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Sputtering target for forming protective film and multilayer wiring film

a technology which is applied in the direction of superimposed coating process, transportation and packaging, vacuum evaporation coating, etc., can solve the problems of increased manufacturing cost of sputtering target and multi-layer wiring film, difficulty in using the above-described layered film as wiring film, and increase in waste liquid treatment costs. , to achieve the effect of reducing the number of sputtering target and wiring film, reducing the number o

Active Publication Date: 2016-07-14
MITSUBISHI MATERIALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present invention relates to a sputtering target for forming a protective film. The protective film formed using this target has superior weather resistance, can prevent surface discoloration, and has excellent etchability. Additionally, the sputtering target is made of a copper alloy that has excellent hot workability. A multilayer wiring film including this protective film is also provided.

Problems solved by technology

Since this residue may cause short-circuiting between wirings, it is difficult to use the above-described layered film as a wiring film.
In addition, in a case where the layered film contains Cr, waste liquid after etching contains Cr, and thus there is a problem in that costs are incurred to treat the waste liquid.
Further, since the layered film contains relatively expensive Ni in a large amount of 35 to 84.5 mass %, there is a problem in that the manufacturing costs of the sputtering target and the multilayer wiring film increase.

Method used

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  • Sputtering target for forming protective film and multilayer wiring film
  • Sputtering target for forming protective film and multilayer wiring film
  • Sputtering target for forming protective film and multilayer wiring film

Examples

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examples

[0068]Hereinafter, the results of an evaluation test will be described in which the effects of the sputtering target for forming a protective film and the multilayer wiring film according to the present invention were evaluated.

[0069]An ingot formed of oxygen-free copper having a purity of 99.99 mass % was prepared. By performing hot rolling, stress relief annealing, and machining on the ingot, a pure copper target for forming a Cu wiring film having an outer diameter of 100 mm and a thickness of 5 mm was prepared.

[0070]Next, a backing plate formed of oxygen-free copper was prepared. The above-described pure copper target for forming a Cu wiring film was layered on the backing plate formed of oxygen-free copper. The components were joined to each other through indium soldering at a temperature of 200° C. As a result, a target with the backing plate was prepared.

[0071]As raw materials to be melted, oxygen-free copper (purity: 99.99 mass % or higher), low-carbon nickel (purity: 99.9 m...

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Abstract

A sputtering target is provided for forming a protective film which is used for forming a protective film on a single surface or both surfaces of a Cu wiring film, the sputtering target including 5 to 15 mass % of Ni or Ni and Al in total (where the Ni content is 0.5 mass % or higher); 0.1 to 5.0 mass % of Mn; 0.5 to 7.0 mass % of Fe; and a balance including Cu and inevitable impurities

Description

TECHNICAL FIELD[0001]The present invention relates to a sputtering target for forming a protective film used for forming a protective film that protects a Cu wiring film formed of copper or a copper alloy; and a multilayer wiring film including a protective film that is formed using the sputtering target for forming a protective film.[0002]Priority is claimed on Japanese Patent Application No. 2013:-230301, filed Nov. 6, 2013, the content of which is incorporated herein by reference.BACKGROUND ART[0003]In the related art, aluminum (Al) widely used as a wiring film of a flat panel display such as a liquid crystal panel or an organic EL panel and as a wiring film of a touch panel or the like. Recently, the size (width) and thickness of a wiring film has been reduced, and there has been a demand for a wiring film having a lower specific resistance than that in the related art.[0004]Along with the above-described reduction in the size and thickness of a wiring film, a wiring film formed...

Claims

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Application Information

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IPC IPC(8): C23C14/34H01J37/34C22C9/00C22C9/06C22C9/01
CPCC23C14/3414C22C9/06H01J37/3426C22C9/00C22C9/01Y10T428/12903Y10T428/12882Y10T428/1291C22C9/05C23C14/14C23C14/00C23C14/34C23C14/165C23C14/16C23C14/3407C23C30/00C23C28/02C23C30/005C23C28/021C23C28/023
Inventor MORI, SATORUKOMIYAMA, SHOZO
Owner MITSUBISHI MATERIALS CORP
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