Rectifier diode

Abstract

A rectifier diode includes a substrate defining an even number of through holes, one or a number of bare chip diodes placed on the top surface of the substrate with even number of conducting grooves thereof respectively kept in alignment with respective through holes of the substrate, and a conducting unit including a metal interface layer coated on exposed surfaces of each bare chip diode and the substrate using, a conductive metal thin film covered over the metal interface layer and defining an electroplating space within each through hole of the substrate and the corresponding conducting groove of one bare chip diode and a conducting medium coated in each electroplating space to form an electrode pin and a bond pad.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The present invention relates to rectifier diode technology and more particularly, to such a rectifier diode, which has one or multiple bare chip diodes be directly placed on a substrate and uses a metal interface layer and a conductive metal thin film and predetermined electrode pins and bond pads to secure the bare chip diodes and the substrate tightly together and to electrically couple the bare chip diodes to the circuit in the substrate, eliminating a further packaging process, simplifying the manufacturing process and reducing the manufacturing cost.[0003]2. Description of the Related Art[0004]With fast development of electronic technology, rectifier diodes are used intensively in different electronic devices to rectify electric current. Taiwan Patent No. 101281, Publication No. 3421841, filed on Sep. 30, 1997, discloses a semiconductor diode device and its fabrication method. According to this design, as shown in...

AI Technical Summary

Benefits of technology

The present invention provides a rectifier diode that eliminates the need for packaging, simplifying the manufacturing process and reducing costs. The diode includes a substrate with through holes and a bare chip diode positioned on the substrate to align with the through holes. A conducting unit is formed to secure the bare chip diode to the substrate and electrically couple it. The conducting unit includes a metal interface layer, a conductive metal thin film, and predetermined electrode pins and bond pads. The bare chip diode can be directly installed in the substrate and electrically coupled to the circuit of the substrate without any extra packaging processes, such as bump bonding, encapsulation, or underfill. This matches the height saving of low profile electronic products. The invention also uses a conducting medium to fill up electroplating spaces and form electrode pins and bond pads, reducing manufacturing costs and improving conducting effects. Additionally, a copper coating layer and conductive adhesive layer are used to form the desired electrode pins and bond pads, saving manufacturing costs and maintaining high levels of electrical conductivity.

Problems solved by technology

Further, the performance of the grinding step tends to result in a precision error, leading to a defective product.

Further, the wiring bonding and encapsulating procedures need to use different processing tools, increasing the equipment installation cost and the product fabrication cost.

This method has the drawback of high cost.

However, due to limited heat transfer area, waste heat cannot be quickly transferred to the carrier plate B3 for dissipation.

Further, the presence of the bumps B1 and the tin solder B2 greatly increase the height of the finished product, not suitable for low profile application.

If gold is used to make the bumps B1, the cost will be very high.

However, this added underfill process complicates the manufacturing process, extends the manufacturing time, and increases the manufacturing cost.

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