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Curable polyorganosiloxane composition

a polyorganosiloxane and composition technology, applied in the direction of solid-state devices, semiconductor/solid-state device details, coatings, etc., can solve the problems of insufficient workability and marked dependence of the modulus of elasticity and achieve good reactivity, excellent cold resistance, and the effect of fluidity and heat resistance of the cured produ

Inactive Publication Date: 2013-03-14
MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present invention is about a curable polyorganosiloxane composition that can produce a cured product with excellent cold resistance. The composition includes an alkenyl group-containing polyorganosiloxane and a branched polyorganosiloxane. The alkenyl group-containing polyorganosiloxane has a curable group and a linear structure with a certain viscosity. The branched polyorganosiloxane has a certain weight ratio to the alkenyl group-containing polyorganosiloxane. The composition has good reactivity and can produce a cured product with excellent thermal and mechanical properties.

Problems solved by technology

However, a base polymer in which a phenyl group is introduced into the base polymer or an organopolysiloxane having a resinous structure has a relatively higher viscosity as compared with the polymerization degree thereof, whereby they are inferior in workability, in particular, a cured product of the base polymer containing a phenyl group with a large amount involves the problem that its modulus of elasticity is markedly dependent on the temperature.

Method used

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  • Curable polyorganosiloxane composition
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Examples

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examples

[0047]In the following, the present invention will be explained in more detail by referring to Examples and Comparative examples. In these examples, all parts mean parts by weight otherwise specifically mentioned, and the viscosity means a viscosity measured by a Brookfield type rotational viscometer at 23° C. according to JIS K6249. The present invention is not limited by these Examples.

[0048]The following mentioned polysiloxanes were used in Examples and Comparative examples. In the following, siloxane units are shown by the following symbols.

M unit: (CH3)3SiO1 / 2—

Mv unit: (CH3)2(CH2═CH)SiO1 / 2—

D unit: —(CH3)2SiO—

DH unit: —(CH3)HSiO—

Dv unit: —(CH3)(CH2═CH)SiO—

Q unit: SiO4 / 2 (tetra-functional)

A1-1: A linear polymethylvinylsiloxane in which the both ends of which are sealed by Mv unit, the intermediate unit being D unit, and having a viscosity at 23° C. of 1500 cP;

A1-2: A linear polymethylvinylsiloxane in which the both ends of which are sealed by Mv unit, the intermediate unit being ...

examples 1 to 6

, Comparative Examples 1 to 3

[0054]According to the following mentioned method, polyorganosiloxane compositions were prepared by using the starting materials shown in Table 1.

[0055]In an apparatus equipped with a stirrer, a heating device and a pressure-reducing device were charged A1 and 50% by weight of a toluene solution of A2 which had previously been adjusted the concentration, and after uniformly mixing, toluene was distilled off at 150° C. and 13 kPa {1 torr} to prepare a polysiloxane solution. This was transferred into an universal mixing and kneading machine, F was added thereto, and the mixture was kneaded at 100° C. for 3 hours under reduced pressure, then, cooled at 40° C. or lower, and C and D were mixed therewith. Next, B and E were added and kneaded for 10 minutes under reduced pressure, and defoaming was carried out to prepare a polyorganosiloxane composition.

TABLE 1Compar-Compar-Compar-ExampleExampleExampleExampleExampleExampleativeativeative123456example 1example 2...

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Abstract

This is to provide a curable polyorganosiloxane composition which gives a cured product excellent in cold resistance. This relates to a curable polyorganosiloxane composition which comprises (A) an alkenyl group-containing polyorganosiloxane comprising (A1) a linear polyorganosiloxane represented by the formula (1) (wherein Rs independently represent R1 or R2, and among Rs, at least two of which are R1s, R1s independently represent a C2-C6 alkenyl group, R2s independently represent a C1-C6 alkyl group, n is a number which makes a viscosity at 23° C. 10 to 10,000 cP), and (A2) a branched polyorganosiloxane comprising a SiO4 / 2 unit and a R′3SiO1 / 2 unit, and further optionally a R′2SiO unit and / or a R′SiO3 / 2 unit (wherein R′s each independently represent an unsubstituted or substituted, monovalent aliphatic group or alicyclic group), at least three R′s are alkenyl groups per one molecule, a weight ratio of (A2) based on (A1) is 1 to 5, a weight ratio of the SiO4 / 2 unit and the optionally existing R′SiO3 / 2 unit based on the total weight of (A1) and (A2) is 20 to 60% by weight; (B) a polyorganohydrogensiloxane having hydrogen atoms bonded to a silicon atom in a number of exceeding 2 in the molecule; and (C) a platinum group metal compound.

Description

TECHNICAL FIELD[0001]The present invention relates to a curable polyorganosiloxane composition which cures by an addition reaction.BACKGROUND ART[0002]A curable polyorganosiloxane composition which cures by an addition reaction has been known to provide a rubbery cured product excellent in heat resistance, weather resistance, electric insulation, and has been widely used in various fields. Among these, it has been attracted attention in the fields of automobile and semiconductor fields, and in these fields, extremely strict reliability has been required for the purpose of uses thereof, and as one of the requirements, there is required to have cold resistance which can endure the use at a cold district or low-temperature environment.[0003]It has been known to introduce a phenyl group into a base polymer to improve cold resistance (Patent Literature 1). It has also been known to formulate an organopolysiloxane having a resinous structure (Patent Literature 2).PRIOR ART LITERATURESPate...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): C08L83/07C09J183/07
CPCC08G77/12H01L23/295C08L83/04H01L23/296C09J183/04C08G77/20C08L2314/08C09D183/04C08G77/70C08L2205/025C08L2203/206B05D3/0254C08K5/56C08L83/00H01L2924/0002H01L2924/00C08G77/04H01L23/29
Inventor TAKANASHI, MASANORI
Owner MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC
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