVO4 active material 1 of a laser, respectively; the first and the second heat sinks 4 and 5 are respectively disposed on the outer sides of the first and the second silicon carbide slabs 2 and 3; the first fan 6 is facing the first heat sink 4 and the second fan 7 is facing the second heat sink 5.
[0016]The first silicon carbide slab 2, the first heat sink 4 and the first f...
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A silicon carbide cladding slab based laser cooling device is disclosed. The cooling device includes two silicon carbide slabs, two heat sinks and two fans. The first and the second silicon carbide slabs are respectively diffusion bonded to both sides of a Nd:YVO4 active material of a laser; the first and the second heat sinks are disposed on outer sides of the first and the second silicon carbide slabs, respectively; the first fan is facing the first heat sink and the second fan is facing the second heat sink. The present invention facilitates the operation and miniaturization of a high-energy Nd:YVO4 slab laser at room temperature and ensures a stable high-energy laser output of the slab laser, thus providing a solution for its commercialization.
Description
CROSS-REFERENCES TO RELATED APPLICATIONS[0001]This application claims the priority of Chinese patent application number 201110060968.X, filed on Mar. 15, 2011, the entire contents of which are incorporated herein by reference.FIELD OF THE INVENTION[0002]The present invention relates to a device used in the field of optical instrument and in particular, relates to a silicon carbide cladding slab based laser cooling device.BACKGROUND[0003]Nowadays, liquid cooling is commonly used as a cooling method for laser devices. Although liquid cooling is effective, it is complex and inconvenient for design and experiment. In design, paths of cooling liquid, airtightness and other aspects must be taken into account; during the experiment, such problems as requiring a bulky cooling liquid circulating device and appropriately arranging the liquid pipelines bring great inconvenience, and also increase the complexity of experiment system design and affect the stability of operations.[0004]A liquid c...
Claims
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CPCH01S3/042H01S3/1673H01S3/0612
Inventor XU, JIANQIUZHANG, RUIHUANG, JINZIWANG, CONG
Owner SHANGHAI JIAO TONG UNIV